公开(公告)号：US20200328142A1

公开(公告)日：2020-10-15

申请号：US16538286

申请日：2019-08-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Don-Son Jiang ,  Nai-Hao Kao ,  Chih-Sheng Lin ,  Szu-Hsien Chen ,  Chih-Yuan Shih ,  Chia-Cheng Chen ,  Yu-Cheng Pai ,  Hsuan-Hao Mi

IPC: H01L23/498 ,  H01L23/14 ,  H01L23/367 ,  H01L23/00 ,  H01L21/48

Abstract: A package stack structure and a method for fabricating the same are provided. An electronic component is disposed on the topmost one of a plurality of organic material substrates, and no chip is disposed on the remaining organic material substrates. A predefined layer number of circuit layers are disposed in the organic material substrates, and distributes the thermal stress via the organic material substrates. Therefore, the bottommost one of the organic material substrates will not be separated from a circuit board due to CTE mismatch. Also a carrier component is provided.

公开(公告)号：US20180090835A1

公开(公告)日：2018-03-29

申请号：US15596113

申请日：2017-05-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q1/48 ,  H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66

CPC classification number: H01Q1/526 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/42 ,  H01L2924/00014

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US20170330826A1

公开(公告)日：2017-11-16

申请号：US15666005

申请日：2017-08-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ching-Wen Chiang ,  Hsin-Chih Wang ,  Chih-Yuan Shih ,  Shih-Ching Chen

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L21/306 ,  H01L21/304

CPC classification number: H01L23/49827 ,  H01L21/304 ,  H01L21/306 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49833 ,  H01L2224/16225

Abstract: A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.