公开(公告)号：US20170231095A1

公开(公告)日：2017-08-10

申请号：US15163045

申请日：2016-05-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H05K1/18

CPC classification number: H05K1/185 ,  G06K19/07777 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/1815 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/207 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09118 ,  H05K2201/10098 ,  H05K2203/1327 ,  H01L2924/00014

Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.

公开(公告)号：US11223117B2

公开(公告)日：2022-01-11

申请号：US16044154

申请日：2018-07-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Kuan-Ta Chen ,  Chia-Chu Lai ,  Ying-Wei Lu

IPC: H01Q1/52 ,  H01Q1/38 ,  H01Q1/40 ,  H01L23/552 ,  H01L23/31 ,  H01L23/66

Abstract: An electronic package includes: a carrier structure; a first electronic component disposed on the carrier structure; a first insulating layer formed on the carrier structure; a first antenna structure coupled to the first insulating layer and electrically connected to the first electronic component; and a second antenna structure embedded in the carrier structure. As such, the electronic package provides more antenna functions within a limited space so as to improve the signal quality and transmission rate of electronic products. An electronic device having the electronic package is also provided. The electronic device is applicable to an electronic product having an antenna function.

公开(公告)号：US10823776B2

公开(公告)日：2020-11-03

申请号：US16408389

申请日：2019-05-09

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Cheng-Tsai Hsieh ,  Kuan-Ta Chen ,  Ying-Wei Lu

IPC: G01R29/10 ,  H04B17/29 ,  H01Q3/26 ,  H04B17/10

Abstract: A testing fixture used in an antenna testing process is provided. A cover unit having a second antenna portion is arranged on a base unit configured for an electronic structure having a first antenna portion to be placed thereon. The cover unit includes a non-metal interposing portion configured for pressing the electronic structure to separate the second antenna portion from the first antenna portion. Therefore, when the antenna testing process is performed on the electronic structure, a metal shielding effect is avoided, and an over the air testing environment is provided.

公开(公告)号：US10659097B1

公开(公告)日：2020-05-19

申请号：US16534634

申请日：2019-08-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Kuan-Ta Chen ,  Ying-Wei Lu ,  Chia-Chu Lai ,  Cheng-Tsai Hsieh

IPC: H04B17/00 ,  H04B1/48 ,  H04B1/04 ,  G01S13/32 ,  G01S13/40 ,  H04B1/7085

Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.

公开(公告)号：US20190139913A1

公开(公告)日：2019-05-09

申请号：US15969199

申请日：2018-05-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Siang Fang ,  Kuan-Ta Chen ,  Ying-Wei Lu

IPC: H01L23/66 ,  H01Q9/04 ,  H01Q1/38 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an antenna substrate on a package structure through a plurality of conductive elements. The antenna substrate has an antenna layer and the package structure has an electronic component. As such, an antenna length can be designed according to the requirement of antenna operation, without increasing the area of the package structure.

公开(公告)号：US20170181287A1

公开(公告)日：2017-06-22

申请号：US15064016

申请日：2016-03-08

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jyun-Yuan Jhang ,  Ming-Fan Tsai ,  Ho-Chuan Lin ,  Ying-Wei Lu ,  Guang-Hwa Ma

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/185 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/552 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01Q1/2283 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q9/0407 ,  H05K1/0216 ,  H05K1/115 ,  H05K2201/0723 ,  H05K2201/09209

Abstract: An electronic package is provided, which includes a substrate and an antenna board structure disposed on the substrate. The antenna board structure has a first portion, a second portion and a partition portion between the first portion and the second portion. As such, current can be split into two paths so as to spread electromagnetic radiation, and thus produce electromagnetic radiation with a high bandwidth.