公开(公告)号：US20050179029A1

公开(公告)日：2005-08-18

申请号：US10777576

申请日：2004-02-12

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Peter Mitchell ,  Larry Nesbit

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Peter Mitchell ,  Larry Nesbit

IPC分类号： G11C13/02 ,  H01L21/336 ,  H01L27/28 ,  H01L51/05 ,  H01L51/30 ,  H01L51/40 ,  H01L29/06

CPC分类号： H01L51/057 ,  B82Y10/00 ,  G11C13/025 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/125 ,  H01L29/66409 ,  H01L29/772 ,  H01L51/0048 ,  Y10S977/734

摘要： A method for forming carbon nanotube field effect transistors, arrays of carbon nanotube field effect transistors, and device structures and arrays of device structures formed by the methods. The methods include forming a stacked structure including a gate electrode layer and catalyst pads each coupled electrically with a source/drain contact. The gate electrode layer is divided into multiple gate electrodes and at least one semiconducting carbon nanotube is synthesized by a chemical vapor deposition process on each of the catalyst pads. The completed device structure includes a gate electrode with a sidewall covered by a gate dielectric and at least one semiconducting carbon nanotube adjacent to the sidewall of the gate electrode. Source/drain contacts are electrically coupled with opposite ends of the semiconducting carbon nanotube to complete the device structure. Multiple device structures may be configured either as a memory circuit or as a logic circuit.

摘要翻译： 一种形成碳纳米管场效应晶体管的方法，碳纳米管场效应晶体管的阵列，以及通过该方法形成的器件结构和器件结构阵列。 所述方法包括形成包括栅极电极层和各个与源极/漏极接触电连接的催化剂焊盘的堆叠结构。 栅极电极层被分成多个栅极电极，并且通过化学气相沉积工艺在每个催化剂焊盘上合成至少一个半导体碳纳米管。 完成的器件结构包括具有由栅极电介质覆盖的侧壁的栅电极和与栅电极的侧壁相邻的至少一个半导体碳纳米管。 源极/漏极触点与半导体碳纳米管的相对端电耦合以完成器件结构。 多个器件结构可以被配置为存储器电路或逻辑电路。

公开(公告)号：US20050167655A1

公开(公告)日：2005-08-04

申请号：US10767065

申请日：2004-01-29

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Peter Mitchell ,  Larry Nesbit

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Peter Mitchell ,  Larry Nesbit

IPC分类号： B82B1/00 ,  B82B3/00 ,  H01L27/28 ,  H01L51/05 ,  H01L51/30 ,  H01L51/40 ,  H01L29/06

CPC分类号： H01L51/057 ,  B82Y10/00 ,  H01L51/0048 ,  Y10S977/70 ,  Y10S977/734 ,  Y10S977/742

摘要： Vertical device structures incorporating at least one nanotube and methods for fabricating such device structures by chemical vapor deposition. Each nanotube is grown by chemical vapor deposition catalyzed by a catalyst pad and encased in a coating of a dielectric material. Vertical field effect transistors may be fashioned by forming a gate electrode about the encased nanotubes such that the encased nanotubes extend vertically through the thickness of the gate electrode. Capacitors may be fashioned in which the encased nanotubes and the corresponding catalyst pad bearing the encased nanotubes forms one capacitor plate.

摘要翻译： 结合至少一个纳米管的垂直器件结构和通过化学气相沉积制造这种器件结构的方法。 每个纳米管通过由催化剂垫催化的化学气相沉积生长并且包裹在电介质材料的涂层中。 可以通过围绕封装的纳米管形成栅电极来形成垂直场效应晶体管，使得封装的纳米管垂直延伸穿过栅电极的厚度。 可以形成电容器，其中包裹的纳米管和带有封装的纳米管的相应的催化剂垫片形成一个电容器板。

公开(公告)号：US20070262450A1

公开(公告)日：2007-11-15

申请号：US11379582

申请日：2006-04-21

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

IPC分类号： H01L23/52

CPC分类号： H01L23/53276 ,  H01L23/5256 ,  H01L2924/0002 ,  Y10S977/742 ,  H01L2924/00

摘要： A fuse structure and a method for operating the same. The fuse structure operating method includes providing a structure. The structure includes (a) an electrically conductive layer and (b) N electrically conductive regions hanging over without touching the electrically conductive layer. N is a positive integer and N is greater than 1. The N electrically conductive regions are electrically connected together. The structure operating method further includes causing a first electrically conductive region of the N electrically conductive regions to touch the electrically conductive layer without causing the remaining N−1 electrically conductive regions to touch the electrically conductive layer.

摘要翻译： 熔丝结构及其操作方法。 熔丝结构操作方法包括提供一种结构。 该结构包括（a）导电层和（b）悬挂在不接触导电层的N个导电区域。 N是正整数，N大于1.N导电区域电连接在一起。 结构操作方法还包括使N个导电区域的第一导电区域与导电层接触而不会使剩余的N-1导电区域接触导电层。

公开(公告)号：US20070190713A1

公开(公告)日：2007-08-16

申请号：US11307671

申请日：2006-02-16

申请人： Bruce Doris ,  Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

发明人： Bruce Doris ,  Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

IPC分类号： H01L21/8238

CPC分类号： H01L21/32139 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/823828 ,  H01L21/823864

摘要： A sidewall image transfer process for forming sub-lithographic structures employs a layer of sacrificial polymer containing silicon that is deposited over a gate conductor layer and covered by a cover layer. The sacrificial polymer layer is patterned with conventional resist and etched to form a sacrificial mandrel. The edges of the mandrel are oxidized or nitrided in a plasma at low temperature, after which the polymer and the cover layer are stripped, leaving sublithographic sidewalls. The sidewalls are used as hardmasks to etch sublithographic gate structures in the gate conductor layer.

摘要翻译： 用于形成亚光刻结构的侧壁图像转印工艺使用沉积在栅极导体层上并被覆盖层覆盖的含有硅的牺牲聚合物层。 牺牲聚合物层用常规抗蚀剂图案化并蚀刻以形成牺牲心轴。 心轴的边缘在低温下在等离子体中被氧化或氮化，之后剥离聚合物和覆盖层，留下亚光刻的侧壁。 侧壁用作硬掩模来蚀刻栅极导体层中的亚光刻栅极结构。

公开(公告)号：US20070125946A1

公开(公告)日：2007-06-07

申请号：US11164792

申请日：2005-12-06

申请人： Carol Boye ,  Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

发明人： Carol Boye ,  Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

IPC分类号： G21K7/00

CPC分类号： G01Q60/42 ,  G01Q70/12

摘要： A Y-shaped carbon nanotube atomic force microscope probe tip and methods comprise a shaft portion; a pair of angled arms extending from a same end of the shaft portion, wherein the shaft portion and the pair of angled arms comprise a chemically modified carbon nanotube, and wherein the chemically modified carbon nanotube is modified with any of an amine, carboxyl, fluorine, and metallic component. Preferably, each of the pair of angled arms comprises a length of at least 200 nm and a diameter between 10 and 200 nm. Moreover, the chemically modified carbon nanotube is preferably adapted to allow differentiation between substrate materials to be probed. Additionally, the chemically modified carbon nanotube is preferably adapted to allow fluorine gas to flow through the chemically modified carbon nanotube onto a substrate to be characterized. Furthermore, the chemically modified carbon nanotube is preferably adapted to chemically react with a substrate surface to be characterized.

摘要翻译： Y型碳纳米管原子力显微镜探针头和方法包括轴部分; 一对成角度的臂，其从所述轴部的同一端延伸，其中所述轴部和所述一对成角度的臂包括化学改性的碳纳米管，并且其中所述化学改性的碳纳米管用胺，羧基，氟 ，和金属成分。 优选地，一对成角度的臂中的每一个包括至少200nm的长度和10和200nm之间的直径。 此外，化学改性的碳纳米管优选适于允许待探测的基底材料之间的分化。 此外，化学改性的碳纳米管优选适于使氟气通过化学改性的碳纳米管流动到待表征的基底上。 此外，化学改性的碳纳米管优选适于与要表征的基材表面发生化学反应。

公开(公告)号：US20070023839A1

公开(公告)日：2007-02-01

申请号：US11161219

申请日：2005-07-27

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

IPC分类号： H01L27/12

CPC分类号： H01L29/785 ,  B82Y10/00 ,  H01L29/4908 ,  H01L29/66795 ,  H01L51/0048 ,  H01L51/0512

摘要： A fin field effect transistor (FinFET) gate comprises a semiconductor wafer; a gate dielectric layer over the semiconductor wafer; a conductive material on the gate dielectric layer; an activated carbon nanotube on a surface of the conductive material; and a plated metal layer on the activated carbon nanotube. Preferably, the carbon nanotube is on a sidewall of the conductive material. The conductive material comprises a first metal layer over the gate dielectric layer, wherein the first metal layer acts as a catalyst for growing the carbon nanotube, wherein the first metal layer is preferably in a range of 1-10 nm in thickness. The semiconductor wafer may comprise a silicon on insulator wafer. The FinFET gate may further comprise a second metal layer disposed between the first metal layer and the gate dielectric layer.

摘要翻译： 鳍状场效应晶体管（FinFET）栅极包括半导体晶片; 半导体晶片上的栅介质层; 栅介电层上的导电材料; 导电材料表面上的活性炭纳米管; 和活化碳纳米管上的电镀金属层。 优选地，碳纳米管位于导电材料的侧壁上。 导电材料包括在栅极介电层上的第一金属层，其中第一金属层用作生长碳纳米管的催化剂，其中第一金属层的厚度优选在1-10nm的范围内。 半导体晶片可以包括绝缘体上硅晶片。 FinFET栅极还可以包括设置在第一金属层和栅极介电层之间的第二金属层。

公开(公告)号：US20050202322A1

公开(公告)日：2005-09-15

申请号：US10798908

申请日：2004-03-11

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Peter Mitchell ,  Larry Nesbit

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Peter Mitchell ,  Larry Nesbit

IPC分类号： G03C5/00 ,  G03F1/00 ,  G03F9/00

CPC分类号： G03F1/30

摘要： Methods for fabricating alternating phase shift masks or reticles used in semiconductor optical lithography systems. The methods generally include forming a layer of phase shift mask material on a handle substrate and patterning the layer to define recessed phase shift windows. The patterned layer is transferred from the handle wafer to a mask blank. The depth of the phase shift windows is determined by the thickness of the layer of phase shift mask material and is independent of the patterning process. In particular, the depth of the phase shift windows is not dependent upon the etch rate uniformity of an etch process across a surface of a mask blank.

摘要翻译： 用于制造用于半导体光刻系统中的交替相移掩模或掩模版的方法。 所述方法通常包括在手柄基板上形成一层相移掩模材料，并且图案化该层以限定凹陷的相移窗口。 图案层从手柄晶片转移到掩模板。 相移窗口的深度由相移掩模材料层的厚度确定，并且与图案化工艺无关。 特别地，相移窗口的深度不依赖于通过掩模板的表面的蚀刻工艺的蚀刻速率均匀性。

公开(公告)号：US20050098804A1

公开(公告)日：2005-05-12

申请号：US10703355

申请日：2003-11-07

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Larry Nesbit

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Larry Nesbit

IPC分类号： H01L21/28 ,  H01L21/336 ,  H01L21/338 ,  H01L29/49 ,  H01L29/76 ,  H01L31/062 ,  H01L31/119

CPC分类号： H01L29/66772 ,  H01L21/2807 ,  H01L29/4908

摘要： A method for fabricating a metal-oxide-semiconductor device structure. The method includes introducing a dopant species concurrently into a semiconductor active layer that overlies an insulating layer and a gate electrode overlying the semiconductor active layer by ion implantation. The thickness of the semiconductor active layer, the thickness of the gate electrode, and the kinetic energy of the dopant species are chosen such that the projected range of the dopant species in the semiconductor active layer and insulating layer lies within the insulating layer and a projected range of the dopant species in the gate electrode lies within the gate electrode. As a result, the semiconductor active layer and the gate electrode may be doped simultaneously during a single ion implantation and without the necessity of an additional implant mask.

公开(公告)号：US20070184647A1

公开(公告)日：2007-08-09

申请号：US11735988

申请日：2007-04-16

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Peter Mitchell

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Peter Mitchell

IPC分类号： H01L21/4763

CPC分类号： B82Y10/00 ,  H01L21/7682 ,  H01L23/5222 ,  H01L23/53238 ,  H01L23/5329 ,  H01L2924/0002 ,  Y10S977/742 ,  Y10S977/842 ,  H01L2924/00

摘要： A dielectric in an integrated circuit is formed by creating oriented cylindrical voids in a conventional dielectric material. Preferably, voids are formed by first forming multiple relatively long, thin carbon nanotubes perpendicular to a surface of an integrated circuit wafer, depositing a conventional dielectric on the surface surrounding the carbon nanotubes, and then removing the carbon nanotubes to produce the voids. A layer of dielectric and voids thus formed can be patterned or otherwise processed using any of various conventional processes. Recesses formed in the dielectric for conductors are lined with a non-conformal dielectric film to seal the voids. The use of a conventional dielectric material having numerous air voids substantially reduces the dielectric constant, leaving a dielectric structure which is both structurally strong and can be constructed compatibly with conventional processes and materials.

摘要翻译： 集成电路中的电介质通过在常规电介质材料中产生取向的圆柱形空隙来形成。 优选地，通过首先形成垂直于集成电路晶片的表面的多个相对长的薄碳纳米管，在围绕碳纳米管的表面上沉积常规电介质，然后除去碳纳米管以产生空隙来形成空隙。 由此形成的电介质层和空隙层可以使用各种常规方法中的任一种进行图案化或以其他方式处理。 用于导体的电介质中形成的凹陷衬有非共形绝缘膜以密封空隙。 使用具有多个空气空隙的常规电介质材料基本上降低了介电常数，留下了在结构上很强并且可以与常规工艺和材料相容地构造的电介质结构。

公开(公告)号：US20070148935A1

公开(公告)日：2007-06-28

申请号：US11532189

申请日：2006-09-15

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

IPC分类号： H01L21/3205 ,  H01L21/4763

CPC分类号： H01L29/66545 ,  H01L21/0273 ,  H01L21/266 ,  H01L21/28035 ,  H01L29/1083 ,  H01L29/6653 ,  H01L29/6659

摘要： A semiconductor fabrication method. The method includes providing a semiconductor structure which includes (i) a semiconductor layer, (ii) a gate dielectric layer on the semiconductor layer, and (iii) a gate electrode region on the gate dielectric layer. The gate dielectric layer is sandwiched between and electrically insulates the semiconductor layer and the gate electrode region. The semiconductor layer and the gate dielectric layer share a common interfacing surface which defines a reference direction perpendicular to the common interfacing surface and pointing from the semiconductor layer to the gate dielectric layer. Next, a resist layer is formed on the gate dielectric layer and the gate electrode region. Next, a cap portion of the resist layer directly above the gate electrode region in the reference direction is removed without removing any portion of the resist layer not directly above the gate electrode region in the reference direction.

摘要翻译： 半导体制造方法。 该方法包括提供半导体结构，其包括（i）半导体层，（ii）半导体层上的栅极电介质层，以及（iii）栅极电介质层上的栅极电极区域。 栅极电介质层被夹在半导体层和栅极电极区域之间并使其电绝缘。 半导体层和栅极介电层共享公共接口表面，其界定垂直于公共接口表面的参考方向并且从半导体层指向栅极介电层。 接下来，在栅极电介质层和栅极电极区域上形成抗蚀剂层。 接下来，去除在参考方向上正好在栅极区域上方的抗蚀剂层的盖部分，而不去除在参考方向上不在栅电极区域正上方的任何部分的抗蚀剂层。