公开(公告)号：US11670570B2

公开(公告)日：2023-06-06

申请号：US16870068

申请日：2020-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yusuf Cinar ,  Jaehong Park ,  Seongyun Baek ,  Hanhong Lee

IPC: H01L23/427 ,  H01L23/00 ,  H01L25/065 ,  H01L21/52 ,  H01L21/48

CPC classification number: H01L23/427 ,  H01L21/4871 ,  H01L21/52 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/32245 ,  H01L2924/1443

Abstract: An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

公开(公告)号：USD986900S1

公开(公告)日：2023-05-23

申请号：US29805770

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：US11495907B2

公开(公告)日：2022-11-08

申请号：US16822872

申请日：2020-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seon Gyun Baek ,  Jae Hong Park ,  Yusuf Cinar ,  Han Hong Lee

IPC: H01R13/50 ,  H01R13/405 ,  H01R13/6581 ,  H01R13/6585 ,  H01R13/6583 ,  H01R13/6587 ,  H01R24/60 ,  H01R13/6582

Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.

公开(公告)号：US09990964B1

公开(公告)日：2018-06-05

申请号：US15626574

申请日：2017-06-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangsu Lee ,  Yusuf Cinar ,  Nam-Hoon Kim ,  Heeyoub Kang ,  Young-Rok Oh

IPC: G11C7/04 ,  G11C11/406 ,  G11C13/00 ,  G11C16/10 ,  G11C16/34 ,  G11C11/16

CPC classification number: G11C7/04 ,  G06F13/00 ,  G11C7/1045 ,  G11C11/1673 ,  G11C11/1695 ,  G11C11/40626 ,  G11C13/0069 ,  G11C16/10 ,  G11C16/34 ,  G11C16/3418

Abstract: A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.

公开(公告)号：US12265432B2

公开(公告)日：2025-04-01

申请号：US18047126

申请日：2022-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hanhong Lee ,  Jaehong Park ,  Yusuf Cinar ,  Seongyun Baek

IPC: G06F1/18 ,  F21V17/10 ,  F21V33/00 ,  H05K5/02 ,  F21Y115/10

Abstract: The present disclosure relates to a portable solid-state drive (SSD) module. The portable SSD module includes a case, an SSD, a light-emitting device (LED) module and a main bracket. The case may have a window. The SSD may be arranged in the case. The LED module may be arranged in the case to indicate an operation of the SSD through the window. The main bracket may be arranged in the case to support the LED module. Therefore, the LED module may be readily and firmly combined with the case.

公开(公告)号：US11889643B2

公开(公告)日：2024-01-30

申请号：US17329900

申请日：2021-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han Hong Lee ,  Jae Hong Park ,  Seon Gyun Baek ,  Yusuf Cinar

IPC: H05K5/02 ,  H05K5/00

CPC classification number: H05K5/0221 ,  H05K5/0008 ,  H05K5/023

Abstract: An extension kit includes a case, a locking lever, and a first elastic member. The case has an interior space which extends in a first direction. The locking lever includes a lever portion which is rotatable about a first rotation axis extending in a second direction intersecting the first direction, a plate portion which extends from the lever portion and which is exposed at the case, an arm portion which extends in the second direction from the plate portion, and a first locking portion which protrudes from the arm portion. The first elastic member is provided in the interior space of the case and elastically connects the case and the locking lever in the interior space of the case.

公开(公告)号：US11800686B2

公开(公告)日：2023-10-24

申请号：US17659766

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchul Hur ,  Jaehong Park ,  Bumjun Kim ,  Yusuf Cinar ,  Hanhong Lee ,  Youngseok Hong ,  Doil Kong ,  Jaeheon Ma

IPC: H05K7/20 ,  G11B33/14 ,  H05K1/02

CPC classification number: H05K7/20436 ,  G11B33/1426 ,  H05K1/0201 ,  H05K1/0203 ,  H05K7/20163 ,  G11B33/142

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

公开(公告)号：US11792921B2

公开(公告)日：2023-10-17

申请号：US17898907

申请日：2022-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunki Yun ,  Kwangkyu Bang ,  Jihong Kim ,  Eunji Yu ,  Kyungjae Kim ,  Yusuf Cinar

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0268 ,  H05K1/112 ,  H05K1/141 ,  H05K1/184 ,  H05K2201/10159

Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

公开(公告)号：USD987640S1

公开(公告)日：2023-05-30

申请号：US29837307

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Han Hong Lee ,  Seon Gyun Baek

Abstract: FIG. 1 is a front perspective view of an extension kit for storage device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The evenly dashed broken lines in the figures depict features of the extension kit for storage device that form no part of the claimed design.

公开(公告)号：USD987639S1

公开(公告)日：2023-05-30

申请号：US29837289

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Han-Hong Lee ,  Seon-Gyun Baek

Abstract: FIG. 1 is a front perspective view of an extension kit for storage device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The evenly dashed broken lines in the figures depict features of the extension kit for storage device form no part of the claimed design.