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11.发明授权公开(公告)号：US09226079B2
公开(公告)日：2015-12-29
申请号：US14220985
申请日：2014-03-20
Applicant: STMicroelectronics S.r.l.
Inventor： Alessandra Sciutti , Matteo Perletti , Sebastiano Conti , Roberto Carminati
CPC classification number: H04R19/005 , B81B7/0029 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , G01L9/0073 , H04R19/04
Abstract: A microelectromechanical sensing structure for a capacitive acoustic transducer, including: a semiconductor substrate; a rigid electrode; and a membrane set between the substrate and the rigid electrode, the membrane having a first surface and a second surface, which are in fluid communication, respectively, with a first chamber and a second chamber, respectively, the first chamber being delimited at least in part by a first wall portion and a second wall portion formed at least in part by the substrate, the second chamber being delimited at least in part by the rigid electrode, the membrane being moreover designed to undergo deformation following upon incidence of pressure waves and facing the rigid electrode so as to form a sensing capacitor having a capacitance that varies as a function of the deformation of the membrane. The structure moreover includes a beam, which is connected to the first and second wall portions and is designed to limit the oscillations of the membrane.
Abstract translation: 一种用于电容式声换能器的微机电感测结构，包括：半导体衬底; 刚性电极; 以及膜，其设置在所述基底和所述刚性电极之间，所述膜具有第一表面和第二表面，所述第一表面和第二表面分别与第一腔室和第二腔室流体连通，所述第一腔室至少在 部分由第一壁部分和至少部分地由基底形成的第二壁部分，第二室至少部分地由刚性电极限定，该膜还被设计成在压力波入射之后经历变形，并且面向 刚性电极，以形成感测电容器，该感测电容器具有作为膜的变形的函数而变化的电容。 该结构还包括梁，其连接到第一和第二壁部分并被设计成限制膜的振荡。
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12.发明申请PROCESS FOR MANUFACTURING A MICROMECHANICAL STRUCTURE HAVING A BURIED AREA PROVIDED WITH A FILTER 审中-公开制造具有过滤器的烧结区域的微观结构的方法公开(公告)号：US20150175410A1
公开(公告)日：2015-06-25
申请号：US14133290
申请日：2013-12-18
Applicant: STMicroelectronics S.r.l.
Inventor： Marco Ferrera , Matteo Perletti , Igor Varisco , Luca Zanotti
IPC: B81C1/00
CPC classification number: B81C1/00119 , B01D67/0062 , B01D71/02 , B01D2325/021 , B01D2325/028 , B01L3/502707 , B01L3/502753 , B01L2300/0681 , B81B2201/10 , B81C1/00071 , B81C1/00087 , B81C2201/0133 , B81C2201/0157 , F04B19/006
Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.
Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。
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13.发明申请WAFER LEVEL ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATED MEMS SENSOR DEVICE 有权MEMS传感器装置和相关MEMS传感器装置的水平方向组装公开(公告)号：US20140319630A1
公开(公告)日：2014-10-30
申请号：US14265053
申请日：2014-04-29
Applicant: STMicroelectronics S.r.l.
Inventor： Sebastiano Conti , Matteo Perletti , Roberto Carminati , Lorenzo Baldo , Alessandro Morcelli
IPC: H04R19/00
CPC classification number: H04R19/005 , H01L29/84 , H04R1/04 , H04R19/04
Abstract: An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.
Abstract translation: MEMS传感器装置的组件设想：第一管芯，集成微机械检测结构并具有外部主面; 集成了可操作地耦合到微机械检测结构的电子电路，电和机械耦合到第一管芯并且具有相应的外部主面。 第一模具和第二模具的外部主面都被设置成与组件外部的环境直接接触，而不插入封装件。
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公开(公告)号：US11317219B2
公开(公告)日：2022-04-26
申请号：US16693003
申请日：2019-11-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Matteo Perletti , Federico Vercesi , Silvia Adorno , Giorgio Allegato
Abstract: A method for manufacturing a filtering module comprising the steps of: forming a multilayer body comprising a filter layer of semiconductor material and having a thickness of less than 10 μm, a first structural layer coupled to a first side of the filter layer, and a second structural layer coupled to a second side, opposite to the first side, of the filter layer; forming a recess in the first structural layer, which extends throughout its thickness; removing selective portions, exposed through the recess, of the filter layer to form a plurality of openings, which extend throughout the thickness of the filter layer; and completely removing the second structural layer to connect fluidically the first and second sides of the filter layer, thus forming a filtering membrane designed to inhibit passage of contaminating particles.
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15.发明授权Process for manufacturing a micromechanical structure having a buried area provided with a filter 有权具有设置有过滤器的掩埋区域的微机械结构的制造方法公开(公告)号：US09061248B1
公开(公告)日：2015-06-23
申请号：US14133290
申请日：2013-12-18
Applicant: STMicroelectronics S.r.l.
Inventor： Marco Ferrera , Matteo Perletti , Igor Varisco , Luca Zanotti
CPC classification number: B81C1/00119 , B01D67/0062 , B01D71/02 , B01D2325/021 , B01D2325/028 , B01L3/502707 , B01L3/502753 , B01L2300/0681 , B81B2201/10 , B81C1/00071 , B81C1/00087 , B81C2201/0133 , B81C2201/0157 , F04B19/006
Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.
Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面的部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。
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Patent Agency Ranking
16.发明申请公开(公告)号：US20140286509A1
公开(公告)日：2014-09-25
申请号：US14220985
申请日：2014-03-20
Applicant: STMicroelectronics S.r.l.
Inventor： Alessandra Sciutti , Matteo Perletti , Sebastiano Conti , Roberto Carminati
CPC classification number: H04R19/005 , B81B7/0029 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , G01L9/0073 , H04R19/04
Abstract: A microelectromechanical sensing structure for a capacitive acoustic transducer, including: a semiconductor substrate; a rigid electrode; and a membrane set between the substrate and the rigid electrode, the membrane having a first surface and a second surface, which are in fluid communication, respectively, with a first chamber and a second chamber, respectively, the first chamber being delimited at least in part by a first wall portion and a second wall portion formed at least in part by the substrate, the second chamber being delimited at least in part by the rigid electrode, the membrane being moreover designed to undergo deformation following upon incidence of pressure waves and facing the rigid electrode so as to form a sensing capacitor having a capacitance that varies as a function of the deformation of the membrane. The structure moreover includes a beam, which is connected to the first and second wall portions and is designed to limit the oscillations of the membrane.
Abstract translation: 一种用于电容式声换能器的微机电感测结构，包括：半导体衬底; 刚性电极; 以及膜，其设置在所述基底和所述刚性电极之间，所述膜具有第一表面和第二表面，所述第一表面和第二表面分别与第一腔室和第二腔室流体连通，所述第一腔室至少在 部分由第一壁部分和至少部分地由基底形成的第二壁部分，第二室至少部分地由刚性电极限定，该膜还被设计成在压力波入射之后经历变形，并且面向 刚性电极，以形成感测电容器，该感测电容器具有作为膜的变形的函数而变化的电容。 该结构还包括梁，其连接到第一和第二壁部分并被设计成限制膜的振荡。
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公开(公告)号：US11128958B2
公开(公告)日：2021-09-21
申请号：US16256816
申请日：2019-01-24
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio Allegato , Federico Vercesi , Laura Maria Castoldi , Laura Oggioni , Matteo Perletti
Abstract: A method for manufacturing a semiconductor die, comprising the steps of: providing a MEMS device having a structural body, provided with a cavity, and a membrane structure suspended over the cavity; coupling the structural body to a filtering module via direct bonding or fusion bonding so that a first portion of the filtering module extends over the cavity and a second portion of the filtering module extends seamlessly as a prolongation of the structural body; and etching selective portions of the filtering module in an area corresponding to the first portion, to form filtering openings fluidically coupled to the cavity. The semiconductor die is, for example, a microphone.
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公开(公告)号：US09628919B2
公开(公告)日：2017-04-18
申请号：US14265053
申请日：2014-04-29
Applicant: STMicroelectronics S.r.l.
Inventor： Sebastiano Conti , Matteo Perletti , Roberto Carminati , Lorenzo Baldo , Alessandro Morcelli
CPC classification number: H04R19/005 , H01L29/84 , H04R1/04 , H04R19/04
Abstract: An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.
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19.发明授权Micromechanical detection structure for a MEMS acoustic transducer and corresponding manufacturing process 有权MEMS声学传感器的微机械检测结构及相应的制造工艺公开(公告)号：US09332354B2
公开(公告)日：2016-05-03
申请号：US14254511
申请日：2014-04-16
Applicant: STMicroelectronics S.r.l.
Inventor： Sebastiano Conti , Marco Salina , Luca Lamagna , Matteo Perletti
CPC classification number: H04R23/00 , H04R19/005 , H04R19/04 , H04R31/00 , Y10T29/49005
Abstract: A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate made of semiconductor material, having a front surface lying in a horizontal plane; a membrane, coupled to the substrate and designed to undergo deformation in the presence of incident acoustic-pressure waves; a fixed electrode, which is rigid with respect to the acoustic-pressure waves and is coupled to the substrate by means of an anchorage structure, in a suspended position facing the membrane to form a detection capacitor. The anchorage structure has at least one pillar element, which is at least in part distinct from the fixed electrode and supports the fixed electrode in a position parallel to the horizontal plane.
Abstract translation: 一种用于MEMS电容式声换能器的微机械结构，具有：由半导体材料制成的基板，其前表面位于水平面; 膜，其耦合到基底并设计成在存在入射声压波的情况下经历变形; 固定电极，其相对于声压波是刚性的，并且通过锚定结构耦合到衬底，处于面向膜的悬挂位置以形成检测电容器。 锚固结构具有至少一个柱元件，其至少部分地不同于固定电极，并且将固定电极支撑在平行于水平面的位置。
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20.发明申请DETECTION STRUCTURE FOR A MEMS ACOUSTIC TRANSDUCER WITH IMPROVED ROBUSTNESS TO DEFORMATION 审中-公开具有改进的稳定性的MEMS声学传感器的检测结构公开(公告)号：US20140353780A1
公开(公告)日：2014-12-04
申请号：US14288106
申请日：2014-05-27
Applicant: STMicroelectronics S.r.l.
Inventor： Matteo Perletti , Sebastiano Conti , Roberto Carminati , Marcella Capezzuto
CPC classification number: B81B3/0051 , B81B3/0021 , B81B2201/0257 , B81C1/00158 , H04R19/005
Abstract: A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate of semiconductor material; a rigid electrode, at least in part of conductive material, coupled to the substrate; a membrane, at least in part of conductive material, facing the rigid electrode and coupled to the substrate, which undergoes deformation in the presence of incident acoustic pressure waves and is arranged between the substrate and the rigid electrode and has a first surface and a second surface, in fluid communication, respectively, with a first chamber and a second chamber, the first chamber being delimited at least in part by a first wall portion and by a second wall portion formed by the substrate, and the second chamber being delimited at least in part by the rigid electrode; and a stopper element, connected between the first and second wall portions for limiting the deformations of the membrane. At least one electrode-anchorage element couples the rigid electrode to the stopper element.
Abstract translation: 用于MEMS电容式声学换能器的微机械结构具有：半导体材料的衬底; 耦合到所述衬底的至少部分导电材料的刚性电极; 至少部分导电材料的膜面向刚性电极并且耦合到衬底，所述衬底在存在入射声压波的情况下经历变形，并且布置在衬底和刚性电极之间并且具有第一表面和第二表面 分别与第一室和第二室分别流体连通的表面，第一室至少部分地由第一壁部分和由衬底形成的第二壁部分限定，并且第二室至少界定 部分由刚性电极; 以及连接在第一和第二壁部分之间以限制膜的变形的止动元件。 至少一个电极固定元件将刚性电极连接到止动元件。
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