公开(公告)号：US20120024582A1

公开(公告)日：2012-02-02

申请号：US13195290

申请日：2011-08-01

申请人： Shinnosuke MAEDA ,  Satoshi HIRANO

发明人： Shinnosuke MAEDA ,  Satoshi HIRANO

IPC分类号： H05K1/00

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/4015 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/10977 ,  H05K2201/2009 ,  H05K2203/041 ,  H01L2924/00

摘要： A multilayer wiring substrate includes a laminate structure in which resin insulation layers and conductor layers are alternately laminated. The resin insulation layers include first-type resin insulation layers, and second-type resin insulation layers, each of which contains an inorganic material in a larger amount and is smaller in thermal expansion coefficient as compared with first-type resin insulation layers. On a cross section of the laminate structure taken along a thickness direction thereof, the ratio of a total thickness of the second-type resin insulation layers located in an area A2 to a thickness corresponding to the area A2 is greater than the ratio of a total thickness of the second-type resin insulation layers located in an area A1 to a thickness corresponding to the area A1. The laminate structure is warped such that the laminate structure is convex toward the side where the second main face is present.

摘要翻译： 多层布线基板包括层叠结构，其中树脂绝缘层和导体层交替层叠。 树脂绝缘层包括第一类树脂绝缘层和第二类树脂绝缘层，其中第二类树脂绝缘层与第一类型树脂绝缘层相比，其中含有大量的无机材料并且热膨胀系数较小。 在沿其厚度方向截取的层叠结构的横截面上，位于A2区域中的第二类树脂绝缘层的总厚度与对应于区域A2的厚度的比率大于总共 位于区域A1中的第二类型树脂绝缘层的厚度为对应于区域A1的厚度。 层压结构翘曲，使得层压结构向第二主面存在的一侧凸出。

公开(公告)号：US20110284269A1

公开(公告)日：2011-11-24

申请号：US13109521

申请日：2011-05-17

申请人： Shinnosuke MAEDA ,  Satoshi HIRANO

发明人： Shinnosuke MAEDA ,  Satoshi HIRANO

IPC分类号： H05K1/09

CPC分类号： H05K1/113 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/4682 ,  H05K2201/09472

摘要： To provide a multilayer wiring substrate which can prevent migration of copper between wiring traces to thereby realize a higher degree of integration, a solder resist layer 25 having a plurality of openings 35, 36 is disposed on a top surface 31 side, and IC-chip connection terminals 41 and capacitor connection terminals 42 are buried in an outermost resin insulation layer 23 in contact with the solder resist layer 25. Each of the IC-chip connection terminals 41 and the capacitor connection terminals 42 is composed of a copper layer 44 and a plating layer 46 covering the outer surface of the copper layer 44. A conductor layer 26 present at the interface between the solder resist layer 25 and the resin insulation layer 23 is composed of a copper layer 27 and a nickel plating layer 28 covering the outer surface of the copper layer 27.

摘要翻译： 为了提供能够防止布线迹线之间的铜迁移从而实现更高的集成度的多层布线基板，具有多个开口部35,36的阻焊层25设置在顶面31侧，IC芯片 连接端子41和电容器连接端子42埋在与阻焊层25接触的最外层树脂绝缘层23中。每个IC芯片连接端子41和电容器连接端子42由铜层44和 镀覆层46覆盖铜层44的外表面。存在于阻焊层25和树脂绝缘层23之间的界面处的导体层26由铜层27和覆盖外表面的镀镍层28构成 的铜层27。

公开(公告)号：US20130253810A1

公开(公告)日：2013-09-26

申请号：US13789044

申请日：2013-03-07

申请人： Takayuki MIYAJIMA ,  Satoshi HIRANO ,  Kiyokazu OKADA

发明人： Takayuki MIYAJIMA ,  Satoshi HIRANO ,  Kiyokazu OKADA

IPC分类号： G08G1/00

CPC分类号： G08G1/00 ,  G08G1/0112 ,  G08G1/0133

摘要： Devices, methods, and programs determine whether a vehicle has exited a link based on map information. If so, the devices, methods, and programs acquire a travel traffic congestion level of the exited link based on travel information within the exited link, and determine whether the travel traffic congestion level of the exited link coincides with a distributed traffic congestion level at a time when the vehicle exited. If not, the devices, methods, and programs determine whether the traffic information has been updated and the distributed traffic congestion level has been changed within the exited link, and if so, acquire a distribution time rate of each distributed traffic congestion level within the exited link. The devices, methods, and programs determine a traffic congestion level of the exited link based on the distribution time rate of each acquired distributed traffic congestion level and the travel traffic congestion level of the exited link.

摘要翻译： 设备，方法和程序确定车辆是否已经基于地图信息退出链接。 如果是这样，设备，方法和程序基于退出的链路中的旅行信息获取退出的链路的旅行交通拥堵级别，并且确定退出链路的旅行业务拥塞级别是否与 车辆退出时间。 如果不是，设备，方法和程序确定流量信息是否已经被更新，并且分配的流量拥塞水平已经在退出的链路内被改变，并且如果是，则获取退出的每个分布的流量拥塞级别的分配时间速率 链接。 设备，方法和程序基于每个获取的分布式业务拥塞级别的分布时间速率和退出链路的旅行业务拥塞级别来确定退出链路的业务拥塞级别。

公开(公告)号：US20090152328A1

公开(公告)日：2009-06-18

申请号：US12389602

申请日：2009-02-20

申请人： Kazutaka OKAMOTO ,  Seung Hwan PARK ,  Satoshi HIRANO

发明人： Kazutaka OKAMOTO ,  Seung Hwan PARK ,  Satoshi HIRANO

IPC分类号： B23K20/12

CPC分类号： B23K20/126 ,  B23K20/128 ,  B23K20/14 ,  B23K2101/003 ,  B23K2103/10

摘要： An apparatus for a friction stir and a friction stir processing of the present invention suppress an occurrence of a surface defect in an area processed by the friction stir. The apparatus for the friction stir includes a tool having a columnar tip-side part, a rotating unit for rotating the tool on a central axis, a first pressing unit for pressing a tip of the tool rotated by the rotating unit against a work, a jig having a tool insertion hole into which the tip-side part of the tool is inserted so that the tip-side part of the tool is encircled around the jig, a second pressing unit for slidably pressing the jig against the work, and a press control unit for controlling the first pressing unit so that the tip-side part of the tool is gradually pulled out of the work by the first pressing unit while moving the tool and the jig relative to the work, in a state that the tool is rotated by the rotating unit and the tip of the tool has been sunk into the work to a predetermined depth by the first pressing unit.

摘要翻译： 本发明的摩擦搅拌装置和摩擦搅拌处理抑制了摩擦搅拌加工区域的表面缺陷的发生。 用于摩擦搅拌的装置包括具有柱状末端侧部分的工具，用于在中心轴线上旋转工具的旋转单元，用于将由旋转单元旋转的工具的尖端压靠在工件上的第一按压单元， 夹具具有工具插入孔，工具的前端部分插入该工具插入孔中，使得工具的末端侧部分围绕夹具环绕;第二按压单元，用于可滑动地将夹具压靠在工件上;压力机 控制单元，用于控制第一按压单元，使得在工具旋转的状态下，通过第一按压单元在工具和夹具相对于工件移动的同时使工具的尖端侧部分逐渐拉出工件 通过旋转单元，工具的尖端已经通过第一按压单元沉入工作到预定深度。

公开(公告)号：US20070163120A1

公开(公告)日：2007-07-19

申请号：US11693431

申请日：2007-03-29

申请人： Kazutaka OKAMOTO ,  Masayuki DOI ,  Hisanori OKAMURA ,  Yasuhisa AONO ,  Manabu KAGAWA ,  Satoshi HIRANO ,  Kinya AOTA

发明人： Kazutaka OKAMOTO ,  Masayuki DOI ,  Hisanori OKAMURA ,  Yasuhisa AONO ,  Manabu KAGAWA ,  Satoshi HIRANO ,  Kinya AOTA

IPC分类号： B23P15/26

CPC分类号： B23K20/1235 ,  B23K20/122 ,  B23P15/26 ,  C23C14/3407 ,  F28F3/12 ,  H01J37/34 ,  H01J37/3497 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49391 ,  Y10T29/49393

摘要： The present invention is a cooling plate including a groove, which becomes a passage of a coolant, inside a body, wherein one or more fins are provided inside the groove, wherein the groove is covered with a lid having width larger than the groove, wherein the lid is joined to the body by friction stir welding, and wherein a weld bead formed by: the joining is outside the passage, and the weld bead formed by the joining is formed within the body and further, is characterized by a manufacturing method of a cooling plate that has a first groove, which becomes a passage of a coolant, and a second groove, which has width larger than the first groove and receives a lid on the first groove, inside a body, receives the lid on the second groove, and is joined to the body, the manufacturing method of a cooling plate wherein, while the lid and the body are joined together by the friction stir welding owing to insertion of a-rotation tool having a shoulder and a pin, the joining is performed so that a weld bead formed by the joining may become out of the passage, and furthermore, is characterized in that a target for sputtering is joined to the cooling plate.

摘要翻译： 本发明是一种冷却板，其包括在主体内形成冷却剂通道的槽，其中在槽内设置一个或多个散热片，其中，所述槽被宽度大于所述槽的盖覆盖，其中 通过摩擦搅拌焊接将盖接合到主体，并且其中通过以下方式形成的焊道：通过接合在通道外部，并且通过接合形成的焊道在主体内形成，并且其特征还在于， 具有成为冷却剂通道的第一槽的冷却板和在第一槽内具有宽度大于第一槽并且在第一槽上容纳盖的第二槽，在第二槽中容纳盖 并且连接到主体，冷却板的制造方法，其中，通过由于具有肩部和销的旋转工具的插入而通过摩擦搅拌焊接将盖和主体接合在一起时，进行接合 所以t 通过接合形成的焊道可能会脱离通道，此外，其特征在于，溅射靶与冷却板接合。

公开(公告)号：US20130240607A1

公开(公告)日：2013-09-19

申请号：US13783018

申请日：2013-03-01

申请人： Seunghwan PARK ,  Satoshi HIRANO ,  Shinya IMANO ,  Jun SATO ,  Hiroyuki KOKAWA ,  Yutaka SATO ,  Kiyohito ISHIDA ,  Toshihiro OMORI

发明人： Seunghwan PARK ,  Satoshi HIRANO ,  Shinya IMANO ,  Jun SATO ,  Hiroyuki KOKAWA ,  Yutaka SATO ,  Kiyohito ISHIDA ,  Toshihiro OMORI

IPC分类号： B23K20/12

CPC分类号： B23K20/1245 ,  B23K20/1255 ,  B23K35/22 ,  C22C19/07 ,  C22F1/10

摘要： A friction stir tool excellent in productivity, high temperature strength, and wear resistance at high temperatures. The friction stir tool is formed of a Co-based alloy comprising crystal grains containing a γ′ precipitate phase dispersed and precipitated therein, and a crystal grain boundary region and a precipitate phase between adjacent crystal grains, in which the precipitate phase is at least one phase selected from a μ phase, a Laves phase and a carbide phase.

摘要翻译： 摩擦搅拌工具，在高温下的生产率，耐高温性和耐磨性优异。 摩擦搅拌工具由包含其中分散和沉淀的γ'析出相的晶粒和相邻晶粒之间的晶界区域和析出相的Co基合金形成，其中析出相是至少一个 相位选自μ相，Laves相和碳化物相。