公开(公告)号：US11348905B2

公开(公告)日：2022-05-31

申请号：US16805911

申请日：2020-03-02

Applicant: Palo Alto Research Center Incorporated

Inventor： Yunda Wang ,  Jengping Lu ,  Qian Wang ,  Sourobh Raychaudhuri

IPC: H01L21/66 ,  G01R31/26 ,  H01L25/075 ,  H01L25/16 ,  H01L33/00

Abstract: MicroLED chips are transferred from an epitaxy wafer to a first coupon substrate. The first coupon substrate has a first, soft adhesive layer that temporarily holds the microLED chips. Using a first transfer substrate, a subset of the microLED chips are transferred from the first coupon substrate to a second coupon substrate having a second, soft adhesive layer. A pattern of microLED chips are transferred from another substrate to the second coupon substrate via a second transfer substrate to fill vacancies in the subset of microLED chips. The transfer substrates are operable to hold and release pluralities of micro objects.

公开(公告)号：US20220153575A1

公开(公告)日：2022-05-19

申请号：US17591493

申请日：2022-02-02

Applicant: Palo Alto Research Center Incorporated

Inventor： Anne Plochowietz ,  Bradley Rupp ,  Jengping Lu ,  Julie A. Bert ,  Lara S. Crawford ,  Sourobh Raychaudhuri ,  Eugene M. Chow ,  Matthew Shreve ,  Sergey Butylkov

IPC: B81C99/00 ,  H01L21/67 ,  H01L23/00

Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

公开(公告)号：US11279084B2

公开(公告)日：2022-03-22

申请号：US16237464

申请日：2018-12-31

Applicant: Xerox Corporation ,  Palo Alto Research Center Incorporated

Inventor： Ashish V. Pattekar ,  Warren Jackson ,  Anne Plochowietz ,  Jengping Lu ,  Jamie Kalb ,  Christopher L. Chua ,  Carolyn Moorlag ,  Eugene Beh

IPC: B33Y50/00 ,  B33Y50/02 ,  B29C64/171 ,  B29C64/194 ,  B29C64/112 ,  B29C64/209 ,  B29C64/35 ,  B29C64/268 ,  B29C64/241 ,  B29C64/386 ,  B29C64/393 ,  B29C64/40 ,  B29C64/245 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00

Abstract: A method for providing high-speed three dimensional (3D) printing is provided. The method includes producing at least one three dimensional (3D) printed part. Producing the 3D part includes continuously constructing to extend outwardly a diameter of a rotating cylindrical core via continuous deposition of a layer, and defining a first pattern in the continuously deposited layer corresponding to a cross-section of the at least one 3D printed part.

公开(公告)号：US20200207615A1

公开(公告)日：2020-07-02

申请号：US16237316

申请日：2018-12-31

Applicant: Palo Alto Research Center Incorporated

Inventor： Anne Plochowietz ,  Eugene M. Chow ,  Jengping Lu ,  Julie A. Bert ,  David K. Biegelsen ,  Bradley Rupp ,  Sourobh Raychaudhuri

IPC: B81C3/00 ,  B81C1/00

Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler.

公开(公告)号：US11806927B2

公开(公告)日：2023-11-07

申请号：US17568647

申请日：2022-01-04

Applicant: Xerox Corporation ,  Palo Alto Research Center Incorporated

Inventor： Ashish V. Pattekar ,  Warren Jackson ,  Anne Plochowietz ,  Jengping Lu ,  Jamie Kalb ,  Christopher L. Chua ,  Carolyn Moorlag ,  Eugene Beh

IPC: B29C33/52 ,  B29C41/42 ,  B29C41/52 ,  B29C64/118 ,  B29C64/124 ,  B29C64/153 ,  B29C64/165 ,  B29C64/182 ,  B29C71/02 ,  B29C71/04 ,  B33Y50/00 ,  B33Y50/02 ,  B29C64/171 ,  B29C64/194 ,  B29C64/112 ,  B29C64/209 ,  B29C64/35 ,  B29C64/268 ,  B29C64/241 ,  B29C64/386 ,  B29C64/393 ,  B29C64/40 ,  B29C64/245 ,  B29C41/08 ,  B29C33/44 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B29C33/00

CPC classification number: B29C64/171 ,  B29C33/448 ,  B29C41/085 ,  B29C64/112 ,  B29C64/194 ,  B29C64/209 ,  B29C64/241 ,  B29C64/245 ,  B29C64/268 ,  B29C64/35 ,  B29C64/386 ,  B29C64/393 ,  B29C64/40 ,  B29C2033/0005 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00

Abstract: A method of providing high-speed three dimensional (3D) printing is described. The method includes producing at least one three dimensional (3D) printed part. Producing the 3D part includes continuously constructing to extend outwardly a diameter of a rotating cylindrical core via continuous deposition of a layer, and defining a first pattern in the continuously deposited layer corresponding to a cross-section of the at least one 3D printed part.

公开(公告)号：US11780218B2

公开(公告)日：2023-10-10

申请号：US17494208

申请日：2021-10-05

Applicant: Palo Alto Research Center Incorporated

Inventor： Robert A. Street ,  Jengping Lu ,  Joerg Martini ,  David K. Biegelsen ,  Thomas Wunderer

IPC: B41C1/10 ,  B41F31/00 ,  B41F7/02 ,  B41F13/08 ,  B41J2/34 ,  B41J2/335 ,  B41F7/08 ,  B41F7/26 ,  B41M1/06 ,  B41F31/13 ,  B41F31/08 ,  B41N3/03

CPC classification number: B41F13/08 ,  B41C1/1041 ,  B41F7/02 ,  B41F7/08 ,  B41F7/26 ,  B41F31/002 ,  B41F31/08 ,  B41F31/13 ,  B41J2/33535 ,  B41J2/34 ,  B41M1/06 ,  B41N3/03 ,  B41C1/1033 ,  B41P2227/70

Abstract: Based on evaporation of fountain solution from a rotating blanket cylinder to create an image that may be inked and printed, a digitally addressable heater array at or just below the blanket surface evaporates deposited fountain solution and forms a fountain solution latent image on the surface. The heater array has controllable heating elements (e.g., field effect transistors, thin film transistors) that provide a transient heat pattern on the surface to evaporate the fountain solution. Heat is generated by current flow in the heating elements, and power developed by the heating circuit is the product of source-drain voltage and current in the channel. Current may be supplied along data lines by an external voltage controlled by digital electronics to provide the desired heat at heating elements addressed by a specific gate line. The heater array may include a current return line that may be a 2-dimensional mesh.

公开(公告)号：US11738503B2

公开(公告)日：2023-08-29

申请号：US17532817

申请日：2021-11-22

Applicant: Palo Alto Research Center Incorporated ,  Xerox Corporation

Inventor： Anne Plochowietz ,  Ashish V. Pattekar ,  Jengping Lu ,  Nan-Xing Hu

IPC: B29C64/147 ,  B29C64/321 ,  B29C64/205 ,  G03G15/22

CPC classification number: B29C64/147 ,  B29C64/205 ,  B29C64/321 ,  G03G15/224

Abstract: Systems and methods for constructing 3-dimensional (3D) parts are disclosed. A printing system may include a deposition system configured to print a plurality of 2-dimensional (2D) layers onto a plurality of carrier sheets. The printing system also includes a transferring system configured to transfer a 2D layer from a carrier sheet of the plurality of carrier sheets, onto the 3D part. The 3D part may be located on a base substrate. The printing system further includes a feed system configured to provide the plurality of carrier sheets from the deposition system to the transfer system in a successive fashion while maintaining the directionality of printing in the deposition and transferring systems.

公开(公告)号：US20220126510A1

公开(公告)日：2022-04-28

申请号：US17568647

申请日：2022-01-04

Applicant: Xerox Corporation ,  Palo Alto Research Center Incorporated

Inventor： Ashish V. Pattekar ,  Warren Jackson ,  Anne Plochowietz ,  Jengping Lu ,  Jamie Kalb ,  Christopher L. Chua ,  Carolyn Moorlag ,  Eugene Beh

IPC: B29C64/171 ,  B29C64/194 ,  B29C64/112 ,  B29C64/209 ,  B29C64/35 ,  B29C64/268 ,  B29C64/241 ,  B29C64/386 ,  B29C64/393 ,  B29C64/40 ,  B29C64/245

Abstract: A method of providing high-speed three dimensional (3D) printing is described. The method includes producing at least one three dimensional (3D) printed part. Producing the 3D part includes continuously constructing to extend outwardly a diameter of a rotating cylindrical core via continuous deposition of a layer, and defining a first pattern in the continuously deposited layer corresponding to a cross-section of the at least one 3D printed part.

公开(公告)号：US11302561B2

公开(公告)日：2022-04-12

申请号：US16681215

申请日：2019-11-12

Applicant: Palo Alto Research Center Incorporated

Inventor： Yunda Wang ,  Jengping Lu ,  Qian Wang ,  Norine E. Chang

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/32 ,  H01L33/62

Abstract: Transfer elements include an adhesion element having a higher Young's modulus at a lower temperature and a lower Young's modulus at a higher temperature. Heating elements are operable to change an operating temperature of each adhesion element in response to an input. A controller is coupled to provide the inputs to the heating elements to cause a change in temperature at least between the higher and lower temperature. The change in temperature causes the transfer elements to selectably hold objects to and release the objects in response to changes between the higher and lower Young's moduli of transfer elements.

公开(公告)号：US11148941B2

公开(公告)日：2021-10-19

申请号：US16237316

申请日：2018-12-31

Applicant: Palo Alto Research Center Incorporated

Inventor： Anne Plochowietz ,  Eugene M. Chow ,  Jengping Lu ,  Julie A. Bert ,  David K. Biegelsen ,  Bradley Rupp ,  Sourobh Raychaudhuri

IPC: H01S4/00 ,  B81C3/00 ,  B81C1/00 ,  B82Y30/00 ,  B82Y40/00

Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler.