公开(公告)号：US12027501B2

公开(公告)日：2024-07-02

申请号：US17219221

申请日：2021-03-31

Applicant: NICHIA CORPORATION

Inventor： Katsuyoshi Kadan ,  So Sakamaki ,  Masayuki Eguchi

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L2933/0066

Abstract: A method of manufacturing a surface light source includes providing an intermediate structure body that includes a composite board including a supporting member and a wiring layer disposed on the supporting member and includes a plurality of light-emitting elements disposed apart from each other on the wiring layer of the composite board, disposing a plurality of covering members apart from each other to cover upper surfaces and lateral surfaces of the light-emitting elements and portions of the composite board around the light-emitting elements, disposing a light-shielding member such that a gap between the covering members is filled, removing the covering members to form a plurality of hole portions, and disposing a light-transmissive member in the hole portions.

公开(公告)号：USRE49298E1

公开(公告)日：2022-11-15

申请号：US16376587

申请日：2019-04-05

Applicant: NICHIA CORPORATION

Inventor： Masahiko Sano ,  Takahiko Sakamoto ,  Keiji Emura ,  Katsuyoshi Kadan

IPC: H01L33/38 ,  H01L33/46 ,  H01L33/44 ,  H01L33/42 ,  H01L33/40

Abstract: The present invention provides a light emitting element capable or realizing at least one of lower resistance, higher output, higher power efficiency (1 m/W), higher mass productivity and lower cost of the element using a light transmissive electrode for an electrode arranged exterior to the light emitting structure. A semiconductor light emitting element includes a light emitting section, a first electrode and a second electrode on a semiconductor structure including first and second conductive type semiconductor layers, the first and the second electrodes respectively including at least two layers of a first layer of a light transmissive conductive film conducting to the first and the second conductive type semiconductor and a second layer arranged so as to conduct with the first layer. First and second light transmissive insulating films are respectively arranged so as to overlap at least one part of the first and the second layers.

公开(公告)号：US11362246B2

公开(公告)日：2022-06-14

申请号：US16796221

申请日：2020-02-20

Applicant: Nichia Corporation

Inventor： Kinya Ichikawa ,  Katsuyoshi Kadan ,  Masahiko Sano ,  Ryohei Hirose ,  Hiroshi Yoneda

IPC: H01L33/62 ,  H01L33/38 ,  H01L25/075

Abstract: A method of manufacturing a display device 1 includes: providing a substrate including sub-pixel defined therein and a first wiring disposed for the sub-pixel, and light-emitting element having a lower surface and a lateral surface and including a first electrode disposed on the lower surface, and a second electrode disposed on the lateral surface; mounting the light-emitting element and electrically connecting the first electrode to the first wiring; forming a resin member on the substrate and covering the light-emitting element; exposing an upper portion of the light-emitting element from an upper surface of the resin member such that the second electrode is partially exposed by removing an upper portion of the resin member; and forming a second wiring on the upper surface of the resin member excluding a portion of the light-emitting element exposed from the resin member and electrically connecting the second wiring to the second electrode.

公开(公告)号：US10797210B2

公开(公告)日：2020-10-06

申请号：US16183662

申请日：2018-11-07

Applicant: NICHIA CORPORATION

Inventor： Katsuyoshi Kadan ,  Hajime Washio

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62

Abstract: A light emitting device includes: first and second conductive members disposed on an upper surface of a substrate; and a light emitting element disposed above a portion of an upper surface of a first electrode layer and a portion of an upper surface of a second electrode layer, above the spacer region. The upper surface of the first electrode layer and the upper surface of the second electrode layer above spacer region are located lower than the upper surface of the first electrode layer above the first conductive member and the upper surface of the second electrode layer above the second conductive member, and a reflectance of the first conductive member and the second to light emitted from the light emitting element is higher than reflectance of the first electrode layer and the second electrode layer to light emitted from the light emitting element.

公开(公告)号：US20200266176A1

公开(公告)日：2020-08-20

申请号：US16796083

申请日：2020-02-20

Applicant: Nichia Corporation

Inventor： Kinya Ichikawa ,  Katsuyoshi Kadan ,  Masahiko Sano ,  Ryohei Hirose ,  Hiroshi Yoneda

IPC: H01L25/075 ,  H01L33/22 ,  H01L33/46 ,  H01L21/66 ,  H01L33/62

Abstract: A method of manufacturing a display device 1 includes: providing a substrate including at least one sub-pixel defined therein and a first wiring disposed for the sub-pixel, and the light-emitting element that includes a first electrode disposed on a lower surface and a second electrode disposed on at least two lateral surfaces intersecting with each other; mounting the light-emitting element on the substrate and electrically connecting the first electrode to the first wiring; forming a resin member covering the at least one light-emitting element, on the substrate, exposing a portion of the second electrode from an upper surface of the resin member by removing an upper portion of the resin member; and forming a second wiring with a mesh shape on the resin member such that a portion of the second wiring is disposed on the light-emitting element to electrically connect the second wiring to the second electrode.

公开(公告)号：US20200006296A1

公开(公告)日：2020-01-02

申请号：US16454906

申请日：2019-06-27

Applicant: NICHIA CORPORATION

Inventor： So Sakamaki ,  Yasunori Nagahama ,  Masahiko Sano ,  Katsuyoshi Kadan

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: A method of manufacturing a light emitting module including a substrate; a light emitting element having an electrode formation surface comprising a positive and negative pair of element electrodes, and a light emitting surface on the side opposite to the electrode formation surface; a wiring electrode connected to the element electrode; and a light reflective resin layer, the method of manufacturing a light emitting module including: placing the light emitting element, on a support member, in a state with the electrode formation surface facing upward, and the light emitting surface facing downward; forming a coating layer on the support member, surrounding the light emitting element; forming the wiring electrode extending from the element electrode over the coating layer; forming the light reflective resin layer on the wiring electrode and the coating layer; joining the substrate on top of the light reflective resin layer; removing the support member; and removing the coating layer.

公开(公告)号：US20140306265A1

公开(公告)日：2014-10-16

申请号：US14314516

申请日：2014-06-25

Applicant: NICHIA CORPORATION

Inventor： Junya NARITA ,  Takuya Okada ,  Yohei Wakai ,  Yoshiki Inoue ,  Naoya Sako ,  Katsuyoshi Kadan

IPC: H01L33/32

CPC classification number: H01L33/22 ,  H01L21/0242 ,  H01L21/0243 ,  H01L21/02458 ,  H01L21/0254 ,  H01L33/007 ,  H01L33/10 ,  H01L33/20 ,  H01L33/32 ,  Y10T428/24 ,  Y10T428/24479

Abstract: The sapphire substrate has a principal surface for growing a nitride semiconductor to form a nitride semiconductor light emitting device and comprising a plurality of projections of the principal surface, wherein an outer periphery of a bottom surface of each of the projections has at least one depression. This depression is in the horizontal direction. The plurality of projections are arranged so that a straight line passes through the inside of at least any one of projections when the straight line is drawn at any position in any direction in a plane including the bottom surfaces of the plurality of projections.

Abstract translation: 蓝宝石衬底具有用于生长氮化物半导体以形成氮化物半导体发光器件的主表面，并且包括主表面的多个突起，其中每个突起的底表面的外周具有至少一个凹陷。 这个凹陷在水平方向。 多个突起被布置成使得当直线在包括多个突起的底表面的平面的任何方向上的任何位置处被拉伸时，直线穿过至少任一个突起的内部。