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公开(公告)号：US12131919B2
公开(公告)日：2024-10-29
申请号：US17755446
申请日：2020-10-19
Applicant: Tokyo Electron Limited
Inventor： Tsunenaga Nakashima , Masami Akimoto
CPC classification number: H01L21/67028 , B05B1/005 , B05B1/28 , B05B12/18 , H01L21/02046 , H01L21/02057 , H01L21/68735
Abstract: A particle removed from a substrate is suppressed from adhering to the substrate again. A substrate cleaning apparatus includes a substrate holder configured to hold the substrate; a gas nozzle configured to jet a cleaning gas to the substrate on the substrate holder; and a nozzle cover provided to surround the gas nozzle. The cleaning gas is jetted to a decompression chamber of the nozzle cover from the gas nozzle, and a gas cluster configured to remove the particle on the substrate in the decompression chamber is generated. A gas for a gas curtain is jetted from an end portion of the nozzle cover toward the substrate, and the gas curtain is formed between the substrate and the end portion of the nozzle cover.
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公开(公告)号：US11637035B2
公开(公告)日：2023-04-25
申请号：US16583590
申请日：2019-09-26
Applicant: Tokyo Electron Limited
Inventor： Satoshi Morita , Masami Akimoto , Katsuhiro Morikawa , Kouichi Mizunaga
IPC: H01L21/687 , H01L21/67 , H01L21/304 , B08B3/04 , H01L21/02
Abstract: A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; an electric heater provided at the rotary table and configured to heat the substrate; a power receiving electrode provided at the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode to supply a power to the electric heater via the power receiving electrode; an electrode moving device configured to connect and disconnect the power feeding electrode and the power receiving electrode relatively; a power feeder configured to supply the power to the power feeding electrode; a processing cup disposed to surround the rotary table; at least one processing liquid nozzle configured to supply a processing liquid onto the substrate; a processing liquid supply device configured to supply the processing liquid to the processing liquid nozzle; and a controller.
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公开(公告)号：US20230021035A1
公开(公告)日：2023-01-19
申请号：US17757173
申请日：2020-12-07
Applicant: Tokyo Electron Limited
Inventor： Masami Akimoto , Naruaki Iida , Tsunenaga Nakashima , Keisuke Sasaki , Takahiro Yasutake , Kazuya Matsushita , Kousei Ide , Masato Ozeki
IPC: H01L21/677 , H01L21/67 , H01L21/673
Abstract: A linearly moving mechanism includes an internal moving body provided within a case body and configured to be moved in a linear direction, the internal moving body being configured to move an external moving body connected to a connection member protruded from the case body through an opening formed at the case body; a seal belt extending in the linear direction and provided within the case body to close the opening, a first surface side of both end portions of the seal belt in a widthwise direction thereof facing an edge portion of the opening while being spaced apart therefrom; and a deformation suppressing member provided to face a second surface side of the both end portions to suppress deformation of the seal belt, the seal belt being connected to the internal moving body to be moved along with a movement of the internal moving body.
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Patent Agency Ranking
公开(公告)号：US20220389574A1
公开(公告)日：2022-12-08
申请号：US17755449
申请日：2020-10-19
Applicant: Tokyo Electron Limited
Inventor： Tsunenaga Nakashima , Masami Akimoto
IPC: C23C16/44 , H01L21/67 , C23C16/455 , H01L21/687
Abstract: A particle removed from a substrate is suppressed from adhering to the substrate again. A substrate cleaning apparatus includes a substrate holder configured to hold the substrate; a gas nozzle configured to jet a cleaning gas to the substrate on the substrate holder; and a nozzle cover provided to surround the gas nozzle. The cleaning gas is jetted to a decompression chamber of the nozzle cover from the gas nozzle, and a gas cluster configured to remove the particle on the substrate in the decompression chamber is generated. A gas for a gas curtain is jetted from a holder support of the substrate holder toward the nozzle cover, and the gas curtain is formed between the nozzle cover and the holder support.
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公开(公告)号：US11510284B2
公开(公告)日：2022-11-22
申请号：US16583662
申请日：2019-09-26
Applicant: Tokyo Electron Limited
Inventor： Satoshi Morita , Masami Akimoto , Katsuhiro Morikawa , Kouichi Mizunaga , Kouzou Kawahara
IPC: H05B3/68 , H05B1/02 , H01L21/687 , H01L21/67
Abstract: A substrate processing apparatus includes a rotary table configured to hold and rotate a substrate; an electronic component provided at the rotary table and configured to be rotated along with the rotary table; a first electrode unit provided at the rotary table and configured to be rotated along with the rotary table, the first electrode unit comprising multiple first electrodes electrically connected to the electronic component via multiple first conductive lines; an electric device configured to perform a power supply to the electronic component and a transmission/reception of signals; a second electrode unit comprising multiple second electrodes electrically connected to the electric device via multiple second conductive lines and arranged at positions respectively corresponding to the multiple first electrodes to be brought into contact with the multiple first electrodes; and an electrode moving device configured to connect/disconnect the first electrode unit to/from the second electrode unit.
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公开(公告)号：US20220056590A1
公开(公告)日：2022-02-24
申请号：US17279748
申请日：2019-09-26
Applicant: Tokyo Electron Limited
Inventor： Satoshi Morita , Masami Akimoto , Katsuhiro Morikawa , Kouichi Mizunaga , Mitsuaki Iwashita , Satoshi Kaneko
IPC: C23C18/16 , C23C16/455 , H01L21/02
Abstract: A substrate processing apparatus includes a rotation driving mechanism configured to rotate a rotary table configured to hold a substrate; an electric heater provided in the rotary table to be rotated along with the rotary table and configured to heat the substrate; a power receiving electrode provided in the rotary table to be rotated along with the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode and configured to supply a power to the electric heater via the power receiving electrode; an electrode moving mechanism; a power feeder configured to supply the power to the power feeding electrode; a processing cup surrounding the rotary table; at least one processing liquid nozzle configured to supply a processing liquid; a processing liquid supply mechanism configured to supply at least an electroless plating liquid; and a controller.
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公开(公告)号：US20160118275A1
公开(公告)日：2016-04-28
申请号：US14882864
申请日：2015-10-14
Applicant: Tokyo Electron Limited
Inventor： Shigehisa Inoue , Jiro Higashijima , Masami Akimoto
CPC classification number: H01L21/67051 , B05B13/0228 , B05B15/50 , B05B15/55 , B05B15/70 , B08B3/02 , B08B3/04 , B08B3/12
Abstract: Disclosed is a substrate liquid processing apparatus including a substrate holding unit configured to hold a substrate; a processing liquid nozzle configured to supply a processing liquid to the substrate held by the substrate holding unit; a nozzle arm configured to hold the processing liquid nozzle; and an arm cleaning tank configured to immerse the entire surface of the nozzle arm in a cleaning liquid so as to clean the nozzle arm.
Abstract translation: 公开了一种基板液体处理装置，其包括：被配置为保持基板的基板保持单元; 处理液喷嘴，被配置为向由所述基板保持单元保持的所述基板供给处理液; 喷嘴臂，其构造成保持所述处理液喷嘴; 以及配置成将喷嘴臂的整个表面浸入清洁液体中以清洁喷嘴臂的臂清洁罐。
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公开(公告)号：US09508569B2
公开(公告)日：2016-11-29
申请号：US14882864
申请日：2015-10-14
Applicant: Tokyo Electron Limited
Inventor： Shigehisa Inoue , Jiro Higashijima , Masami Akimoto
CPC classification number: H01L21/67051 , B05B13/0228 , B05B15/50 , B05B15/55 , B05B15/70 , B08B3/02 , B08B3/04 , B08B3/12
Abstract: Disclosed is a substrate liquid processing apparatus including a substrate holding unit configured to hold a substrate; a processing liquid nozzle configured to supply a processing liquid to the substrate held by the substrate holding unit; a nozzle arm configured to hold the processing liquid nozzle; and an arm cleaning tank configured to immerse the entire surface of the nozzle arm in a cleaning liquid so as to clean the nozzle arm.
Abstract translation: 公开了一种基板液体处理装置，其包括：被配置为保持基板的基板保持单元; 处理液喷嘴，被配置为向由所述基板保持单元保持的所述基板供给处理液; 喷嘴臂，其构造成保持所述处理液喷嘴; 以及配置成将喷嘴臂的整个表面浸入清洁液体中以清洁喷嘴臂的臂清洁罐。
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