FLEXIBLE TRANSISTORS WITH NEAR-JUNCTION HEAT DISSIPATION

    公开(公告)号:US20210343618A1

    公开(公告)日:2021-11-04

    申请号:US16862825

    申请日:2020-04-30

    摘要: Flexible transistors and electronic circuits incorporating the transistors are provided. The flexible transistors promote heat dissipation from the active regions of the transistors while preserving their mechanical flexibility and high-frequency performance. The transistor designs utilize thru-substrate vias (TSVs) beneath the active regions of thin-film type transistors on thin flexible substrates. To promote rapid heat dissipation, the TSVs are coated with a material having a high thermal conductivity that transfers heat from the active region of the transistor to a large-area ground.

    Perivascular drug delivery system
    15.
    发明授权

    公开(公告)号:US10668017B2

    公开(公告)日:2020-06-02

    申请号:US15674293

    申请日:2017-08-10

    摘要: The present technology provide compositions that are drug delivery systems for the sustained release of anti-stenotic drugs for the treatment and prevention of occlusion of blood vessels, particularly after perivascular surgery. The compositions include a hydrogel, unimolecular micelles dispersed within the hydrogel, and an effective amount of anti-stenotic drug dispersed within the unimolecular micelle. The hydrogel may be a di-or tri-block copolymer comprising one block of poly(ethylene glycol) (PEG) and one or two blocks of poly(lactic-co-glycolic acid) (PLGA). The unimolecular micelle may include three domains: a dendritic polymer core, hydrophobic block polymers (e.g., PVL, PVCL, and/or PCL) attached to the core and PEG attached to the hydrophobic block polymers.