Abstract:
A semiconductor buffer structure may include a silicon substrate and a buffer layer that is formed on the silicon substrate. The buffer layer may include a first layer, a second layer formed on the first layer, and a third layer formed on the second layer. The first layer may include AlxInyGa1-x-yN (0≦x≦1, 0≦y≦1, 0≦x+y≦1) and have a lattice constant LP1 that is smaller than a lattice constant LP0 of the silicon substrate. The second layer may include AlxInyGa1-x-yN (0≦x
Abstract translation:半导体缓冲结构可以包括硅衬底和形成在硅衬底上的缓冲层。 缓冲层可以包括第一层,形成在第一层上的第二层和形成在第二层上的第三层。 第一层可以包括比硅衬底的晶格常数LP0小的晶格常数LP1的Al x In y Ga 1-x-y N(0&n 1; x&n 1; 1,0&amp; n 1; y&n 1 E; 1,0& 第二层可以包括Al x In y Ga 1-x-y N(0&nlE; x <1,0&lt; nlE; y <1,0&amp; nlE; x + y <1),并且具有大于晶格常数LP1并且小于晶格的晶格常数LP2 常数LP0。 第三层可以包括Al x In y Ga 1-x-y N(0&nlE; x <1,0&lt; nlE; y <1,0&amp; nlE; x + y <1),并且具有大于晶格常数LP1并且小于晶格的晶格常数LP3 常数LP2。
Abstract:
Example embodiments are directed to a light-emitting device including a patterned emitting unit and a method of manufacturing the light-emitting device. The light-emitting device includes a first electrode on a top of a semiconductor layer, and a second electrode on a bottom of the semiconductor layer, wherein the semiconductor layer is a pattern array formed of a plurality of stacks. A space between the plurality of stacks is filled with an insulating layer, and the first electrode is on the insulating layer.
Abstract:
A light emitting device may include a substrate, an n-type clad layer, an active layer, and a p-type clad layer. A concave-convex pattern having a plurality of grooves and a mesa between each of the plurality of grooves may be formed on the substrate, and a reflective layer may be formed on the surfaces of the plurality of grooves or the mesa between each of the plurality of grooves. Therefore, light generated in the active layer may be reflected by the reflective layer, and extracted to an external location.