公开(公告)号：US20190049083A1

公开(公告)日：2019-02-14

申请号：US16080868

申请日：2017-03-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Groetsch ,  Julia Rothneichner

IPC: F21S41/16 ,  F21S41/14 ,  F21S41/64 ,  F21K9/64

CPC classification number: F21S41/16 ,  F21K9/64 ,  F21S41/14 ,  F21S41/18 ,  F21S41/645 ,  F21Y2115/30

Abstract: A pixel light source includes having a light source array, an optical system and an imager matrix arrangement, wherein the optical system maps light radiated by the light source array onto the imager matrix arrangement, the light source array includes a plurality of light emitting diode elements and a plurality of LARP elements, and the optical system is configured to map the light radiated by at least one of the LARP elements into a gap in the angular aperture situated between the light radiated by the light emitting diode elements.

公开(公告)号：US20220149019A1

公开(公告)日：2022-05-12

申请号：US17541798

申请日：2021-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64

Abstract: An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.

公开(公告)号：US10147683B2

公开(公告)日：2018-12-04

申请号：US15024180

申请日：2014-09-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norbert Haefner ,  Ulrich Frei ,  Stefan Groetsch ,  Kurt-Juergen Lang

IPC: H01L23/544 ,  H01L25/075 ,  H01L33/00 ,  G01B11/27 ,  H01L21/67 ,  H01L21/66 ,  H01L33/48

Abstract: A method of processing an optoelectronic component includes a light source having at least one luminous area formed by one or a plurality of light emitting diodes and a receptacle device that receives the light source, including determining a deviation of an actual position of the light source at the receptacle device from a desired position of the light source at the receptacle device, and forming at least one marking at the receptacle device that indicates the deviation.

公开(公告)号：US20170307177A1

公开(公告)日：2017-10-26

申请号：US15518019

申请日：2015-10-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Groetsch ,  Uli Hiller ,  Michael Brandl

IPC: F21V11/14 ,  B60Q1/14 ,  F21S8/10

CPC classification number: F21S41/692 ,  B60Q1/14 ,  F21S41/683 ,  F21V11/14 ,  G02B26/023

Abstract: A light assembly includes a light source, and a micromechanical shutter arrangement having a two-dimensional arrangement of closable shutter openings, wherein at least one shutter opening has a rectangular shape with a length and a width, and the length is greater than the width. The light assembly may be configured as a headlamp for a motor vehicle.

公开(公告)号：US09307647B2

公开(公告)日：2016-04-05

申请号：US14607993

申请日：2015-01-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Stefan Groetsch

IPC: H01L23/48 ,  H05K9/00 ,  H05K1/18 ,  H01L33/48 ,  H05K3/34 ,  H01L31/0203 ,  H01L33/62

CPC classification number: H05K1/181 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16057 ,  H01L2224/16105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.

公开(公告)号：US20150167938A1

公开(公告)日：2015-06-18

申请号：US14418924

申请日：2013-07-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Groetsch ,  Frank Singer

IPC: F21V19/00 ,  F21V29/70

CPC classification number: F21V19/0015 ,  F21S41/147 ,  F21S41/19 ,  F21S43/14 ,  F21S43/19 ,  F21S45/47 ,  F21V29/70 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48 ,  H01L2924/0002 ,  Y10T29/41 ,  H01L2924/00

Abstract: A method for producing an illuminant is specified, in which a positioning device (3) holds an optoelectronic semiconductor component (1) inside a tolerance range (4) on the upper side of a connection carrier (2) during the mechanical fixation and electrical connecting of the optoelectronic semiconductor component (1) to the connection carrier (2).

Abstract translation: 规定了用于制造发光体的方法，其中定位装置（3）在机械固定和电连接期间将光电子半导体部件（1）保持在连接载体（2）的上侧的公差范围（4）内 的光电子半导体部件（1）连接到连接载体（2）。

公开(公告)号：US20140231837A1

公开(公告)日：2014-08-21

申请号：US14346687

申请日：2012-09-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Michael Zitzlsperger ,  Stefan Groetsch

IPC: H01L25/075 ,  H01L33/62 ,  F21S8/10 ,  H01L33/64

CPC classification number: H01L25/0753 ,  F21S41/141 ,  H01L24/73 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main body. The heat sink extends from the mounting surface as far as the base surface. Furthermore, the LED module has a number of LED chips, each having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side. The LED chips are arranged with the electrically insulating carrier substrate on the heat sink.

Abstract translation: LED模块具有电绝缘主体，基面和与基面相对的安装面。 多个电连接触点设置在安装表面。 连接触点不与基面相邻。 散热器布置在主体中。 散热片从安装表面延伸到基面最远处。 此外，LED模块具有多个LED芯片，每个LED芯片在芯片下侧具有电绝缘载体基板，在芯片顶侧具有两个芯片触点。 LED芯片布置有散热器上的电绝缘载体衬底。