Polymer compositions and methods
    12.
    发明授权
    Polymer compositions and methods 有权
    聚合物组合物和方法

    公开(公告)号:US08952104B2

    公开(公告)日:2015-02-10

    申请号:US13977059

    申请日:2012-01-06

    申请人: Scott D. Allen

    发明人: Scott D. Allen

    CPC分类号: C08G64/42 C08G64/0216

    摘要: The present disclosure describes polymer compositions comprising aliphatic polycarbonate chains containing epoxy functional groups. In certain embodiments, the aliphatic polycarbonate chains comprise epoxy functional groups capable of participating in epoxide ring-opening reactions. In certain embodiments, the invention encompasses composites formed by the reaction of nucleophilic reagents and epoxide functional groups, wherein the epoxide functional groups are located on aliphatic polycarbonate chains.

    摘要翻译: 本公开描述了包含含有环氧官能团的脂族聚碳酸酯链的聚合物组合物 在某些实施方案中,脂族聚碳酸酯链包含能够参与环氧化物开环反应的环氧官能团。 在某些实施方案中,本发明包括通过亲核试剂和环氧官能团的反应形成的复合物,其中环氧官能团位于脂族聚碳酸酯链上。

    SUCCINIC ANHYDRIDE FROM ETHYLENE OXIDE
    14.
    发明申请
    SUCCINIC ANHYDRIDE FROM ETHYLENE OXIDE 有权
    来自乙烯氧化物的SUCCINIC ANHYDRIDE

    公开(公告)号:US20130165670A1

    公开(公告)日:2013-06-27

    申请号:US13819969

    申请日:2011-08-25

    IPC分类号: C07D307/60

    摘要: Continuous flow systems and methods produce succinic anhydride by a double carbonylation of ethylene oxide with carbon monoxide and at least one catalyst. In some embodiments, the double carbonylation occurs using a single catalyst. In other embodiments, a first catalyst is used to promote the first carbonylation, and a second catalyst different from the first catalyst is used to promote the second carbonylation. The succinic anhydride is isolated from the product stream by crystallization and the catalyst is recycled to the reaction stream.

    摘要翻译: 连续流动系统和方法通过环氧乙烷与一氧化碳和至少一种催化剂的双羰基化产生琥珀酸酐。 在一些实施方案中,使用单一催化剂进行双羰基化。 在其它实施方案中,使用第一催化剂促进第一羰基化,并且使用不同于第一催化剂的第二催化剂来促进第二羰基化。 琥珀酸酐通过结晶从产物流中分离,催化剂再循环到反应流中。

    Opening hard mask and SOI substrate in single process chamber
    17.
    发明授权
    Opening hard mask and SOI substrate in single process chamber 失效
    在单处理室中打开硬掩模和SOI衬底

    公开(公告)号:US07560387B2

    公开(公告)日:2009-07-14

    申请号:US11275707

    申请日:2006-01-25

    IPC分类号: H01L21/311

    CPC分类号: H01L21/3081 H01L21/31116

    摘要: Methods for opening a hard mask and a silicon-on-insulator substrate in a single process chamber are disclosed. In one embodiment, the method includes patterning a photoresist over a stack including an anti-reflective coating (ARC) layer, a silicon dioxide (SiO2) based hard mask layer, a silicon nitride pad layer, a silicon dioxide (SiO2) pad layer and the SOI substrate, wherein the SOI substrate includes a silicon-on-insulator layer and a buried silicon dioxide (SiO2) layer; and in a single process chamber: opening the ARC layer; etching the silicon dioxide (SiO2) based hard mask layer; etching the silicon nitride pad layer; etching the silicon dioxide (SiO2) pad layer; and etching the SOI substrate. Etching all layers in a single chamber reduces the turn-around-time, lowers the process cost, facilitates process control and/or improve a trench profile.

    摘要翻译: 公开了在单个处理室中打开硬掩模和绝缘体上硅衬底的方法。 在一个实施例中,该方法包括在包括抗反射涂层(ARC)层,基于二氧化硅(SiO 2)的硬掩模层,氮化硅衬垫层,二氧化硅(SiO 2)衬垫层和叠层 SOI衬底,其中所述SOI衬底包括绝缘体上硅层和掩埋二氧化硅(SiO 2)层; 并在单个处理室中:打开ARC层; 蚀刻基于二氧化硅(SiO 2)的硬掩模层; 蚀刻氮化硅焊盘层; 蚀刻二氧化硅(SiO 2)垫层; 并蚀刻SOI衬底。 在单个室中蚀刻所有层减少了周转时间,降低了工艺成本,便于工艺控制和/或改善沟槽轮廓。