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Patent Agency Ranking
公开(公告)号：US20150091027A1
公开(公告)日：2015-04-02
申请号：US14499421
申请日：2014-09-29
Applicant: NICHIA CORPORATION
Inventor： Shinya OKURA , Shintaro NAKASHIMA , Hiroki FUKUTA
CPC classification number: H01L33/62 , H01L33/505 , H01L33/58 , H01L2224/48471 , H01L2224/48479 , H01L2924/00014 , H01L2224/4554
Abstract: A light emitting device of the invention includes a substrate; a light emitting element mounted on the upper surface of the substrate; a wire that is electrically connected to the light emitting element; and a plate-shaped light-transmissive member that covers the light emitting element. The wire has a stack structure in which a first bonding ball, a bonding wire, and a second bonding ball are stacked in that order, the stack structure is disposed on the upper surface of the light emitting element, and the plate-shaped light-transmissive member is disposed above the stack structure.
Abstract translation: 本发明的发光器件包括：衬底; 安装在所述基板的上表面上的发光元件; 电连接到发光元件的导线; 以及覆盖发光元件的板状透光性部件。 线材具有堆叠结构，其中第一接合球，接合线和第二接合球按顺序堆叠，堆叠结构设置在发光元件的上表面上， 透射构件设置在堆叠结构的上方。
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公开(公告)号：US20240395786A1
公开(公告)日：2024-11-28
申请号：US18788019
申请日：2024-07-29
Applicant: NICHIA CORPORATION
Inventor： Kenji OZEKI , Hiroki FUKUTA
IPC: H01L25/16 , H01L23/00 , H01L23/24 , H01L25/07 , H01L25/075 , H01L27/02 , H01L29/866 , H01L33/00 , H01L33/50 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62
Abstract: A light emitting device including a substrate having a substantially rectangular shape when viewed in plan view, light emitting elements arranged along a first long side of the substantially rectangular shape of the substrate, light transmissive members each disposed on an upper surface of each of the light emitting elements, and a cover member having a substantially rectangular shape when viewed in plan view. The cover member covering an upper surface of the substrate, and exposing upper surfaces of the light transmissive members. The device includes terminals exposed from the cover member. The terminals being arranged along a second long side of the substantially rectangular shape of the substrate, and being capable of individually driving the light emitting elements. When viewed in the plan view, a long side of the substantially rectangular shape of the cover member overlaps with at least one of the first and the second long sides.
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公开(公告)号：US20190385993A1
公开(公告)日：2019-12-19
申请号：US16558163
申请日：2019-09-02
Applicant: NICHIA CORPORATION
Inventor： Kenji OZEKI , Hiroki FUKUTA
Abstract: A light emitting device includes a substrate, light emitting elements, light transmissive members, an underfill, and a cover member. The light emitting elements are mounted on the substrate. The light transmissive members are each disposed on an upper surface of each of the light emitting elements. The underfill covers an upper surface of the substrate, lateral surfaces of the light emitting elements, and lateral surfaces of the light transmissive members between the light transmissive members. The cover member covers an upper surface of the underfill and has a hardness greater than a hardness of the underfill.
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公开(公告)号：US20190097086A1
公开(公告)日：2019-03-28
申请号：US16123274
申请日：2018-09-06
Applicant: NICHIA CORPORATION
Inventor： Satoshi SHICHIJO , Hiroki FUKUTA , Kunihito SUGIMOTO
IPC: H01L33/38 , H01L33/62 , H01L33/10 , H01L23/532
Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, and first and second external connection parts. The first semiconductor layer is exposed from the light emitting layer and the second semiconductor layer at exposed portions arranged in columns each extending in a first direction. The insulating film defines openings respectively located above the exposed portions. The first electrode is connected to the first semiconductor layer through the openings and covers a part of the second semiconductor layer via the insulating film. The first external connection part is connected to the first electrode and spaced apart from the exposed portions in the plan view. The first external connection part has a shape elongated in the first direction between adjacent ones of the columns of the exposed portions. The second external connection part is connected to the second semiconductor layer via the second electrode.
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公开(公告)号：US20170154880A1
公开(公告)日：2017-06-01
申请号：US15364267
申请日：2016-11-30
Applicant: NICHIA CORPORATION
Inventor： Kenji OZEKI , Hiroki FUKUTA
CPC classification number: H01L25/167 , H01L23/24 , H01L24/26 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/072 , H01L25/0753 , H01L27/0248 , H01L29/866 , H01L33/0095 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16227 , H01L2224/26155 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/92225 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/1304 , H01L2924/1426 , H01L2924/1811 , H01L2924/19105 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2224/81 , H01L2224/83
Abstract: A method of manufacturing a light emitting device includes: mounting light emitting elements on a collective substrate; arranging a first protruding member surrounding the light emitting elements; arranging a second protruding member between the light emitting elements; forming a cover member covering an upper end of the second protruding member, a lateral surface of each of the light emitting elements in a region surrounded by the first protruding member; and singulating the light emitting devices by cutting the cover member, the second protruding member, and the collective substrate at a portion including the second protruding member. The second protruding member is harder than the cover member. An upper end of the second protruding member is located lower than that of the first protruding member but higher than the upper surface of each of the light emitting elements.
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