Abstract:
A light emitting device includes a base structure, a wall, a light emitting element, a protection element, and a light reflective portion. The wall includes an inner peripheral surface defining an opening. The opening has a substantially polygonal shape in a planar view of the light emitting device. The light reflective portion has a maximum length which is longest in the light reflective portion. The maximum length is defined at a maximum-length position closest to the first corner among a plurality of positions defined in the light reflective portion. The light reflective portion has a minimum length which is shortest in the light reflective portion. The minimum length is defined at a minimum-length position arranged apart from the maximum-length position. The light reflective portion includes an inclined surface extending from the maximum-length position to the minimum-length position.
Abstract:
A light emitting device includes: a first substrate including: a first lead, and a second lead positioned apart from the first lead; a second substrate disposed on an upper face of the second lead, the second substrate including: a base, and a first conducting part disposed on an upper face of the base; a light emitting element disposed on the second substrate and electrically connected to the first conducting part; a first wire electrically connecting the first lead and the first conducting part; and a wall part straddling and covering an upper face of the first lead and an upper face of the second lead. A height of the wall part is less than a height of the second substrate.
Abstract:
A light-emitting module includes a first mounting board which has a first surface, a second surface opposite to the first surface, and a recess on the first surface. An opening passes through the first mounting board from a bottom surface of the recess to the second surface. A second mounting board has a mounting surface and a light-emitting element surface opposite to the mounting surface and is provided in the recess such that the light-emitting element surface faces the bottom surface of the recess. A light-emitting element is provided on the light-emitting element surface and configured to emit light through the opening. An elastic cushion is provided between the bottom surface and the light-emitting element surface. The second mounting board projects from the first surface of the first mounting board when a force pressing the second mounting board toward the bottom surface of the recess is not applied.
Abstract:
A light emitting device includes a package having a recess which includes a bottom surface. A first bottom surface of a first light emitting element is put on a first part of the bottom surface. A second bottom surface of a second light emitting element is put on the first part of the bottom surface. A first side surface of the first light emitting element is opposite to a second side surface of the second light emitting element with a gap. At least a part of the first side surface does not overlap with the second side surface viewed in a direction perpendicular to the first side surface. A protection element is provided at a second part of the bottom surface. A light reflective material covers the protection element.
Abstract:
A light emitting device is provided which includes a light emitting element, a phosphor, and a sealing member. The light emitting element has a light emission peak wavelength in the range not shorter than 400 nm and not longer than 460 nm. The phosphor can be excited by light from the light emitting element, and emit luminescent radiation with a light emission peak wavelength in the range in not shorter than 600 nm and not longer than 700 nm. The sealing member includes a pigment for absorbing a part of the light from the light emitting element. X of the light emission chromaticity of the light emitting device falls within the range of x≧0.600 in the chromaticity coordinates in the CIE 1931 color space chromaticity diagram.
Abstract:
The invention provides semiconductor light-emitting devices which have a semiconductor layer on a principal surface of a translucent substrate and a reflective layer on a second principal surface opposite to the principal surface having the semiconductor layer, which enables that the peeling of the reflective layer from the translucent substrate is suppressed. A semiconductor light-emitting device includes a first metal layer disposed in contact with a second principal surface of a translucent substrate, a second metal layer disposed in contact with at least the second principal surface or a side surface of the translucent substrate around the first metal layer, and a third metal layer disposed on the second metal layer. The first metal layer has a reflectance with respect to a peak wavelength of light emitted from an emitting layer higher than the reflectance of the second metal layer. The second metal layer has an adhesion with respect to the translucent substrate higher than the adhesion between the first metal layer and the translucent substrate.