Insulating film formed using an organic silane and method of producing
semiconductor device
    8.
    发明授权
    Insulating film formed using an organic silane and method of producing semiconductor device 有权
    使用有机硅烷形成的绝缘膜和制造半导体器件的方法

    公开(公告)号:US6025630A

    公开(公告)日:2000-02-15

    申请号:US190828

    申请日:1998-11-12

    摘要: A silicon oxide film is formed to cover an island non-monocrystalline silicon region by plasma CVD using an organic silane having ethoxy groups (e.g., TEOS) and oxygen as raw materials, while hydrogen chloride or a chlorine-containing hydrocarbon (e.g., trichloroethylene) of a fluorine-containing gas is added to the plasma CVD atmosphere, preferably in an amount of from 0.01 to 1 mol % of the atmosphere so as to reduce the alkali elements from the silicon oxide film formed and to improve the reliability of the film. Prior to forming the silicon oxide film, the silicon region may be treated in a plasma atmosphere containing oxygen and hydrogen chloride or a chlorine-containing hydrocarbon. The silicon oxide film is obtained at low temperatures and this has high reliability usable as a gate-insulating film in a semiconductor device.

    摘要翻译: 通过使用具有乙氧基(例如TEOS)和氧作为原料的有机硅烷等离子体CVD,形成氧化硅膜以覆盖岛状非单晶硅区域,而氯化氢或含氯烃(例如三氯乙烯) 的含氟气体添加到等离子体CVD气氛中,优选为0.01〜1摩尔%的气氛,以减少形成的氧化硅膜的碱元素,提高膜的可靠性。 在形成氧化硅膜之前,可以在含有氧和氯化氢或含氯烃的等离子体气氛中处理硅区域。 在低温下得到氧化硅膜,在半导体器件中作为栅极绝缘膜具有高的可靠性。