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公开(公告)号：US20220173275A1
公开(公告)日：2022-06-02
申请号：US17531210
申请日：2021-11-19
发明人： Kyungwook Hwang , Ho Won Jang , Junsik Hwang
摘要： An LED device includes a light emission layer including a first semiconductor layer including a first surface and a second surface facing the first surface, the second surface having an area larger than an area of the first surface, an active layer on the first surface, and a second semiconductor layer on the active layer, an insulating layer on the first surface, the insulating layer defining an open region of the first semiconductor layer, a first electrode that contacts the first semiconductor layer via the open region, and a second electrode on the second semiconductor layer and contacting the second semiconductor layer.
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2.发明授权公开(公告)号：US11329187B2
公开(公告)日：2022-05-10
申请号：US16883363
申请日：2020-05-26
发明人： Kyungwook Hwang , Jungel Ryu , Sungjin Kang , Jongmyeong Kim , Jehong Oh , Euijoon Yoon , Seungmin Lee , Junsik Hwang
摘要： A method of aligning micro LEDs and a method of manufacturing a micro LED display using the same are provided. The method of aligning micro LEDs includes providing micro LEDs, each having a first surface that has a first maximum width and a second surface opposite to the first surface and has a second maximum width that is greater than the first maximum width, providing a transfer substrate including a transfer mold that has an array of openings, each of the openings being configured to accommodate the first surface of a corresponding micro LED and not accommodate the second surface of the corresponding micro LED and aligning the micro LEDs in one direction in the openings of the transfer mold by inserting the micro LEDs into the openings of the transfer mold so that the first surface of each of the micro LEDs is positioned within a corresponding opening.
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3.发明公开公开(公告)号：US20230420604A1
公开(公告)日：2023-12-28
申请号：US18214808
申请日：2023-06-27
发明人： Dongho KIM , Howon Jang , Jehong OH , Kyungwook Hwang , Junsik Hwang
CPC分类号： H01L33/0093 , H01L33/007 , H01L33/62 , H01L33/16
摘要： Provided are a method of manufacturing a micro-LED and a method of manufacturing a display apparatus to which the method is applied. In the method of manufacturing a micro-LED, a membrane formed to include a cavity is formed on a substrate, and then, a sacrificial layer that may be selectively removed by wet etching is formed on the membrane. Next, a light-emitting device is formed on the sacrificial layer, and the light-emitting device is separated from the membrane by the wet etching. In an example, an undoped semiconductor layer may further be formed between the membrane and the sacrificial layer. The sacrificial layer may include an oxide layer having the same crystal lattice structure as that of the undoped semiconductor layer. In an example, another undoped semiconductor layer may further be formed between the sacrificial layer and the light-emitting device.
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公开(公告)号：US11888085B2
公开(公告)日：2024-01-30
申请号：US18180602
申请日：2023-03-08
发明人： Seogwoo Hong , Junsik Hwang , Hyunjoon Kim , Joonyong Park , Kyungwook Hwang
IPC分类号： H01L33/00 , H01L25/075
CPC分类号： H01L33/005 , H01L25/0753
摘要： A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.
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公开(公告)号：US20230261163A1
公开(公告)日：2023-08-17
申请号：US18138339
申请日：2023-04-24
发明人： Kyungwook HWANG , Junsik Hwang , Joonyong Park , Seogwoo Hong
CPC分类号： H01L33/62 , H01L25/167 , H01L33/0095 , H01L33/46 , H01L2933/0058 , H01L2933/0066
摘要： A display apparatus and a method of manufacturing the display method are provided. The display apparatus includes a transfer substrate, and micro display elements spaced apart from each other in units of sub-pixels on the transfer substrate, wherein each of the micro display elements includes a micro light emitting unit and a drive unit, wherein the drive unit includes drive electrodes and drives the micro light emitting unit.
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公开(公告)号：US20230231072A1
公开(公告)日：2023-07-20
申请号：US18180602
申请日：2023-03-08
发明人： Seogwoo HONG , Junsik Hwang , Hyunjoon Kim , Joonyong Park , Kyungwook Hwang
IPC分类号： H01L33/00 , H01L25/075
CPC分类号： H01L33/005 , H01L25/0753
摘要： A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.
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公开(公告)号：US20230084493A1
公开(公告)日：2023-03-16
申请号：US17990953
申请日：2022-11-21
发明人： Kyungwook Hwang , Junsik Hwang , Hyunjoon Kim , Joonyong Park , Seogwoo Hong
摘要： Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.
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公开(公告)号：US20220285188A1
公开(公告)日：2022-09-08
申请号：US17506154
申请日：2021-10-20
发明人： Hyunjoon KIM , Seogwoo Hong , Kyungwook Hwang , Junsik Hwang , Dongho Kim , Joonyong Park
IPC分类号： H01L21/673 , H01L33/20 , H01L33/62 , B65G47/90
摘要： Provided is a display transfer structure including a substrate including a plurality of wells, and a plurality of light emitting elements disposed in the plurality of wells, wherein the plurality of light emitting elements have a rotationally asymmetric planar shape, and wherein the plurality of wells respectively have a planar shape different from a planar shape of each of the plurality of light emitting elements.
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公开(公告)号：US12080585B2
公开(公告)日：2024-09-03
申请号：US18312641
申请日：2023-05-05
发明人： Kyungwook Hwang , Junsik Hwang
IPC分类号： H01L21/683 , H01L25/075 , H01L33/50 , H01L33/52 , H01L33/62
CPC分类号： H01L21/6835 , H01L25/0753 , H01L33/50 , H01L33/52 , H01L33/62 , H01L2221/68309 , H01L2221/68313 , H01L2221/68354 , H01L2221/68368 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.
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公开(公告)号：US11869880B2
公开(公告)日：2024-01-09
申请号：US17090077
申请日：2020-11-05
发明人： Kyungwook Hwang , Junsik Hwang , Sungwoo Hwang
IPC分类号： H01L25/075 , H01L23/00 , H01L33/00
CPC分类号： H01L25/0753 , H01L24/08 , H01L24/24 , H01L24/80 , H01L24/95 , H01L33/0095 , H01L24/82 , H01L2224/08225 , H01L2224/16225 , H01L2224/245 , H01L2224/24137 , H01L2224/8014 , H01L2224/80986 , H01L2224/9512 , H01L2224/95102 , H01L2224/95136 , H01L2924/10156 , H01L2924/12041 , H01L2933/0041 , H01L2224/245 , H01L2924/0549 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/00014
摘要： A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED includes an active layer including a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.
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