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公开(公告)号：US20200095114A1
公开(公告)日：2020-03-26
申请号：US16560518
申请日：2019-09-04
Applicant: STMicroelectronics S.r.l.
Inventor： Anna Angela Pomarico , Giuditta Roselli , Daniele Caltabiano , Roberto Brioschi , Mohammad Abbasi Gavarti
Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.
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12.发明授权公开(公告)号：US10338378B2
公开(公告)日：2019-07-02
申请号：US15264446
申请日：2016-09-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Brioschi
Abstract: The mirror group is formed by a monolithic frame bent along a bending line and including a first and a second supporting portions carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions are arranged on opposite sides of the bending line of the frame, angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.
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公开(公告)号：US10225635B2
公开(公告)日：2019-03-05
申请号：US15143207
申请日：2016-04-29
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto Brioschi , Alex Gritti , Kevin Formosa , Paul Anthony Barbara
Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
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公开(公告)号：US10189703B2
公开(公告)日：2019-01-29
申请号：US15362556
申请日：2016-11-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Marco Omar Ghidoni , Roberto Brioschi
Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.
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公开(公告)号：US09769554B2
公开(公告)日：2017-09-19
申请号：US14943848
申请日：2015-11-17
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto Brioschi , Silvia Adorno , Kenneth Fonk
CPC classification number: H04R1/086 , B81B7/0058 , B81B7/0061 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , B81C1/00309 , B81C2203/0785 , H01L2224/48137 , H01L2224/48227 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006
Abstract: A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the MEMS acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.
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Patent Agency Ranking
公开(公告)号：US11851319B2
公开(公告)日：2023-12-26
申请号：US16560518
申请日：2019-09-04
Applicant: STMicroelectronics S.r.l.
Inventor： Anna Angela Pomarico , Giuditta Roselli , Daniele Caltabiano , Roberto Brioschi , Mohammad Abbasi Gavarti
CPC classification number: B81B3/0072 , B60T1/065 , B60T8/17 , B60T8/171 , G01L1/18 , G01L3/00 , G01L9/06 , B81B2201/0264 , B81B2201/0292 , B81B2203/0127 , B81B2203/0315
Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.
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公开(公告)号：US10597287B2
公开(公告)日：2020-03-24
申请号：US16233682
申请日：2018-12-27
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Marco Omar Ghidoni , Roberto Brioschi
Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.
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公开(公告)号：US10531204B2
公开(公告)日：2020-01-07
申请号：US16137439
申请日：2018-09-20
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Brioschi , Marco Omar Ghidoni
IPC: B06B1/02 , B81B7/02 , B81B7/04 , B81C1/00 , H04R1/44 , H04R3/00 , H04R7/06 , H04R19/00 , H04R19/04 , H04R31/00
Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.
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19.发明申请公开(公告)号：US20190028815A1
公开(公告)日：2019-01-24
申请号：US16137439
申请日：2018-09-20
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Brioschi , Marco Omar Ghidoni
IPC: H04R19/04 , H04R7/06 , H04R31/00 , H04R19/00 , H04R3/00 , B81C1/00 , B06B1/02 , H04R1/44 , B81B7/04
CPC classification number: H04R19/04 , B06B1/0292 , B81B7/02 , B81B7/04 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0292 , B81B2201/047 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H04R1/44 , H04R3/005 , H04R7/06 , H04R19/005 , H04R31/003 , H04R31/006 , H04R2201/003 , H04R2499/11 , H01L2924/00014
Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.
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公开(公告)号：US10091587B2
公开(公告)日：2018-10-02
申请号：US15377627
申请日：2016-12-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Brioschi , Marco Omar Ghidoni
IPC: H04R25/00 , H04R19/04 , B06B1/02 , B81C1/00 , H04R3/00 , H04R19/00 , B81B7/04 , H04R1/44 , H04R7/06 , H04R31/00
Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.
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