公开(公告)号：US11017866B2

公开(公告)日：2021-05-25

申请号：US16803401

申请日：2020-02-27

Applicant: Silicon Storage Technology, Inc.

Inventor： Viktor Markov ,  Alexander Kotov

IPC: G11C16/24 ,  G11C16/26 ,  G11C16/16 ,  H01L27/11529 ,  H01L27/11524

Abstract: A method of improving stability of a memory device having a controller configured to program each of a plurality of non-volatile memory cells within a range of programming states bounded by a minimum program state and a maximum program state. The method includes testing the memory cells to confirm the memory cells are operational, programming each of the memory cells to a mid-program state, and baking the memory device at a high temperature while the memory cells are programmed to the mid-program state. Each memory cell has a first threshold voltage when programmed in the minimum program state, a second threshold voltage when programmed in the maximum program state, and a third threshold voltage when programmed in the mid-program state. The third threshold voltage is substantially at a mid-point between the first and second threshold voltages, and corresponds to a substantially logarithmic mid-point of read currents.

公开(公告)号：US10714489B2

公开(公告)日：2020-07-14

申请号：US16209515

申请日：2018-12-04

Applicant: Silicon Storage Technology, Inc.

Inventor： Yuri Tkachev ,  Alexander Kotov ,  Nhan Do

IPC: H01L29/788 ,  H01L27/11521 ,  G11C16/04

Abstract: A memory device with a memory cell and control circuitry. The memory cell includes source and drain regions formed in a semiconductor substrate, with a channel region extending there between. A floating gate is disposed over a first portion of the channel region for controlling its conductivity. A select gate is disposed over a second portion of the channel region for controlling its conductivity. A control gate is disposed over the floating gate. An erase gate is disposed over the source region and adjacent to the floating gate. The control circuitry is configured to perform a program operation by applying a negative voltage to the erase gate for causing electrons to tunnel from the erase gate to the floating gate, and perform an erase operation by applying a positive voltage to the erase gate for causing electrons to tunnel from the floating gate to the erase gate.

公开(公告)号：US10079061B2

公开(公告)日：2018-09-18

申请号：US15084955

申请日：2016-03-30

Applicant: Silicon Storage Technology, Inc.

Inventor： Xiaozhou Qian ,  Viktor Markov ,  Jong-Won Yoo ,  Xiao Yan Pi ,  Alexander Kotov

IPC: G11C11/34 ,  G11C16/12 ,  G11C16/04 ,  G11C16/10

CPC classification number: G11C16/12 ,  G11C16/0425 ,  G11C16/10

Abstract: The disclosed embodiments comprise a flash memory device and a method of programming the device in a way that reduces degradation of the device compared to prior art methods.

公开(公告)号：US09431126B2

公开(公告)日：2016-08-30

申请号：US14214097

申请日：2014-03-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Xian Liu ,  James Cheng ,  Dmitry Bavinov ,  Alexander Kotov ,  Jong-Won Yoo

IPC: G11C16/04 ,  G11C16/34 ,  G11C16/12 ,  G11C11/56 ,  G11C16/10

CPC classification number: G11C16/3486 ,  G11C11/5628 ,  G11C11/5642 ,  G11C16/0441 ,  G11C16/10 ,  G11C16/12 ,  G11C16/3459

Abstract: A non-volatile memory device and method for programming cells using repeated pulses of program voltages, with interleaved read operations to determine the level of read current, until the desired programming state is achieved. Each successive program pulse has one or more program voltages increased by a step value relative to the previous pulse. For a single level cell type, each cell is individually removed from the programming pulses after reaching a first read current threshold, and the step value is increased for one or more kicker pulses thereafter. For a multi-level cell type, the step value drops after one of the cells reaches a first read current threshold, some cells are individually removed from the programming pulses after reaching a second read current threshold while others are individually removed from the programming pulses after reaching a third read current threshold.

Abstract translation: 一种用于使用编程电压的重复脉冲编程单元的非易失性存储器件和方法，具有交错读取操作以确定读取电流的电平，直到达到期望的编程状态。 每个连续的编程脉冲具有相对于先前脉冲增加阶跃值的一个或多个编程电压。 对于单级单元类型，在达到第一读取电流阈值之后，每个单元从编程脉冲中单独地移除，并且此后的一个或多个猝发脉冲的步长值增加。 对于多级单元类型，步长值在其中一个单元达到第一读取电流阈值后下降，一些单元在达到第二读取电流阈值之后单独地从编程脉冲中移除，而其他单元在编程脉冲之后被单独从编程脉冲中移除 达到第三个读取电流阈值。

公开(公告)号：US20210065817A1

公开(公告)日：2021-03-04

申请号：US16803401

申请日：2020-02-27

Applicant: Silicon Storage Technology, Inc.

Inventor： Viktor Markov ,  Alexander Kotov

IPC: G11C16/26 ,  H01L27/11524 ,  H01L27/11529 ,  G11C16/16

Abstract: A method of improving stability of a memory device having a controller configured to program each of a plurality of non-volatile memory cells within a range of programming states bounded by a minimum program state and a maximum program state. The method includes testing the memory cells to confirm the memory cells are operational, programming each of the memory cells to a mid-program state, and baking the memory device at a high temperature while the memory cells are programmed to the mid-program state. Each memory cell has a first threshold voltage when programmed in the minimum program state, a second threshold voltage when programmed in the maximum program state, and a third threshold voltage when programmed in the mid-program state. The third threshold voltage is substantially at a mid-point between the first and second threshold voltages, and corresponds to a substantially logarithmic mid-point of read currents.

公开(公告)号：US20200066738A1

公开(公告)日：2020-02-27

申请号：US16209515

申请日：2018-12-04

Applicant: Silicon Storage Technology, Inc.

Inventor： Yuri Tkachev ,  Alexander Kotov ,  Nhan Do

IPC: H01L27/11521 ,  H01L29/788 ,  G11C16/04

Abstract: A memory device with a memory cell and control circuitry. The memory cell includes source and drain regions formed in a semiconductor substrate, with a channel region extending there between. A floating gate is disposed over a first portion of the channel region for controlling its conductivity. A select gate is disposed over a second portion of the channel region for controlling its conductivity. A control gate is disposed over the floating gate. An erase gate is disposed over the source region and adjacent to the floating gate. The control circuitry is configured to perform a program operation by applying a negative voltage to the erase gate for causing electrons to tunnel from the erase gate to the floating gate, and perform an erase operation by applying a positive voltage to the erase gate for causing electrons to tunnel from the floating gate to the erase gate.

公开(公告)号：US09293217B2

公开(公告)日：2016-03-22

申请号：US14214097

申请日：2014-03-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Xian Liu ,  James Cheng ,  Dmitry Bavinov ,  Alexander Kotov ,  Jong-Won Yoo

IPC: G11C16/04 ,  G11C16/34 ,  G11C16/12 ,  G11C11/56 ,  G11C16/10

Abstract: A non-volatile memory device and method for programming cells using repeated pulses of program voltages, with interleaved read operations to determine the level of read current, until the desired programming state is achieved. Each successive program pulse has one or more program voltages increased by a step value relative to the previous pulse. For a single level cell type, each cell is individually removed from the programming pulses after reaching a first read current threshold, and the step value is increased for one or more kicker pulses thereafter. For a multi-level cell type, the step value drops after one of the cells reaches a first read current threshold, some cells are individually removed from the programming pulses after reaching a second read current threshold while others are individually removed from the programming pulses after reaching a third read current threshold.

公开(公告)号：US20200065023A1

公开(公告)日：2020-02-27

申请号：US16217916

申请日：2018-12-12

Applicant: Silicon Storage Technology, Inc.

Inventor： Viktor Markov ,  Alexander Kotov

IPC: G06F3/06

Abstract: A memory device with memory cells each including source and drain regions with a channel region there between, a floating gate over a first channel region portion, a select gate over a second channel region portion, a control gate over the floating gate, and an erase gate over the source region. Control circuitry is configured to, for one of the memory cells, apply a first pulse of programming voltages that includes a first voltage applied to the control gate, perform a read operation that includes detecting currents through the channel region for different control gate voltages to determine a target control gate voltage using the detected currents that corresponds to a target current through the channel region, and apply a second pulse of programming voltages that includes a second voltage applied to the control gate that is determined from the first voltage, a nominal read voltage and the target voltage.

公开(公告)号：US09275748B2

公开(公告)日：2016-03-01

申请号：US14190010

申请日：2014-02-25

Applicant: Silicon Storage Technology, Inc.

Inventor： Nhan Do ,  Steven Malcolm Lemke ,  Jinho Kim ,  Jong-Won Yoo ,  Alexander Kotov ,  Yuri Tkachev

IPC: G11C16/26 ,  G11C16/14 ,  G11C16/04 ,  H01L21/28 ,  H01L29/788 ,  H01L27/115 ,  H01L29/423

CPC classification number: G11C16/26 ,  G11C16/0408 ,  G11C16/0425 ,  G11C16/0433 ,  G11C16/10 ,  G11C16/14 ,  H01L21/28273 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/42328 ,  H01L29/7881

Abstract: A method of reading a memory device having rows and columns of memory cells formed on a substrate, where each memory cell includes spaced apart first and second regions with a channel region therebetween, a floating gate disposed over a first portion of the channel region, a select gate disposed over a second portion of the channel region, a control gate disposed over the floating gate, and an erase gate disposed over the first region. The method includes placing a small positive voltage on the unselected source lines, and/or a small negative voltage on the unselected word lines, during the read operation to suppress sub-threshold leakage and thereby improve read performance.

Abstract translation: 一种读取存储器件的方法，所述存储器件具有形成在衬底上的存储器单元的行和列，其中每个存储器单元包括间隔开的第一和第二区域，其间具有通道区域;布置在沟道区域的第一部分上的浮置栅极， 设置在通道区域的第二部分上的选择栅极，设置在浮置栅极上的控制栅极以及设置在第一区域上的擦除栅极。 该方法包括在读取操作期间在未选择的源极线上放置小的正电压和/或在未选择的字线上施加小的负电压以抑制亚阈值泄漏，从而提高读取性能。

公开(公告)号：US09123822B2

公开(公告)日：2015-09-01

申请号：US13958483

申请日：2013-08-02

Applicant: Silicon Storage Technology, Inc.

Inventor： Jong-Won Yoo ,  Alexander Kotov ,  Yuri Tkachev ,  Chien-Sheng Su

IPC: H01L29/788 ,  H01L29/66 ,  H01L21/28 ,  H01L29/423 ,  H01L27/115

CPC classification number: H01L29/788 ,  H01L21/28273 ,  H01L27/11521 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7881 ,  H01L29/7883

Abstract: A non-volatile memory cell includes a substrate of a first conductivity type with first and second spaced apart regions of a second conductivity type, forming a channel region therebetween. A select gate is insulated from and disposed over a first portion of the channel region which is adjacent to the first region. A floating gate is insulated from and disposed over a second portion of the channel region which is adjacent the second region. Metal material is formed in contact with the floating gate. A control gate is insulated from and disposed over the floating gate. An erase gate includes a first portion insulated from and disposed over the second region and is insulated from and disposed laterally adjacent to the floating gate, and a second portion insulated from and laterally adjacent to the control gate and partially extends over and vertically overlaps the floating gate.

Abstract translation: 非易失性存储单元包括具有第一和第二间隔开的第二导电类型的第一导电类型的衬底，在它们之间形成沟道区。 选择栅极与与第一区域相邻的沟道区域的第一部分绝缘并布置在其上。 浮动栅极与邻近第二区域的沟道区域的第二部分绝缘并布置在其上。 金属材料形成为与浮动栅极接触。 控制栅极与浮动栅极绝缘并设置在浮动栅极上。 擦除栅极包括与第二区域绝缘并且布置在第二区域上的第一部分，并且与浮动栅极绝缘并横向邻近设置，以及与控制栅极绝缘并横向邻近控制栅极的第二部分，并且部分地延伸越过浮动 门。