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    MOBILE DEVICE FOR AN ELECTRONIC STETHOSCOPE INCLUDING AN ELECTRONIC MICROPHONE AND A UNIT FOR DETECTING THE POSITION OF THE MOBILE DEVICE
    14.
    发明申请
    MOBILE DEVICE FOR AN ELECTRONIC STETHOSCOPE INCLUDING AN ELECTRONIC MICROPHONE AND A UNIT FOR DETECTING THE POSITION OF THE MOBILE DEVICE 审中-公开
    用于包括电子麦克风的电子止血器的移动设备和用于检测移动设备的位置的单元

    公开(公告)号：US20140371631A1

    公开(公告)日：2014-12-18

    申请号：US14305728

    申请日：2014-06-16

    Applicant: STMicroelectronics S.r.l.

    Inventor： Fulvio Vittorio Fontana

    IPC: A61B7/04 ,  H04R1/46

    CPC classification number: A61B7/04 ,  H04R1/46

    Abstract: A mobile device for an electronic stethoscope, including: a microphone, which receive an acoustic signal coming from an area of the body during a detection period and generates an auscultation signal of an electrical type, as a function of the acoustic signal; a transmitter; a processing unit, which transmits the auscultation signal to an external electronic device, through the transmitter; and an electronic accelerometer, which generates an acceleration signal indicating acceleration of the mobile device. The processing unit generates, on the basis of the acceleration signal, a position signal, indicating the position of the mobile device during the detection period, and transmits the position signal to the external electronic device, through the transmitter.

    Abstract translation: 一种用于电子听诊器的移动设备，包括：麦克风，其在检测期间接收来自身体区域的声信号，并且产生作为声信号的函数的电类型的听诊信号; 发射机 处理单元，其通过发送器将听诊信号发送到外部电子设备; 以及电子加速度计，其产生表示移动装置的加速度的加速度信号。 处理单元基于加速度信号生成表示移动装置在检测期间的位置的位置信号，并通过发送器将位置信号发送到外部电子装置。

    SMDs integration on QFN by 3D stacked solution
    16.
    发明授权
    SMDs integration on QFN by 3D stacked solution 有权

    公开(公告)号：US11842948B2

    公开(公告)日：2023-12-12

    申请号：US17244378

    申请日：2021-04-29

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Cristina Somma ,  Fulvio Vittorio Fontana

    IPC: H01L23/495

    CPC classification number: H01L23/49503 ,  H01L23/49517 ,  H01L23/49575

    Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.

    PACKAGE FOR SEMICONDUCTOR DEVICES SENSITIVE TO MECHANICAL AND THERMO-MECHANICAL STRESSES, SUCH AS MEMS PRESSURE SENSORS
    19.
    发明申请
    PACKAGE FOR SEMICONDUCTOR DEVICES SENSITIVE TO MECHANICAL AND THERMO-MECHANICAL STRESSES, SUCH AS MEMS PRESSURE SENSORS 有权
    用于机械和机械应力敏感的半导体器件的封装，如MEMS压力传感器

    公开(公告)号：US20160146692A1

    公开(公告)日：2016-05-26

    申请号：US14861648

    申请日：2015-09-22

    Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS, INC.

    Inventor： Fulvio Vittorio Fontana ,  Jefferson Talledo

    IPC: G01L19/14

    CPC classification number: G01L19/148 ,  B81B7/0045 ,  B81C1/00325 ,  H01L21/50 ,  H01L23/057 ,  H01L23/49575 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

    Abstract: A surface mounting device has one body of semiconductor material such as an ASIC, and a package surrounding the body. The package has a base region carrying the body, a cap and contact terminals. The base region has a Young's modulus lower than 5 MPa. For forming the device, the body is attached to a supporting frame including contact terminals and a die pad, separated by cavities; bonding wires are soldered to the body and to the contact terminals; an elastic material is molded so as to surround at least in part lateral sides of the body, fill the cavities of the supporting frame and cover the ends of the bonding wires on the contact terminals; and a cap is fixed to the base region. The die pad is then etched away.

    Abstract translation: 表面安装装置具有一个诸如ASIC的半导体材料，以及围绕该主体的封装。 该包装具有承载本体的基部区域，盖子和接触端子。 基部区域的杨氏模量低于5MPa。 为了形成装置，主体附接到支撑框架，该支撑框架包括由空腔分开的接触端子和模片垫; 接合线焊接到主体和接触端子; 将弹性材料模制成至少围绕主体的侧面，填充支撑框架的空腔并覆盖接触端子上的接合线的端部; 并且帽固定到基部区域。 然后蚀刻掉芯片焊盘。

    Method of manufacturing semiconductor devices and corresponding device
    20.
    发明授权
    Method of manufacturing semiconductor devices and corresponding device 有权

    公开(公告)号：US12230511B2

    公开(公告)日：2025-02-18

    申请号：US17398710

    申请日：2021-08-10

    Applicant: STMicroelectronics S.r.l.

    Inventor： Fulvio Vittorio Fontana ,  Marco Rovitto

    IPC: H01L21/48 ,  H01L21/67 ,  H01L23/495

    Abstract: At least one semiconductor chip or die is held within at a chip retaining formation provided in a chip holding device. The chip holding device is then positioned with the at least one semiconductor chip or die arranged facing a chip attachment location in a chip mounting substrate. This positioning produces a cavity between the at least one semiconductor chip or die arranged at the chip retaining formation and the chip attachment location in the chip mounting substrate. A chip attachment material is dispensed into the cavity. Once cured, the chip attachment material attaches the at least one semiconductor chip or die onto the substrate at the chip attachment location in the chip mounting substrate.

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