-
公开(公告)号：US20170345982A1
公开(公告)日：2017-11-30
申请号：US15609028
申请日：2017-05-31
Applicant: NICHIA CORPORATION
Inventor： Koji ABE , Yasushi OKAMOTO
CPC classification number: H01L33/58 , H01L25/0753 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitting device includes a package, a light-emitting element disposed on the package, and a light-transmissive member over the light-emitting element. An upper surface of the light-transmissive member and an upper surface of the package each have a plurality of projections. The light-transmissive member contains particles of light-transmissive first fillers having refractive indices smaller than the refractive index of a matrix of the light-transmissive member. Part of the particles of the first fillers is exposed to the air from the matrix of the light-transmissive member on the upper surface of the light-transmissive member.
-
公开(公告)号：US20170271565A1
公开(公告)日：2017-09-21
申请号：US15608842
申请日：2017-05-30
Applicant: NICHIA CORPORATION
Inventor： Koji ABE
IPC: H01L33/60
CPC classification number: H01L33/60 , H01L33/62 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2924/00012
Abstract: A method of manufacturing a light emitting device includes: providing an assembly comprising: a package comprising: a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess, and a light emitting element electrically connected to the lead frame; and forming a reflective film containing particles of a first light reflective substance on at least a portion of an outer surface of the resin member corresponding to the recess. The first light reflective substance comprises particles of a white pigment. A reflectance of the reflective film is higher than a reflectance of the resin member.
-
公开(公告)号：US20160322548A1
公开(公告)日：2016-11-03
申请号：US15099693
申请日：2016-04-15
Applicant: NICHIA CORPORATION
Inventor： Koji ABE , Tomohisa KISHIMOTO
CPC classification number: H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2933/0058 , H01L2924/00014 , H01L2924/00012
Abstract: A package, includes a cup-shaped resin component having a bottom surface and side walls that surround the bottom surface, an opening which is opened at an upper part of the side walls, a pair of leads exposed on part of the bottom surface, and a reflective film, the resin component having a 3-D shape defined by an X axis, a Y axis and a Z axis, the outer surface of the side walls that has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening, and the reflective film being disposed in the recess.
Abstract translation: 包装体包括具有下表面的杯形树脂部件和围绕底面的侧壁，在侧壁的上部开口的开口，暴露在底面的一部分上的一对引线，以及 反射膜，所述树脂部件具有由X轴，Y轴和Z轴限定的3-D形状，所述侧壁的外表面具有凹陷部，所述凹部沿Z轴方向凹陷并且布置在 对应于开口的位置，反射膜设置在凹部中。
-
14.发明申请公开(公告)号：US20160190413A1
公开(公告)日：2016-06-30
申请号：US14978641
申请日：2015-12-22
Applicant: Nichia Corporation
Inventor： Koji ABE , Yuki SHIOTA
CPC classification number: H01L33/62 , H01L21/4846 , H01L21/565 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00012 , H01L2924/00014
Abstract: A package for mounting a light emitting element includes a recess; a pair of lead electrodes exposed at a bottom surface of the recess; a plating layer covering a surface of each of the pair of lead electrodes; and a resin molded body retaining the pair of lead electrodes, and forming an area between the pair of lead electrodes at the bottom surface of the recess and a lateral surface of the recess. At least one of the lead electrodes has a front surface protrusion that is linearly formed along the resin molded body at the bottom surface of the recess and along a periphery of the bottom surface of the recess, and a back surface protrusion that is formed at a position at a back surface opposite to a position of the front surface protrusion, and at least a tip of each of the front surface protrusion and the back surface protrusion is exposed outside the plating layer.
Abstract translation: 用于安装发光元件的封装包括凹部; 在所述凹部的底面露出的一对引线电极; 覆盖所述一对引线电极中的每一个的表面的镀层; 以及保持所述一对引线电极的树脂成型体，并且在所述凹部的所述底面的所述一对引线电极和所述凹部的侧面之间形成区域。 所述引线电极中的至少一个具有在所述凹部的底面的所述树脂成型体和所述凹部的所述底面的周围沿着所述树脂成形体直线状地形成的前表面突起， 位于与前表面突起的位置相反的后表面，并且至少前表面突起和后表面突起中的每一个的尖端暴露在镀层外部。
-
公开(公告)号：US20250107302A1
公开(公告)日：2025-03-27
申请号：US18887542
申请日：2024-09-17
Applicant: NICHIA CORPORATION
Inventor： Koji ABE
IPC: H01L33/62 , H01L25/075 , H01L33/52
Abstract: A method of manufacturing a light-emitting device includes: providing a substrate including a base, and a pair of wiring parts disposed on an upper surface side of the base; providing a light-emitting element including a semiconductor structure, and a pair of electrodes; disposing the light-emitting element above the substrate such that the electrodes face the wiring parts; disposing an electrically-conductive member containing copper such that the electrically-conductive member electrically connects the wiring parts to the electrodes and includes a body portion and a protruding portion, the body portion overlapping a corresponding wiring part of the wiring parts in a top view, and the protruding portion protruding outward such that a gap is located between the protruding portion and the base; and disposing a protective film at least in the gap in a state in which the gap is widened by heating the electrically-conductive member.
-
Patent Agency Ranking
公开(公告)号：US20220328741A1
公开(公告)日：2022-10-13
申请号：US17702245
申请日：2022-03-23
Applicant: NICHIA CORPORATION
Inventor： Koji ABE , Kazusa NISHIUCHI
IPC: H01L33/62 , H01L33/56 , H01L25/075 , H01L33/00 , H01L33/60
Abstract: A method of manufacturing a light emitting module includes: providing a wiring board having an upper face on which a plurality of light emitting elements are mounted; disposing a first resin in an area of the upper face of the wiring board that is outward of a region in which the light emitting elements are mounted, wherein the first resin contains a light reflecting substance; and covering lateral faces of the light emitting elements with the first resin by spreading the first resin over the region in which the light emitting elements are mounted.
-
公开(公告)号：US20200052172A1
公开(公告)日：2020-02-13
申请号：US16656791
申请日：2019-10-18
Applicant: NICHIA CORPORATION
Inventor： Koji ABE
Abstract: A light emitting device includes a light emitting element, a light-transmissive member covering the light emitting element, a fluorescent material contained in the light-transmissive member, and a multilayer film disposed on the light-transmissive member and including alternatively layered two types of films of different refractive indices, in which the two types of films are aggregated nano-particles of TiO2 and aggregated nano-particles of SiO2.
-
公开(公告)号：US20190172980A1
公开(公告)日：2019-06-06
申请号：US16249782
申请日：2019-01-16
Applicant: Nichia Corporation
Inventor： Koji ABE , Yuki SHIOTA
Abstract: A package for mounting a light emitting element includes: a first lead electrode having, in a plan view, a first region, a second region surrounding a periphery of the first region having a width of 110 μm or more and a thickness greater than that of the first region, and a third region partially surrounding a periphery of the second region and having a thickness smaller than that of the second region; a second lead electrode spaced apart from the first lead electrode; and a resin molded body fixing a portion of each of the first and second lead electrodes. A portion of each of the first and second lead electrodes and a portion of the resin molded body exposed therebetween form a bottom surface of a recess.
-
公开(公告)号：US20190103531A1
公开(公告)日：2019-04-04
申请号：US16209339
申请日：2018-12-04
Applicant: NICHIA CORPORATION
Inventor： Koji ABE , Tomohisa KISHIMOTO
CPC classification number: H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2933/0058 , H01L2924/00014 , H01L2924/00012
Abstract: A method for manufacturing a package includes molding a precursor of a package including a cup-shaped resin component having a bottom surface and side walls, an opening opened at am upper part of the side walls, and a pair of leads exposed on the bottom surface. The side walls include a side wall that extends along the Y axis and the X axis and that has a first outer surface, and a side wall that extends along the Y axis and the Z axis. A thickness of the side wall extending along Y axis and the X axis is less than a thickness of the side wall extending along axis and the Z axis, The first outer surface has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening. The method further includes forming a reflective film in the recess.
-
公开(公告)号：US20170309800A1
公开(公告)日：2017-10-26
申请号：US15643477
申请日：2017-07-07
Applicant: NICHIA CORPORATION
Inventor： Koji ABE
CPC classification number: H01L33/54 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: A package for mounting a light emitting element includes a pair of lead electrodes and a resin molded body. The pair of lead electrodes are made of metal plates. The package has a recess portion in which a light emitting element is mounted. The recess portion is formed of the pair of lead electrodes and the resin molded body. The pair of lead electrodes are exposed on a bottom surface of the recess portion. At least one of the pair of lead electrodes has a groove portion that is formed along a periphery of the metal plate exposed on the bottom surface of the recess portion. The periphery of the at least one of the pair of lead electrodes on the bottom surface of the recess portion constitutes a boundary between the bottom surface of the recess portion and a side surface portion of the recess portion.
-
-
-
-
-
-
-
-
-
Search Results
22
records
(took 0.019 seconds)
