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公开(公告)号：US20250105583A1
公开(公告)日：2025-03-27
申请号：US18893211
申请日：2024-09-23
Applicant: ROHM CO., LTD.
Inventor： Okimoto KONDO , Tomoichiro TOYAMA
IPC: H01S5/0225 , H01S5/02234 , H01S5/026 , H01S5/42
Abstract: A semiconductor light emitting device includes a surface-emitting laser element including an element front surface from which a laser beam is emitted, a light-transmissive first resin portion that encapsulates the surface-emitting laser element and includes a first resin surface, and a second resin portion that differs from the first resin portion and is at least partially formed on the first resin surface facing the element front surface in a direction orthogonal to the element front surface.
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公开(公告)号：US20240113239A1
公开(公告)日：2024-04-04
申请号：US18537297
申请日：2023-12-12
Applicant: ROHM CO., LTD.
Inventor： Masahiko ARIMURA , Tomoichiro TOYAMA
IPC: H01L31/0203 , H01L31/167
CPC classification number: H01L31/0203 , H01L31/167
Abstract: This insulation module includes: a first light-emitting element and a first light-receiving element that constitute a photocoupler; a first plate-shaped member that has light-transmitting properties and is provided between the first light-receiving element and the first light-emitting element; an encapsulation resin that at least encapsulates the light-emitting element and the light-receiving element; and a plurality of terminals that are provided to a first plastic side surface of the encapsulation resin. The first plate-shaped member is layered on the light-receiving surface of the first light-receiving element, and the first light-emitting element is layered on the first plate-shaped member. Recessed-projecting portions are provided to sections between adjacent terminals among the plurality of terminals on the first plastic side surface.
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公开(公告)号：US20240113238A1
公开(公告)日：2024-04-04
申请号：US18537258
申请日：2023-12-12
Applicant: ROHM CO., LTD.
Inventor： Masahiko ARIMURA , Tomoichiro TOYAMA
IPC: H01L31/0203 , H01L25/16 , H01L31/0232 , H01L31/167
CPC classification number: H01L31/0203 , H01L25/167 , H01L31/0232 , H01L31/167
Abstract: An insulation module includes: a light-emitting element; a light-receiving element that receives light from the light-emitting element; a first die pad on which the light-emitting element is mounted; a second die pad that is provided in alignment with the first die pad and on which the light-receiving element is mounted; a transparent resin that at least covers both the light-emitting element and the light-receiving element; a reflection member that covers at least the transparent resin and is formed from a material that reflects light from the light-emitting element; and an encapsulation resin that encapsulates the reflection member as well as the transparent resin and is formed from a material having a light-blocking effect. At least one of the reflection member and the transparent resin includes inorganic particles that absorb or reflect light from the light-emitting element.
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公开(公告)号：US20220310889A1
公开(公告)日：2022-09-29
申请号：US17840296
申请日：2022-06-14
Applicant: Rohm Co., Ltd.
Inventor： Tomoichiro TOYAMA , Ryo KITTAKA
Abstract: A semiconductor light-emitting device includes a substrate, a semiconductor light-emitting element, and a resin member. The substrate includes a base member and a conductive part. The semiconductor light-emitting element is supported on the substrate. The resin member covers at least a portion of the substrate. The base member has a front surface and a back surface that face opposite to each other in a thickness direction. The conductive part includes a front portion formed on the front surface. The semiconductor light-emitting element is mounted on the front portion. The resin member includes a frame-shaped portion surrounding the semiconductor light-emitting element as viewed in the thickness direction, and a front-surface covering portion connected to the frame-shaped portion and covering a portion of the front surface of the base member that is exposed from the front portion.
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公开(公告)号：US20210234077A1
公开(公告)日：2021-07-29
申请号：US17230379
申请日：2021-04-14
Applicant: ROHM CO., LTD.
Inventor： Tomoichiro TOYAMA
Abstract: Semiconductor light emitting device includes: substrate including main and back surfaces, first and second side surfaces, and bottom and top surfaces, wherein main surface includes first to fourth sides; first main surface electrode on main surface and including first base portion contacting the sides of the main surface, and die pad connected to first base portion; second main surface electrode disposed on the main surface and including second base portion contacting first and third sides of the main surface, and wire pad connected to second base portion; semiconductor light emitting element including first electrode pad and mounted on die pad; wire connecting first electrode pad and wire pad; first insulating film covering portion between first base portion and die pad; second insulating film covering portion between second base portion and wire pad and having end portions contacting main surface; and light-transmitting sealing resin.
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Patent Agency Ranking
公开(公告)号：US20200274038A1
公开(公告)日：2020-08-27
申请号：US16725484
申请日：2019-12-23
Applicant: Rohm Co., Ltd.
Inventor： Tomoichiro TOYAMA , Ryo KITTAKA
Abstract: A semiconductor light-emitting device includes a substrate, a semiconductor light-emitting element, and a resin member. The substrate includes a base member and a conductive part. The semiconductor light-emitting element is supported on the substrate. The resin member covers at least a portion of the substrate. The base member has a front surface and a back surface that face opposite to each other in a thickness direction. The conductive part includes a front portion formed on the front surface. The semiconductor light-emitting element is mounted on the front portion. The resin member includes a frame-shaped portion surrounding the semiconductor light-emitting element as viewed in the thickness direction, and a front-surface covering portion connected to the frame-shaped portion and covering a portion of the front surface of the base member that is exposed from the front portion.
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公开(公告)号：US20190386190A1
公开(公告)日：2019-12-19
申请号：US16556896
申请日：2019-08-30
Applicant: Rohm Co., Ltd.
Inventor： Masahiko KOBAYAKAWA , Tomoichiro TOYAMA
IPC: H01L33/60 , H01L25/075 , H01L33/62
Abstract: An LED module according to the present invention includes an LED unit 2 and a case 1, where the LED unit includes an LED chip 21, and the case 1 includes a main body 11 made of a ceramic material and a pad 12a on which the LED unit 2 is mounted. The outer edge 121a of the pad 12a is positioned inward of the outer edge 2a of the LED unit 2 as viewed in plan. These arrangements prevent the light emission amount of the LED module A1 from reducing with time.
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公开(公告)号：US20190067527A1
公开(公告)日：2019-02-28
申请号：US16107209
申请日：2018-08-21
Applicant: ROHM CO., LTD.
Inventor： Tomoichiro TOYAMA
IPC: H01L33/48 , H01L23/00 , H01L33/62 , H01L25/075
Abstract: An example of an optical device of the present disclosure includes a substrate, an obverse-surface conductive layer, a reverse-surface conductive layer, a first conductive part, an optical element and a reflector. The first conductive part extends through the substrate and overlaps with a first obverse-surface conducting region of the obverse-surface conductive layer and the reverse-surface conductive layer as viewed in a thickness direction of the substrate. The reflector has an inner surface that surrounds the optical element as viewed in the thickness direction. The optical element is located on first obverse-surface conducting region, and the second obverse-surface conducting region is located between the first obverse-surface conducting region and the inner surface of the reflector as viewed in the thickness direction. A second obverse-surface conducting region of the obverse-surface conductive layer is spaced apart from the inner surface of the reflector as viewed in the thickness direction.
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公开(公告)号：US20170309602A1
公开(公告)日：2017-10-26
申请号：US15642501
申请日：2017-07-06
Applicant: ROHM CO., LTD.
Inventor： Tomoichiro TOYAMA
IPC: H01L25/075 , H01L27/15 , H01L33/64 , H01L33/62 , H01L33/56 , H01L33/50 , H01L33/48 , H01L33/08 , H01L33/52 , H01L33/60 , H01L25/16
CPC classification number: H01L25/0753 , H01L25/167 , H01L27/15 , H01L33/08 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48465
Abstract: A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member.
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公开(公告)号：US20140103370A1
公开(公告)日：2014-04-17
申请号：US14105437
申请日：2013-12-13
Applicant: ROHM CO., LTD.
Inventor： Tomoichiro TOYAMA
CPC classification number: H01L25/0753 , H01L25/167 , H01L27/15 , H01L33/08 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48465
Abstract: A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member.
Abstract translation: 半导体发光器件包括LED芯片，其包括层叠在基板上的n型半导体层，有源层和p型半导体层。 LED芯片还包括连接到p型半导体的阳极电极和连接到n型半导体的阴极。 阳极和阴极电极面对安装有LED芯片的壳体。 壳体包括包括前表面和后表面的基底构件，以及包括在前表面形成有阳极和阴极衬垫的前表面层的布线，在后表面上形成有阳极和阴极安装电极的后表面层，阳极通过布线 连接阳极焊盘和阳极安装电极并穿过基底部件的一部分，以及通过连接阴极焊盘和阴极安装电极并穿过基底部件的一部分的布线连接阴极。
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