公开(公告)号：US20240387503A1

公开(公告)日：2024-11-21

申请号：US18788803

申请日：2024-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/00 ,  H01L25/16 ,  H01L27/15

Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.

公开(公告)号：US12080585B2

公开(公告)日：2024-09-03

申请号：US18312641

申请日：2023-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Junsik Hwang

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62

CPC classification number: H01L21/6835 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2221/68309 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.

公开(公告)号：US11869880B2

公开(公告)日：2024-01-09

申请号：US17090077

申请日：2020-11-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Sungwoo Hwang

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L24/08 ,  H01L24/24 ,  H01L24/80 ,  H01L24/95 ,  H01L33/0095 ,  H01L24/82 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/245 ,  H01L2224/24137 ,  H01L2224/8014 ,  H01L2224/80986 ,  H01L2224/9512 ,  H01L2224/95102 ,  H01L2224/95136 ,  H01L2924/10156 ,  H01L2924/12041 ,  H01L2933/0041 ,  H01L2224/245 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  H01L2924/00014

Abstract: A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED includes an active layer including a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.

公开(公告)号：US20230402435A1

公开(公告)日：2023-12-14

申请号：US18234798

申请日：2023-08-16

Applicant: Samsung Electronics Co., Ltd

Inventor： Seogwoo HONG ,  Junsik Hwang ,  Kyungwook Hwang

IPC: H01L25/075 ,  H01L27/12 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L27/1214 ,  H01L33/50 ,  H01L33/62 ,  H01L2933/0066

Abstract: The present disclosure provides a micro-light-emitting diode display apparatus and a method of manufacturing the same. Provided is a micro-light-emitting diode (LED) display apparatus including a plurality of pixels, the micro-LED display apparatus including a driving circuit substrate, a first electrode provided on the driving circuit substrate, one or more microlight-emitting diodes (LEDs) provided on the first electrode, an insulating layer provided on the one or more micro-LEDs, a via pattern provided in the insulating layer, electrical contacts provided in the via pattern, and a second electrode provided on the electrical contacts, wherein the via pattern exposes a portion of the one or more micro-LEDs.

公开(公告)号：US20230395575A1

公开(公告)日：2023-12-07

申请号：US18236246

申请日：2023-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Sungwoo Hwang

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L24/08 ,  H01L24/80 ,  H01L33/0095 ,  H01L24/95 ,  H01L24/24 ,  H01L2224/8014 ,  H01L2224/08225 ,  H01L2924/12041 ,  H01L2224/80986 ,  H01L24/82 ,  H01L2224/245 ,  H01L2224/95102 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/9512 ,  H01L2224/95136 ,  H01L2924/10156 ,  H01L2933/0041

Abstract: A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED comprises an active layer comprising a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.

公开(公告)号：US11626530B2

公开(公告)日：2023-04-11

申请号：US17171636

申请日：2021-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang

IPC: H01L33/00 ,  H01L25/075

Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.

公开(公告)号：US20220173275A1

公开(公告)日：2022-06-02

申请号：US17531210

申请日：2021-11-19

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Kyungwook Hwang ,  Ho Won Jang ,  Junsik Hwang

IPC: H01L33/38 ,  H01L33/40 ,  H01L27/15 ,  H01L33/00

Abstract: An LED device includes a light emission layer including a first semiconductor layer including a first surface and a second surface facing the first surface, the second surface having an area larger than an area of the first surface, an active layer on the first surface, and a second semiconductor layer on the active layer, an insulating layer on the first surface, the insulating layer defining an open region of the first semiconductor layer, a first electrode that contacts the first semiconductor layer via the open region, and a second electrode on the second semiconductor layer and contacting the second semiconductor layer.

公开(公告)号：US11329187B2

公开(公告)日：2022-05-10

申请号：US16883363

申请日：2020-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Kyungwook Hwang ,  Jungel Ryu ,  Sungjin Kang ,  Jongmyeong Kim ,  Jehong Oh ,  Euijoon Yoon ,  Seungmin Lee ,  Junsik Hwang

IPC: H01L33/00 ,  H01L27/15

Abstract: A method of aligning micro LEDs and a method of manufacturing a micro LED display using the same are provided. The method of aligning micro LEDs includes providing micro LEDs, each having a first surface that has a first maximum width and a second surface opposite to the first surface and has a second maximum width that is greater than the first maximum width, providing a transfer substrate including a transfer mold that has an array of openings, each of the openings being configured to accommodate the first surface of a corresponding micro LED and not accommodate the second surface of the corresponding micro LED and aligning the micro LEDs in one direction in the openings of the transfer mold by inserting the micro LEDs into the openings of the transfer mold so that the first surface of each of the micro LEDs is positioned within a corresponding opening.

公开(公告)号：US11300827B2

公开(公告)日：2022-04-12

申请号：US17128609

申请日：2020-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Junsik Hwang

IPC: G02F1/1335 ,  G02F1/13357

Abstract: Provided is a backlight unit configured to emit light to a liquid crystal display device including a plurality of pixels, the backlight unit including a substrate including a driving circuit, and a light source array including a plurality of micro light-emitting elements provided on the substrate, wherein a number of micro light-emitting elements is equal to or greater than a number of the plurality of pixels.

公开(公告)号：US11251331B2

公开(公告)日：2022-02-15

申请号：US16666593

申请日：2019-10-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kiho Kong ,  Junhee Choi ,  Deukseok Chung ,  Junsik Hwang

IPC: H01L33/00 ,  G09G3/32 ,  H01L33/50 ,  H01L33/62

Abstract: Provided are a method of manufacturing a display apparatus and the display apparatus. The method includes forming an emissive layer and a driving layer on a first area of a substrate, forming an exposure line electrically connected to the driving layer, on a second area of the substrate, and forming a color conversion layer on the driving layer by emitting light from the emissive layer using the exposure line.