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公开(公告)号：US20210305148A1
公开(公告)日：2021-09-30
申请号：US16868038
申请日：2020-05-06
发明人： Cho-Hsin Chang , Hao-Ju Fang , Ting-Wei Chi , Te-Fang Chu
IPC分类号： H01L23/498 , H01L21/48
摘要： A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.
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公开(公告)号：US09502758B2
公开(公告)日：2016-11-22
申请号：US14146163
申请日：2014-01-02
发明人： Hsin-Lung Chung , Hao-Ju Fang , Chih-Hsien Chiu , Yude Chu , Tsung-Hsien Tsai
CPC分类号： H01Q1/40 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/19107 , H01Q9/42 , H01Q23/00 , H01L2924/00014
摘要： An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.
摘要翻译： 公开了一种电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 形成在所述基板上并封装所述电子元件的密封剂; 以及嵌入所述密封剂中而不与所述基板接触并从所述密封剂的表面露出的天线体。 由于天线体不设置在基板上，所以可以减小基板的表面积，以满足电子封装的小型化要求。
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公开(公告)号：US20150366085A1
公开(公告)日：2015-12-17
申请号：US14564180
申请日：2014-12-09
发明人： Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Hao-Ju Fang , Kuang-Neng Chung
CPC分类号： H05K1/111 , H01L21/565 , H01L23/3128 , H01L23/58 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00014
摘要： A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.
摘要翻译： 提供了一种封装结构，其包括：具有相对的第一和第二表面的基板; 至少设置在所述基板的第一表面上的电子元件; 以及形成在所述基板的所述第一表面上以封装所述电子元件的密封剂。 密封剂具有非矩形形状，以减少密封剂中的无效空间。
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公开(公告)号：US20150145747A1
公开(公告)日：2015-05-28
申请号：US14146163
申请日：2014-01-02
发明人： Hsin-Lung Chung , Hao-Ju Fang , Chih-Hsien Chiu , Yude Chu , Tsung-Hsien Tsai
CPC分类号： H01Q1/40 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/19107 , H01Q9/42 , H01Q23/00 , H01L2924/00014
摘要： An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.
摘要翻译： 公开了一种电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 形成在所述基板上并封装所述电子元件的密封剂; 以及嵌入所述密封剂中而不与所述基板接触并从所述密封剂的表面露出的天线体。 由于天线体不设置在基板上，所以可以减小基板的表面积，以满足电子封装的小型化要求。
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公开(公告)号：US20170236787A1
公开(公告)日：2017-08-17
申请号：US15584281
申请日：2017-05-02
发明人： Chih-Hsien Chiu , Hao-Ju Fang , Hsin-Lung Chung , Cho-Hsin Chang , Tsung-Hsien Tsai , Chia-Yang Chen , Chun-Chi Ke
IPC分类号： H01L23/552 , H01L23/00 , H01L21/48 , H01L25/065 , H01L21/78 , H01L23/16 , H01L23/31 , H01L21/56 , H01L21/54
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/54 , H01L21/561 , H01L21/563 , H01L21/78 , H01L23/16 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.
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公开(公告)号：US09673151B2
公开(公告)日：2017-06-06
申请号：US14837604
申请日：2015-08-27
发明人： Chih-Hsien Chiu , Hao-Ju Fang , Hsin-Lung Chung , Cho-Hsin Chang , Tsung-Hsien Tsai , Chia-Yang Chen , Chun-Chi Ke
IPC分类号： H01L23/552 , H01L21/48 , H01L21/54 , H01L21/56 , H01L21/78 , H01L23/16 , H01L23/31 , H01L25/065 , H01L23/498
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/54 , H01L21/561 , H01L21/563 , H01L21/78 , H01L23/16 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.
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公开(公告)号：US09526171B2
公开(公告)日：2016-12-20
申请号：US14564180
申请日：2014-12-09
发明人： Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Hao-Ju Fang , Kuang-Neng Chung
CPC分类号： H05K1/111 , H01L21/565 , H01L23/3128 , H01L23/58 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00014
摘要： A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.
摘要翻译： 提供了一种封装结构，其包括：具有相对的第一和第二表面的基板; 至少设置在所述基板的第一表面上的电子元件; 以及形成在所述基板的所述第一表面上以封装所述电子元件的密封剂。 密封剂具有非矩形形状，以减少密封剂中的无效空间。
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公开(公告)号：US11527472B2
公开(公告)日：2022-12-13
申请号：US16868038
申请日：2020-05-06
发明人： Cho-Hsin Chang , Hao-Ju Fang , Ting-Wei Chi , Te-Fang Chu
IPC分类号： H01L23/498 , H01L21/48
摘要： A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.
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公开(公告)号：US10074613B2
公开(公告)日：2018-09-11
申请号：US15584281
申请日：2017-05-02
发明人： Chih-Hsien Chiu , Hao-Ju Fang , Hsin-Lung Chung , Cho-Hsin Chang , Tsung-Hsien Tsai , Chia-Yang Chen , Chun-Chi Ke
IPC分类号： H01L23/552 , H01L21/48 , H01L21/54 , H01L21/56 , H01L21/78 , H01L23/16 , H01L23/31 , H01L25/065 , H01L23/00 , H01L23/498
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/54 , H01L21/561 , H01L21/563 , H01L21/78 , H01L23/16 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00012 , H01L2224/45099 , H01L2224/85
摘要： A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.
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公开(公告)号：US20160093576A1
公开(公告)日：2016-03-31
申请号：US14837604
申请日：2015-08-27
发明人： Chih-Hsien Chiu , Hao-Ju Fang , Hsin-Lung Chung , Cho-Hsin Chang , Tsung-Hsien Tsai , Chia-Yang Chen , Chun-Chi Ke
IPC分类号： H01L23/552 , H01L23/31 , H01L21/54 , H01L21/48 , H01L21/56 , H01L21/78 , H01L23/498 , H01L23/16
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/54 , H01L21/561 , H01L21/563 , H01L21/78 , H01L23/16 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.
摘要翻译： 提供一种半导体封装，包括：具有相对的第一和第二表面的衬底; 设置在第一表面上并电连接到第一表面的多个半导体部件; 密封剂，其封装所述第一表面和所述半导体部件，并且具有将所述基板分隔成多个封装单元的至少一个第一凹槽，所述多个封装单元具有至少一个所述半导体部件; 以及金属层，形成在所述基板和所述密封剂上并且封装所述封装单元的周边，其中所述第二表面从所述金属层露出，其中所述金属层沿着所述第一凹槽的壁表面形成，以形成第二凹槽 对应于第一凹槽的位置并且具有金属表面。 因此，封装单元被隔离并且形成包括金属层和空气层的多层隔离结构，并且彼此电磁屏蔽。
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