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公开(公告)号：US10272684B2
公开(公告)日：2019-04-30
申请号：US15253601
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , David S. Hunt , Joseph Edward Scheffelin , Dana Gruenbacher , Stefan H. Hollinger , Uwe Schober , Peter Janouch
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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公开(公告)号：US10264667B2
公开(公告)日：2019-04-16
申请号：US14310601
申请日：2014-06-20
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Steve Bush , Faiz Sherman
Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.
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公开(公告)号：US09357635B2
公开(公告)日：2016-05-31
申请号：US14981056
申请日：2015-12-28
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics Asia Pacific Pte Ltd
Inventor： Simon Dodd , Joe Scheffelin , Dana Gruenbacher , Roberto Brioschi , Teck Khim Neo , Dave Hunt , Faiz Sherman
IPC: B41J2/14 , B41J2/175 , B05B1/14 , B32B38/04 , B32B38/14 , B32B37/00 , H05K1/02 , H05K1/09 , H05K3/30
CPC classification number: B41J2/1623 , B05B1/14 , B05B11/0054 , B05B15/40 , B41J2/14024 , B41J2/14145 , B41J2/1433 , B41J2/162 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L41/1132 , H01L2224/2732 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32225 , H01L2224/48096 , H01L2224/48097 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/83862 , H01L2224/83874 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/19106 , H05K1/0272 , H05K1/09 , H05K1/181 , H05K3/305 , H05K2201/10083 , H05K2201/10515 , H05K2201/10545 , Y02P70/613 , Y10T156/1089 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2924/00
Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可阻挡或减少通过喷嘴的流体流动。
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公开(公告)号：US20160107446A1
公开(公告)日：2016-04-21
申请号：US14981056
申请日：2015-12-28
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics Asia Pacific Pte Ltd
Inventor： Simon Dodd , Joe Scheffelin , Dana Gruenbacher , Roberto Brioschi , Teck Khim Neo , Dave Hunt , Faiz Sherman
IPC: B41J2/16
CPC classification number: B41J2/1623 , B05B1/14 , B05B11/0054 , B05B15/40 , B41J2/14024 , B41J2/14145 , B41J2/1433 , B41J2/162 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L41/1132 , H01L2224/2732 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32225 , H01L2224/48096 , H01L2224/48097 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/83862 , H01L2224/83874 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/19106 , H05K1/0272 , H05K1/09 , H05K1/181 , H05K3/305 , H05K2201/10083 , H05K2201/10515 , H05K2201/10545 , Y02P70/613 , Y10T156/1089 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2924/00
Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
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公开(公告)号：US20160107443A1
公开(公告)日：2016-04-21
申请号：US14976434
申请日：2015-12-21
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana GRUENBACHER , Faiz SHERMAN
IPC: B41J2/14
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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Patent Agency Ranking
16.发明授权公开(公告)号：US09174445B1
公开(公告)日：2015-11-03
申请号：US14310633
申请日：2014-06-20
Applicant: STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Daniele Prati , Domenico Giusti , Simon Dodd
CPC classification number: B41J2/14072 , B41J2/1404 , B41J2002/14362 , B41J2002/14403 , Y10T29/49352
Abstract: The present disclosure is directed to a microfluidic die having a substrate with an inlet path that is configured to move fluid into the die. The die includes a plurality of heaters formed above the substrate, each heater having a first area, a plurality of chambers formed above the plurality of heaters, and a plurality of nozzles formed above the chambers. Each nozzle having an entrance adjacent to the chamber and an exit adjacent to en external environment, the entrance having a second area, and the second having a third area, the first area being greater than the second area, and the second area being greater than the third area. A ratio of the first area to the third area being greater than 5 to 1.
Abstract translation: 本公开针对具有基底的微流体模具，该基底具有入口路径，该入口路径被配置为将流体移动到模具中。 模具包括形成在基板上方的多个加热器，每个加热器具有第一区域，形成在多个加热器上方的多个室以及形成在室上方的多个喷嘴。 每个喷嘴具有邻近室的入口和与外部环境相邻的出口，入口具有第二区域，第二区域具有第三区域，第一区域大于第二区域，第二区域大于第二区域 第三区。 第一区域与第三区域的比例大于5比1。
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公开(公告)号：US20180194614A1
公开(公告)日：2018-07-12
申请号：US15915454
申请日：2018-03-08
Applicant: STMicroelectronics Asia Pacific Pte Ltd , STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Teck Khim Neo , Mauro Pasetti , Franco Consiglieri , Luca Molinari , Andrea Nicola Colecchia , Simon Dodd
CPC classification number: B81B7/008 , B05B1/24 , B05B17/06 , B41J2/04501 , B41J2/04541 , B41J2/04543 , B41J2/14016 , B41J2/14072 , B81B2201/05 , B81B2207/012 , B81B2207/091
Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
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公开(公告)号：US09938136B2
公开(公告)日：2018-04-10
申请号：US15240709
申请日：2016-08-18
Applicant: STMicroelectronics Asia Pacific Pte Ltd , STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Teck Khim Neo , Mauro Pasetti , Franco Consiglieri , Luca Molinari , Andrea Nicola Colecchia , Simon Dodd
CPC classification number: B81B7/008 , B05B1/24 , B05B17/06 , B41J2/04501 , B41J2/04541 , B41J2/04543 , B41J2/14016 , B41J2/14072 , B81B2201/05 , B81B2207/012 , B81B2207/091
Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
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公开(公告)号：US09873250B2
公开(公告)日：2018-01-23
申请号：US15260218
申请日：2016-09-08
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , Andrea Nicola Colecchia
CPC classification number: H01L24/09 , B41J2/14072 , B41J2/14201 , B41J2/1753 , B41J2/17546 , B41J2/17553 , B41J2002/14491 , H01L2224/0401
Abstract: Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.
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公开(公告)号：US20170259568A1
公开(公告)日：2017-09-14
申请号：US15260218
申请日：2016-09-08
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , Andrea Nicola Colecchia
CPC classification number: H01L24/09 , B41J2/14072 , B41J2/14201 , B41J2/1753 , B41J2/17546 , B41J2/17553 , B41J2002/14491 , H01L2224/0401
Abstract: Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.
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