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公开(公告)号：US20150043172A1
公开(公告)日：2015-02-12
申请号：US14103601
申请日：2013-12-11
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Eiji MUGIYA , Kenzo KITAZAKI , Masaya SHIMAMURA , Tetsuo SAJI , Hiroshi NAKAMURA
CPC classification number: H05K1/0218 , H01L2224/16225 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2924/19105 , H05K1/0215 , H05K1/0216 , H05K3/284 , H05K3/303 , H05K9/0024 , H05K9/0045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09145 , H05K2201/0919 , H05K2201/09972 , H05K2201/1056 , H05K2203/108 , Y10T29/4913 , H01L2924/00012
Abstract: There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section.
Abstract translation: 提供一种电路模块及其制造方法，可以防止电路基板的层间布线受到激光照射的损害，并且屏蔽层可靠地电连接到电路基板的表面导体。 电路基板包括安装部件，密封体和屏蔽件。 电路基板是形成有层间配线的多层基板，具有设置有表面导体的安装面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有包括到达表面导体的第一沟槽部分和没有到达表面导体的第二沟槽部分的沟槽。 屏蔽件具有外屏蔽部分和内屏蔽部分。
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公开(公告)号：US20140293550A1
公开(公告)日：2014-10-02
申请号：US14148240
申请日：2014-01-06
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Eiji MUGIYA , Masaya SHIMAMURA , Kenzo KITAZAKI , Takehiko KAI
CPC classification number: H01L23/28 , H01L21/561 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/97 , H01L2924/12042 , H01L2924/1461 , H01L2924/15192 , H01L2924/1531 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K1/095 , H05K3/0052 , H05K3/284 , H05K3/285 , H05K2203/1316 , H01L2224/81 , H01L2224/83 , H01L2224/85 , H01L2924/00
Abstract: A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove portion formed along a boundary between the first and second areas; a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield portion provided in the groove portion; and a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens a connection area of the wiring portion with the second shield portion.
Abstract translation: 电路模块包括：布线基板，包括具有第一和第二区域的安装表面和在安装表面的另一侧上的端子表面; 安装在所述第一和第二区域上的多个电子部件; 覆盖所述多个电子部件的密封层由绝缘材料形成，并且包括沿着所述第一和第二区域之间的边界形成的槽部; 导电屏蔽，其包括覆盖所述密封层的外表面的第一屏蔽部分和设置在所述凹槽部分中的第二屏蔽部分; 以及导电层，其包括设置在所述安装面上并且电连接所述端子表面和所述第二屏蔽部分的布线部分，以及增厚部分，其设置在所述布线部分中并且部分地使所述布线部分的连接区域与 第二屏蔽部分。
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公开(公告)号：US20180286817A1
公开(公告)日：2018-10-04
申请号：US15935829
申请日：2018-03-26
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Kenzo KITAZAKI , Takehiko KAI , Masaya SHIMAMURA , Mikio AOKI , Jin MIKATA , Taiji ITO
IPC: H01L23/552 , H01L23/66 , H01L21/56 , H01L21/78
Abstract: Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.
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公开(公告)号：US20180159217A1
公开(公告)日：2018-06-07
申请号：US15828191
申请日：2017-11-30
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Jin MIKATA , Masaya SHIMAMURA , Mikio AOKI , Takehiko KAI , Taiji ITO
Abstract: A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.
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Patent Agency Ranking
公开(公告)号：US20160095267A1
公开(公告)日：2016-03-31
申请号：US14861867
申请日：2015-09-22
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Kenzo KITAZAKI , Eiji MUGIYA , Masaya SHIMAMURA
CPC classification number: H05K1/0216 , H01L2224/16225 , H01L2924/181 , H05K3/0052 , H05K3/284 , H05K9/0024 , H05K2201/0715 , H01L2924/00012
Abstract: A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.
Abstract translation: 一种电路模块，包括：具有安装在其上的电子部件并且还具有限定电子部件安装的相应屏蔽区域的导电图案的基板; 覆盖所述基板和所述电子部件的密封层，所述密封层沿着所述导电图案形成在其中; 以及导电屏蔽，包括：覆盖所述密封层的顶表面的第一屏蔽部分; 覆盖所述密封层的侧面的第二遮蔽部; 以及填充所述密封层中的凹槽的第三屏蔽部分，其中所述凹槽成形为使得所述第三屏蔽部分的至少一端连接到所述第二屏蔽部分，所述第三屏蔽部分用作屏蔽壁， 并且所述第三屏蔽部分的至少一端的宽度比所述第三屏蔽部分的其它部分宽。
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公开(公告)号：US20150070851A1
公开(公告)日：2015-03-12
申请号：US14090534
申请日：2013-11-26
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Kenzo KITAZAKI , Masaya SHIMAMURA , Eiji MUGIYA , Takehiko KAI
CPC classification number: H05K9/0015 , H01L21/561 , H01L23/295 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/83851 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/1461 , H01L2924/15159 , H01L2924/15192 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K3/301 , Y10T29/49146 , H01L2924/00 , H01L2224/83 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
Abstract translation: 电路模块包括具有安装表面，导体图案和绝缘保护层的布线基板，安装表面具有第一和第二区域，导体图案沿安装表面上的第一和第二区域之间的边界形成， 绝缘保护层形成在安装表面上，绝缘保护层覆盖安装表面和导体图案; 安装在所述第一和第二区域上的多个电子部件; 绝缘密封层，其具有沟槽，所述绝缘密封层覆盖所述多个电子部件，所述沟槽具有使得所述沟槽穿过所述保护层以达到所述导电图案的表面的深度; 以及具有第一和第二屏蔽部分的导电屏蔽，所述第一屏蔽部分覆盖所述密封层的外表面，所述第二屏蔽部分电连接到所述导体图案。
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公开(公告)号：US20150070849A1
公开(公告)日：2015-03-12
申请号：US14090445
申请日：2013-11-26
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Masaya SHIMAMURA , Takehiko KAI , Eiji MUGIYA , Tetsuo SAJI , Hiroshi NAKAMURA
IPC: H05K1/02
CPC classification number: H05K1/0216 , H01L21/561 , H01L23/3135 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/0215 , H05K1/0269 , H05K3/284 , H05K5/065 , H05K9/0037 , H05K9/0083 , H05K2201/09036 , H05K2201/09145 , H05K2201/09972 , H05K2201/1056 , H01L2224/81 , H01L2924/00 , H01L2924/00012
Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.
Abstract translation: 提供一种电路模块，包括具有安装表面的电路基板; 安装在安装表面上的安装部件; 所述密封体形成在所述安装表面上，所述密封体覆盖所述安装部件，并且具有从所述密封体的主表面到所述安装表面形成的沟槽; 以及屏蔽体，其具有形成在所述沟槽内的内屏蔽部和覆盖所述密封体和所述内屏蔽部的外屏蔽部，所述外屏蔽部具有形成在所述屏蔽体的主表面上的平坦面的第一部， 形成在所述内屏蔽部上并从所述第一部分突出或下垂的第二部分。
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公开(公告)号：US20150043170A1
公开(公告)日：2015-02-12
申请号：US14086407
申请日：2013-11-21
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Masaya SHIMAMURA , Kenzo KITAZAKI , Yutaka NAGAI , Hiroshi NAKAMURA , Tetsuo SAJI , Eiji MUGIYA
CPC classification number: H05K9/00 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/1531 , H01L2924/181 , H01L2924/19105 , H05K1/0218 , H05K1/0271 , H05K1/186 , H05K3/0052 , H05K3/284 , H05K3/301 , H05K2201/0715 , Y10T29/4913 , H01L2224/81 , H01L2924/00
Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.
Abstract translation: 电路模块包括基板，安装部件，密封体，沟槽和屏蔽件。 基板具有安装表面。 安装部件安装在安装表面上。 密封体具有主表面和外周面，密封体密封安装部件，主表面将安装部件夹在主表面和安装表面之间，外周表面覆盖安装部件在安装表面上。 沟槽具有凹槽状形状，沟槽从密封体的主表面凹入到安装表面，沟槽形成为在沟槽和外周表面之间留出空间。 屏蔽覆盖密封体的主表面和外周表面，屏蔽件被填充在沟槽中。
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公开(公告)号：US20130271928A1
公开(公告)日：2013-10-17
申请号：US13849364
申请日：2013-03-22
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Masaya SHIMAMURA , Eiji MUGIYA
CPC classification number: H05K9/0084 , H01L23/552 , H01L24/97 , H01L2924/12042 , H01L2924/1461 , H01L2924/15192 , H01L2924/351 , H05K1/0218 , H05K3/284 , H05K5/0095 , H05K9/0037 , H05K13/00 , H05K2201/09972 , H05K2201/10371 , Y10T29/49146 , H01L2924/00
Abstract: A circuit module pertaining to an embodiment of the present invention has a board, multiple electronic components, a shield member, sealing layer, and cover layer. The board has a mounting surface that includes a first area and second area in which the multiple electronic components are mounted. The shield member is constituted by conductive material and placed between the first area and second area on the mounting surface. The sealing layer has on its top surface a groove having its bottom face including an upper end face of the shield member, is formed on the mounting surface, and is constituted by an insulator that covers the multiple electronic components. The cover layer is constituted by conductive material and has a first cover part that fills the groove as well as a second cover part that covers the first cover part and sealing layer.
Abstract translation: 关于本发明的实施例的电路模块具有板，多个电子部件，屏蔽部件，密封层和覆盖层。 该电路板具有安装表面，该安装表面包括安装多个电子部件的第一区域和第二区域。 屏蔽构件由导电材料构成，并被放置在安装表面上的第一区域和第二区域之间。 密封层在其顶面上具有包括屏蔽部件的上端面的底面的槽，形成在安装面上，由覆盖多个电子部件的绝缘体构成。 覆盖层由导电材料构成，并且具有填充槽的第一盖部以及覆盖第一盖部和密封层的第二盖部。
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