摘要:
A solid-state image sensing device having an enhanced sensitivity to a short wavelength comprises an optical substrate for passing a predetermined light therethrough, a semiconductor substrate supported on the optical substrate and a plurality of electrodes formed on an insulating layer overlying the semiconductor substrate, in which a light corresponding to an object is incident from the optical substrate side.
摘要:
An electronic device includes an electronic control unit, a wire, and a wiring-side connector. When a movable member is arranged in a first arrangement relative to a wiring-side connector main body, the movable member is in a position where the movable member does not prevent the wire from projecting from the main body to extend straight in a counter-fitting direction. When the movable member rotates from the first arrangement to a second arrangement relative to the main body, a restricting member approaches a portion of the main body from which the wire projects, to press and bend the wire, so a direction in which the wire projects from the main body is limited to a direction crossing the counter-fitting direction. When the movable member is arranged in the second arrangement and the main body is fitted to an ECU-side connector, the second arrangement is maintained.
摘要:
An image pickup device has a signal processing part configured to perform signal process for the first to third color signals. The signal processing part includes a first color generator configured to generate a fourth color signal corresponding to a reference pixel based on a ratio between a second color signal at a pixel located in vicinity of the reference pixel and a first color signal at a pixel located in vicinity of the reference pixel, a second color generator configured to generate a fifth color signal corresponding to the reference pixel based on a ratio between a third color signal at a pixel located in vicinity of the reference pixel and the first color signal at a pixel located in vicinity of the reference pixel, and a image quality converter configured to generate color signals by performing a predetermined image process based on the first to fifth color signals.
摘要:
An electronic device includes an electronic control unit, a wire, and a wiring-side connector. When a movable member is arranged in a first arrangement relative to a wiring-side connector main body, the movable member is in a position where the movable member does not prevent the wire from projecting from the main body to extend straight in a counter-fitting direction. When the movable member rotates from the first arrangement to a second arrangement relative to the main body, a restricting member approaches a portion of the main body from which the wire projects, to press and bend the wire, so a direction in which the wire projects from the main body is limited to a direction crossing the counter-fitting direction. When the movable member is arranged in the second arrangement and the main body is fitted to an ECU-side connector, the second arrangement is maintained.
摘要:
The present invention provides such a structure that a male-type terminal which in inserted to a female-type terminal to come in contact therewith comprises a resistor on at least a tip portion of a resistor and that at the time of insertion to the female-type terminal, a switching is made from the resistor to the conductor portion and, at the time of detachment from the female-type terminal, switching is made from the conductor portion to the resistor.
摘要:
A color imaging device includes a solid state image sensor formed with a plurality of picture elements in a two dimensional array. A color filter array has filter portions in one-to-one correspondence with the picture elements. The filter portions are formed as lenses to provide a focusing effect. These lenses can include cyan focusing color filter portions, yellow focusing color filter portions, and full-color light-transmitting focusing color filter portions. All of these filter portions focus incident light using a lens effect onto respective elements on the solid state image sensor. In one embodiment, protective layers are located between filter parts. Other embodiments use tannic acid in their formation. In this way, inaccuracies in color signal separation are minimized.
摘要:
A color filter array is provided on the surface of the device comprising a pattern of color filter elements corresponding to the pattern of photosensors. The color filter array has a plurality of separate filter elements arranged in horizontal and vertical rows, some of which are white (W) some of which are yellow (Ye), some of which are green (G) and the remaining elements are cyan (Cy), each of the elements corresponding to a respective photosensor. The horizontal rows of filter elements comprise a first horizontal row consisting of white and green elements alternately arranged, a second horizontal row consisting of yellow and cyan elements alternately arranged and positioned adjacent the first row, and each of the white filter elements of the first horizontal row are arranged in the same vertical row with a yellow filter element of the second horizontal row.
摘要:
In a solid-state image pick-up device having a plurality of image pick-up portions horizontally arranged, each containing a plurality of photodiodes vertically arranged, the image pick-up portions are arranged alternately at long and short intervals, overflow drains are provided on each short interval each commonly for two image pick-up portions, two transfer portions are provided on each long interval, one end of each transfer portion is connected to a line transfer portion, and the output terminal of the line transfer portion is connected to an interpolation circuit with delay lines.
摘要:
Provided is a bending rigid printed wiring board which facilitate the mounting of electric parts (realization of a high producibility and high assemblability substrate circuit) and enables spaces to be saved and which can be easily manufactured.That is, provided is a bending rigid printed wiring board, which is characterized in that a heat resistant resin layer is laminated on a front surface of a hard core material provided so as to contain a gap portion and also on a top surface of the gap portion, in that a heat resistant resin layer is laminated on a rear surface of the core material except the gap portion, in that a conductor layer is laminated and firmly fixed via the heat resistant resin layers and in that the conductor layer is etched, whereby a circuit is formed.
摘要:
The present invention provides a method for polishing the surface of the transparent substrate layer of a color filter unit comprising a transparent substrate layer, a color filter layer, a protective film layer and a transparent electrode layer, which method comprises attaching, to the surface of the transparent electrode layer, a pressure-sensitive tape consisting of a base film layer and a pressure-sensitive adhesive layer giving substantially no staining to said surface of the transparent electrode layer, formed on one surface of the base film layer, as well as a pressure-sensitive tape used in the method. When the surface of the transparent substrate layer is polished according to the present method, there occurs no breakage of the color filter unit. Further, there occurs no staining of the surface of the transparent electrode layer owing to the adhesion of residual pressure-sensitive adhesive, abrasive, polishing refuse, etc. Consequently, a color filter unit giving a good image clearness can be obtained at high productivity.