公开(公告)号：US20250167166A1

公开(公告)日：2025-05-22

申请号：US19027974

申请日：2025-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junga LEE ,  Youngja Kim ,  Hyunki Kim ,  Youngmin Lee

IPC: H01L23/00 ,  B23K1/00 ,  B23K1/015 ,  B23K3/047 ,  B23K3/08 ,  B23K101/40

Abstract: An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.

公开(公告)号：US11742329B2

公开(公告)日：2023-08-29

申请号：US17399233

申请日：2021-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho Park ,  Kyungsuk Oh ,  Hyunki Kim ,  Yongkwan Lee ,  Sangsoo Kim ,  Seungkon Mok ,  Junyoung Oh ,  Changyoung Yoo

IPC: H01L23/16 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L23/16 ,  H01L23/3185 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/48227

Abstract: A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

公开(公告)号：US20220367416A1

公开(公告)日：2022-11-17

申请号：US17671065

申请日：2022-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkwan Lee ,  Seunghwan Kim ,  Jungjoo Kim ,  Jongwan Kim ,  Hyunki Kim ,  Junwoo Park ,  Hyunggil Baek ,  Junga Lee ,  Taejun Jeon

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: A semiconductor package includes a package substrate having a communication hole extending from an upper surface of the package substrate to a lower surface of the package substrate, a semiconductor chip attached to the upper surface of the package substrate, an auxiliary chip attached to the lower surface of the package substrate, external connection terminals attached to the lower surface of the package substrate and spaced apart from the auxiliary chip, and an encapsulant encapsulating the semiconductor chip and the auxiliary chip and filling the communication hole.

公开(公告)号：US20210013152A1

公开(公告)日：2021-01-14

申请号：US17032916

申请日：2020-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juhyeon OH ,  Sunchul Kim ,  Hyunki Kim

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16

Abstract: A semiconductor package includes a first substrate, a second substrate provided on the first substrate, a semiconductor chip provided between the first substrate and the second substrate, solder structures extending between the first substrate and the second substrate and spaced apart from the semiconductor chip, and bumps provided between the semiconductor chip and the second substrate. The solder structures electrically connect the first substrate and the second substrate.

公开(公告)号：US12237297B2

公开(公告)日：2025-02-25

申请号：US18127513

申请日：2023-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junga Lee ,  Youngja Kim ,  Hyunki Kim ,  Youngmin Lee

IPC: B23K3/00 ,  B23K1/00 ,  B23K1/015 ,  B23K3/047 ,  B23K3/08 ,  H01L23/00 ,  B23K101/40

Abstract: An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.

公开(公告)号：US11791014B2

公开(公告)日：2023-10-17

申请号：US18053498

申请日：2022-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yesin Ryu ,  Yoonna Oh ,  Hyunki Kim

IPC: G06F11/00 ,  G11C29/00 ,  G06F11/20 ,  G06F12/10 ,  G11C17/16 ,  G11C17/18

CPC classification number: G11C29/88 ,  G06F11/2094 ,  G06F12/10 ,  G11C17/16 ,  G11C17/18 ,  G06F2201/82

Abstract: A memory device includes a row decoder, a column decoder, and a repair control circuit, which is configured to: (i) compare a row address with a stored failed row address, (ii) compare a column address with a stored failed column address, (iii) control the row decoder to activate the at least one of a plurality of redundancy word lines when the row address corresponds to the failed row address, and (iv) control the column decoder to activate at least one of a plurality of redundancy bit lines when the column address corresponds to the failed column address. The repair control circuit varies a repair unit according to an address input during a repair operation.

公开(公告)号：US20230069753A1

公开(公告)日：2023-03-02

申请号：US18053498

申请日：2022-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yesin Ryu ,  Yoonna Oh ,  Hyunki Kim

IPC: G11C29/00 ,  G06F11/20 ,  G06F12/10 ,  G11C17/16 ,  G11C17/18

Abstract: A memory device includes a row decoder, a column decoder, and a repair control circuit, which is configured to: (i) compare a row address with a stored failed row address, (ii) compare a column address with a stored failed column address, (iii) control the row decoder to activate the at least one of a plurality of redundancy word lines when the row address corresponds to the failed row address, and (iv) control the column decoder to activate at least one of a plurality of redundancy bit lines when the column address corresponds to the failed column address. The repair control circuit varies a repair unit according to an address input during a repair operation.

公开(公告)号：US11437326B2

公开(公告)日：2022-09-06

申请号：US17032916

申请日：2020-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juhyeon Oh ,  Sunchul Kim ,  Hyunki Kim

IPC: H01L21/50 ,  H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16 ,  H01L25/18 ,  H01L21/52

Abstract: A semiconductor package includes a first substrate, a second substrate provided on the first substrate, a semiconductor chip provided between the first substrate and the second substrate, solder structures extending between the first substrate and the second substrate and spaced apart from the semiconductor chip, and bumps provided between the semiconductor chip and the second substrate. The solder structures electrically connect the first substrate and the second substrate.

公开(公告)号：US11101243B2

公开(公告)日：2021-08-24

申请号：US16680657

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho Park ,  Kyungsuk Oh ,  Hyunki Kim ,  Yongkwan Lee ,  Sangsoo Kim ,  Seungkon Mok ,  Junyoung Oh ,  Changyoung Yoo

IPC: H01L25/065 ,  H01L23/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

公开(公告)号：US10825774B2

公开(公告)日：2020-11-03

申请号：US16424000

申请日：2019-05-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juhyeon Oh ,  Sunchul Kim ,  Hyunki Kim

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16 ,  H01L25/18 ,  H01L21/52

Abstract: A semiconductor package includes a first substrate, a second substrate provided on the first substrate, a semiconductor chip provided between the first substrate and the second substrate, solder structures extending between the first substrate and the second substrate and spaced apart from the semiconductor chip, and bumps provided between the semiconductor chip and the second substrate. The solder structures electrically connect the first substrate and the second substrate.