Method of manufacturing a semiconductor device
    14.
    发明授权
    Method of manufacturing a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07393723B2

    公开(公告)日:2008-07-01

    申请号:US10793909

    申请日:2004-03-08

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a semiconductor device that forms laminate layers includes the steps of reducing contamination containing the single bond of carbon on at least one part of a surface on which the laminate films are formed by activated hydrogen before the laminate films are formed, and forming the laminate films on the surface on which the laminate films are formed.

    摘要翻译: 一种形成层叠层的半导体器件的制造方法包括以下步骤:在层压膜形成之前,通过活性氢在其上形成层压膜的表面的至少一部分上减少含有单键碳的污染物,并形成 在其上形成层压膜的表面上的层压膜。

    Insulating film and method of producing semiconductor device
    18.
    发明授权
    Insulating film and method of producing semiconductor device 失效
    绝缘膜及半导体器件的制造方法

    公开(公告)号:US07465679B1

    公开(公告)日:2008-12-16

    申请号:US09466828

    申请日:1999-12-20

    IPC分类号: H01L21/31 H01L21/469

    摘要: A silicon oxide film is formed to cover an island non-monocrystalline silicon region by plasma CVD using an organic silane having ethoxy groups (e.g., TEOS) and oxygen as raw materials, while hydrogen chloride or a chlorine-containing hydrocarbon (e.g., trichloroethylene) of a fluorine-containing gas is added to the plasma CVD atmosphere, preferably in an amount of from 0.01 to 1 mol % of the atmosphere so as to reduce the alkali elements from the silicon oxide film formed and to improve the reliability of the film. Prior to forming the silicon oxide film, the silicon region may be treated in a plasma atmosphere containing oxygen and hydrogen chloride or a chlorine-containing hydrocarbon. The silicon oxide film is obtained at low temperatures and this has high reliability usable as a gate-insulating film in a semiconductor device.

    摘要翻译: 通过使用具有乙氧基(例如TEOS)和氧作为原料的有机硅烷通过等离子体CVD覆盖岛状非单晶硅区域,同时使用氯化氢或含氯烃(例如三氯乙烯) 的含氟气体添加到等离子体CVD气氛中,优选为0.01〜1摩尔%的气氛,以减少形成的氧化硅膜的碱元素,提高膜的可靠性。 在形成氧化硅膜之前,可以在含有氧和氯化氢或含氯烃的等离子体气氛中处理硅区域。 在低温下得到氧化硅膜,在半导体器件中作为栅极绝缘膜具有高的可靠性。

    Method of manufacturing a semiconductor device
    20.
    发明授权
    Method of manufacturing a semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US06228751B1

    公开(公告)日:2001-05-08

    申请号:US08706667

    申请日:1996-09-06

    IPC分类号: H01L27108

    摘要: A method of manufacturing a semiconductor device that forms laminate layers includes the steps of reducing contamination containing the single bond of carbon on at least one part of a surface on which the laminate films are formed by activated hydrogen before the laminate films are formed, and forming the laminate films on the surface on which the laminate films are formed.

    摘要翻译: 一种形成层叠层的半导体器件的制造方法包括以下步骤:在层压膜形成之前,通过活性氢在其上形成层压膜的表面的至少一部分上减少含有单键碳的污染物,并形成 在其上形成层压膜的表面上的层压膜。