Abstract:
A method for reading data of a memory cell including a resistive memory element having a low resistance state and a high resistance state according to stored data and a selection element may include applying a recovery voltage to both ends of the memory cell, and applying a read voltage to both ends of the memory cell and sensing the data. The recovery voltage may be equal to or more than a second voltage obtained by adding a drift value of the memory cell to a first voltage for turning on the memory cell in a case in which the resistive memory element is in the low resistance state.
Abstract:
An electronic device includes a semiconductor memory. The semiconductor memory includes a memory cell; a first line coupled to a first end of the memory cell; a first coupling circuit to selectively couple a high voltage terminal to the first line in response to a first selection signal; a second line coupled to a second end of the memory cell; a second coupling circuit to selectively couple a first low voltage terminal to the second line in response to a second selection signal; and a first charge storing circuit selectively coupled to the first line in response to an enable signal, the enable signal corresponding to a predetermined operation mode when the memory cell is turned on.
Abstract:
An electronic device includes a semiconductor memory, and the semiconductor memory includes a memory cell including a resistive memory element having a high resistance state and a low resistance state according to stored data, a selection element coupled serially to the resistive memory element, and a current clamping transistor electrically connected to a first end of the memory cell to limit an amount of a current flowing through the memory cell. In a drift recovery operation of the memory cell, a rising pulse voltage may be applied to a second end of the memory cell in a state in which the current clamping transistor has been turned off, the first end facing the second end.
Abstract:
Provided is an electronic device including a semiconductor memory. The semiconductor memory may include a memory region comprising a plurality of memory cells disposed at respective intersections between a plurality of row lines and a plurality of column lines, the plurality of row lines extending in a first direction, the plurality of column lines extending in a second direction crossing the first direction; first and second row drivers arranged on one side and the other side of the memory region in the first direction, respectively, and driving a common row line corresponding to a row address among the plurality of row lines; and a column driver driving a common column line corresponding to a column address among the plurality of column lines, wherein the first and second row drivers are coupled to the common row line.
Abstract:
An image sensor device is provided to include: a pixel bias voltage sampling unit suitable for sampling a pixel bias voltage; a pixel power noise addition control unit suitable for controlling the magnitude of added pixel power noise; a pixel power noise addition unit suitable for adding pixel power noise to a node of the pixel bias voltage sampled by the pixel bias voltage sampling unit according to control of the pixel power noise addition control unit; and a biasing unit suitable for offsetting pixel power noise transmitted from the pixel by inverting the pixel power noise added by the pixel power noise addition unit.
Abstract:
A reservoir capacitor includes a first capacitor group having two or more capacitors, which are serially coupled to each other between a first power voltage supply terminal and a second power voltage supply terminal, a second capacitor group having two or more capacitors, which are serially coupled to each other between a third power voltage supply terminal and a fourth power voltage supply terminal and a connection line suitable for electrically coupling a first coupling node between the capacitors of the first capacitor group to a second coupling node between the capacitors of the second capacitor group.
Abstract:
Provided is an electronic device including a semiconductor memory. The semiconductor memory may include: a plurality of first lines; a plurality of second lines; a plurality of memory cells disposed in respective intersection regions between the plurality of first lines and the plurality of second lines; a first test circuit configured to apply a stress pulse to a first selection line coupled to a defective memory cell among the plurality of memory cells during a first test period, in response to a first test control signal, the first selection line including any one of the plurality of first lines; and a control unit configured to generate the first test control signal based on a first test mode signal.
Abstract:
A semiconductor memory includes: a first line; a second line spaced apart from the first line and extending in a first direction; a third line spaced apart from the second line and extending in a second direction; a first memory cell disposed between the first and second lines at an intersection region of the first and second lines, the first memory cell including a first selection element layer, a first electrode, and a first insert electrode interposed between the first selection element layer and the first electrode; and a second memory cell disposed between the second and third lines at an intersection region of the second and third lines, the second memory cell including a second selection element layer, a second electrode, and a second insert electrode interposed between the second selection element layer and the second electrode.
Abstract:
A method drives an electronic device including a semiconductor memory in a test mode. The method includes applying a stress pulse simultaneously to a plurality of memory cells to turn on the plurality of memory cells, determining whether the memory cells are turned on or turned off, and applying a second maximum voltage to a selected memory cell of the plurality of memory cells only when the selected memory cell is determined to be in a turned-off state.
Abstract:
An electronic device includes a semiconductor memory. The semiconductor memory may include: a memory circuit comprising a plurality of memory cells; a read circuit configured to generate a first read data signal by reading data from a read target memory cell according to a first read control signal, the read target memory cell being among the plurality of memory cells; and a control circuit configured to control the read circuit to reread the data from the read target memory cell by generating a second read control signal, the second read control signal being based on a data value of the first read data signal.