公开(公告)号：US20170181287A1

公开(公告)日：2017-06-22

申请号：US15064016

申请日：2016-03-08

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jyun-Yuan Jhang ,  Ming-Fan Tsai ,  Ho-Chuan Lin ,  Ying-Wei Lu ,  Guang-Hwa Ma

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/185 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/552 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01Q1/2283 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q9/0407 ,  H05K1/0216 ,  H05K1/115 ,  H05K2201/0723 ,  H05K2201/09209

Abstract: An electronic package is provided, which includes a substrate and an antenna board structure disposed on the substrate. The antenna board structure has a first portion, a second portion and a partition portion between the first portion and the second portion. As such, current can be split into two paths so as to spread electromagnetic radiation, and thus produce electromagnetic radiation with a high bandwidth.

公开(公告)号：US10199317B2

公开(公告)日：2019-02-05

申请号：US15083421

申请日：2016-03-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H01L23/498 ,  H01L23/66 ,  H01Q9/06 ,  H01Q19/10 ,  H01Q23/00 ,  H01Q1/24

Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.

公开(公告)号：US09999132B2

公开(公告)日：2018-06-12

申请号：US15163045

申请日：2016-05-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H05K1/18 ,  G06K19/077 ,  H01L25/00 ,  H05K1/16 ,  H05K3/00 ,  H05K3/10 ,  H05K3/20 ,  H05K3/46

CPC classification number: H05K1/185 ,  G06K19/07777 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/1815 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/207 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09118 ,  H05K2201/10098 ,  H05K2203/1327 ,  H01L2924/00014

Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.

公开(公告)号：US20170201023A1

公开(公告)日：2017-07-13

申请号：US15083421

申请日：2016-03-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H01Q9/04 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/24 ,  H01Q1/48

CPC classification number: H01L23/49838 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01Q1/243 ,  H01Q9/065 ,  H01Q19/104 ,  H01Q23/00

Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.

公开(公告)号：US20170231095A1

公开(公告)日：2017-08-10

申请号：US15163045

申请日：2016-05-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H05K1/18

CPC classification number: H05K1/185 ,  G06K19/07777 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/1815 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/207 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09118 ,  H05K2201/10098 ,  H05K2203/1327 ,  H01L2924/00014

Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.

公开(公告)号：US20160300660A1

公开(公告)日：2016-10-13

申请号：US14718126

申请日：2015-05-21

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chi-Pin Tsai ,  Ming-Fan Tsai ,  Jyun-Yuan Jhang ,  Chi-Liang Shih

IPC: H01F27/28 ,  H01F27/02

CPC classification number: H01F27/022 ,  H01F17/062 ,  H01F2027/2814 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device is provided, which includes: a magnetically conductive element having at least a through hole; a conductor structure formed on the magnetically conductive element and in the through hole; and a base body encapsulating the magnetically conductive element and the conductor structure, thereby allowing the electronic device to generate a higher magnetic flux and thus cause an increase in inductance.

Abstract translation: 提供一种电子器件，其包括：具有至少一个通孔的导磁元件; 形成在所述导磁元件和所述通孔中的导体结构; 以及基体，其密封导电元件和导体结构，从而允许电子器件产生较高的磁通量，从而引起电感的增加。