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公开(公告)号：US09627748B2
公开(公告)日：2017-04-18
申请号：US14151184
申请日：2014-01-09
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Chih-Hsien Chiu , Heng-Cheng Chu , Cheng-Yu Chiang
CPC classification number: H01Q9/0421 , H01Q1/38 , H01Q1/40
Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.
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公开(公告)号：US09502758B2
公开(公告)日：2016-11-22
申请号：US14146163
申请日：2014-01-02
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Hsin-Lung Chung , Hao-Ju Fang , Chih-Hsien Chiu , Yude Chu , Tsung-Hsien Tsai
CPC classification number: H01Q1/40 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/19107 , H01Q9/42 , H01Q23/00 , H01L2924/00014
Abstract: An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.
Abstract translation: 公开了一种电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 形成在所述基板上并封装所述电子元件的密封剂; 以及嵌入所述密封剂中而不与所述基板接触并从所述密封剂的表面露出的天线体。 由于天线体不设置在基板上，所以可以减小基板的表面积，以满足电子封装的小型化要求。
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公开(公告)号：US20160172762A1
公开(公告)日：2016-06-16
申请号：US14695469
申请日：2015-04-24
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chi-Liang Shih
Abstract: An electronic module is provided, which includes: a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body. A portion of the antenna body is exposed from the encapsulant. As such, the invention increases the arrangement area of the antenna body without increasing the size of the substrate, and also reduces the height of the encapsulant. Therefore, the electronic module of the present invention meets the miniaturization requirement.
Abstract translation: 提供了一种电子模块，其包括：基板; 设置在所述基板上的天线体; 以及形成在衬底上并封装天线体的密封剂。 天线体的一部分从密封剂暴露出来。 因此，本发明增加了天线体的布置面积，而不增加基板的尺寸，并且还降低了密封剂的高度。 因此，本发明的电子模块满足小型化要求。
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公开(公告)号：US09337250B2
公开(公告)日：2016-05-10
申请号：US14087554
申请日：2013-11-22
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Tsung-Hsien Tsai , Heng-Cheng Chu , Chien-Cheng Lin , Chih-Hsien Chiu , Hsin-Lung Chung , Yude Chu
CPC classification number: H01L23/66 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/64 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/16 , H01L25/50 , H01L28/00 , H01L2223/6661 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.
Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括：具有多个导电焊盘的衬底和围绕形成在其表面上的导电焊盘的多个焊盘; 安装在导电焊盘上的多个无源器件; 绝缘层，其形成在所述表面上并且具有嵌入其中的无源器件的一部分; 安装在所述绝缘层的顶表面上的半导体芯片; 电连接半导体芯片和接合焊盘的多个接合线; 形成在基板的表面上以封装绝缘层，接合线和半导体芯片的密封剂，其中投射到基板上的半导体芯片的区域覆盖无源器件中最外面的一个的一部分。 因此，无源器件的安装密度提高。
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公开(公告)号：US12211776B2
公开(公告)日：2025-01-28
申请号：US17574944
申请日：2022-01-13
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chih-Hsien Chiu , Ko-Wei Chang , Wen-Jung Tsai , Che-Wei Yu , Chia-Yang Chen
IPC: H01L23/552 , H01L21/48 , H01L23/00 , H01L23/31 , H01L23/498 , H01L25/00 , H01L25/065
Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.
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Patent Agency Ranking
公开(公告)号：US20230027120A1
公开(公告)日：2023-01-26
申请号：US17411322
申请日：2021-08-25
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Shao-Tzu Tang , Wen-Jung Tsai , Chih-Hsien Chiu , Ko-Wei Chang , Yu-Wei Yeh , Yu-Cheng Pai , Chuan-Yi Pan , Chi-Rui Wu
IPC: H01Q1/22 , H01L23/552
Abstract: An electronic package is provided, in which a carrier structure provided with electronic components is disposed onto an antenna structure, where a stepped portion is formed at an edge of the antenna structure, so that a shielding body is arranged along a surface of the stepped portion. Therefore, the shielding body only covers a part of the surface of the antenna structure to prevent the shielding body from interfering with operation of the antenna structure.
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公开(公告)号：US20220375822A1
公开(公告)日：2022-11-24
申请号：US17379289
申请日：2021-07-19
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chih-Hsien Chiu , Siang-Yu Lin , Wen-Jung Tsai , Chia-Yang Chen , Chien-Cheng Lin
IPC: H01L23/42 , H01L23/31 , H01L23/367 , H01L23/16 , H01L21/56
Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.
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公开(公告)号：US11195808B2
公开(公告)日：2021-12-07
申请号：US16878250
申请日：2020-05-19
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chih-Hsien Chiu , Wen-Jung Tsai
IPC: H01L23/66 , H01L21/56 , H01L23/552 , H01L23/498 , H01L23/31 , H01L23/00
Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.
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公开(公告)号：US20210320073A1
公开(公告)日：2021-10-14
申请号：US16878250
申请日：2020-05-19
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chih-Hsien Chiu , Wen-Jung Tsai
IPC: H01L23/66 , H01L23/498 , H01L23/31 , H01L23/552 , H01L21/56
Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.
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公开(公告)号：US10811378B2
公开(公告)日：2020-10-20
申请号：US16533751
申请日：2019-08-06
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu
Abstract: An electronic package is provided. An electronic component and a plurality of conductive pillars electrically connected with the electronic component are embedded in an encapsulating layer. Each of the conductive pillars has a circumferential surface and two end surfaces wider than the circumferential surface in width. The encapsulating layer encapsulates and protects the electronic component effectively, so as to improve the reliability of the electronic package. A method for fabricating the electronic package is also provided.
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