Abstract:
A probe, including a first input configured to receive a first input signal, a second input configured to receive a second input signal, a first cable connected to the first input, a second cable connected to the second input, an electronically adjustable delay connected to the first cable, the electronically adjustable delay configured to delay the first input signal to remove a skew between the first input signal and the second input signal, and an amplifier configured to receive the first input signal from the electronically adjustable delay and a second input signal.
Abstract:
A circuit includes a load; a first differential pair coupled to the load and responsive to input data; a second differential pair coupled to the load and responsive to the input data; a third differential pair coupled to the first differential pair and the second differential pair and responsive to a first control signal and a second control signal; a bias circuit configured to pull a node coupled to both the first differential pair and the second differential pair to a predetermined state; and a current source coupled to the third differential pair and the bias circuit.
Abstract:
A de-embed probe including an input configured to connect to a device under test, a memory, a signal generator connected to the input, the signal generator configured to generate a test signal, and a controller connected to the signal generator and configured to control the signal generator. The de-embed probe may be used in a test and measurement system. The test and measurement system also includes a test and measurement instrument including a processor connected to the controller of the de-embed probe, the processor configured to provide instructions to the controller, and a test and measurement input to receive an output from the de-embed probe.
Abstract:
A test and measurement instrument including a splitter configured to split an input signal having a particular bandwidth into a plurality of split signals, each split signal including substantially the entire bandwidth of the input signal; a plurality of harmonic mixers, each harmonic mixer configured to mix an associated split signal of the plurality of split signals with an associated harmonic signal to generate an associated mixed signal; and a plurality of digitizers, each digitizer configured to digitize a mixed signal of an associated harmonic mixer of the plurality of harmonic mixers. A first-order harmonic of at least one harmonic signal associated with the harmonic mixers is different from an effective sample rate of at least one of the digitizers.
Abstract:
A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.
Abstract:
A test and measurement system includes a device under test (DUT) interface structured to couple to at least one DUT and a measurement instrument coupled to the interface. The instrument includes one or more processors configured to, when testing the DUT, accept a measurement signal at a first input channel and generate a first sample waveform from the measurement signal using a first set of parameters, accept the measurement signal at a second input channel and generate a second sample from the measurement signal using a second set of parameters, and generate a measurement waveform from a combination of the first sample waveform and the second sample waveform. Additionally, the measurement instrument is structured to determine settling errors in the first pulse of a double-pulse test, and then compensate measurements made in subsequent pulses for the settling errors.
Abstract:
A current measurement device with a shunt resistor of a resistive core with an opening and measurement leads, a Rogowski coil with electrical contacts surrounding the resistive core, conductive layers on first and second sides of the resistive core, one or more insulative layers between the conductive layers and the Rogowski coil, the current measurement device configured to combine signals from the shunt resistor and the Rogowski core. The current measurement device may have a Rogowski coil on a flexible substrate at least partially wrapped around the shunt resistor. A current measurement device has a rigid substrate, vias filled with a conductive material through the rigid substrate, conductive layers on the top surface and the bottom surface connecting to the vias to form a Rogowski coil structure, one or more insulative layers directly on the coil structure, a shunt resistor directly on the one or more insulative layers.
Abstract:
A probe tip for an isolated probe having a triaxial cable has a conductive probe tip interface at one end of the cable, a signal conductor, the signal conductor traversing a length of the cable and electrically connected to the conductive probe tip interface, a reference conductor surrounding the signal conductor along the length of the cable, a shield conductor surrounding the reference conductor at least along the length of the cable, the shield conductor and the reference conductor electrically connected at ends of the probe tip, a first insulator between the signal conductor and the reference conductor along the length of the cable, a second insulator between the reference conductor and the shield conductor along the length of the cable, and high magnetic permeability material inside the shield conductor. A method of manufacturing a tip for an isolated probe having a triaxial cable includes accessing a shield conductor of the triaxial cable, inserting a high magnetic permeability material between the shield conductor and a reference conductor in the triaxial cable, electrically connecting the shield conductor to the reference conductor. A triaxial cable has a signal conductor, the signal conductor traversing a length of the cable, a reference conductor surrounding the signal conductor along the length of the cable, a shield conductor surrounding the reference conductor along the length of the cable, the shield conductor and the reference conductor electrically connected at ends of the cable, a first insulator between the signal conductor and the reference conductor along the length of the cable, a second insulator between the reference conductor and the shield conductor along the length of the cable, and high magnetic permeability material inside the shield conductor.
Abstract:
A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid.
Abstract:
A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid.