公开(公告)号：US06852932B2

公开(公告)日：2005-02-08

申请号：US10650309

申请日：2003-08-28

申请人： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

发明人： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

IPC分类号： H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K1/11 ,  H01R12/04

CPC分类号： H05K3/4038 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/1056

摘要： A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.

摘要翻译： 一种多层电路板，其具有与电接地构件选择性地和电隔离的孔，并且还具有由聚合物材料在结构上支撑的选择性地形成的空气桥和/或交叉构件。 每个孔选择性地接收导电材料。

公开(公告)号：US06729023B2

公开(公告)日：2004-05-04

申请号：US09815564

申请日：2001-03-23

申请人： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

发明人： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

IPC分类号： H05K302

CPC分类号： H05K3/4038 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/1056

摘要： A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.

摘要翻译： 一种用于制造具有孔96,98的多层电路板116的方法，其可以与电接地构件46选择性地和电隔离，并且还具有在结构上由材料112支撑的选择性地形成的空气桥和/或交叉构件104.每个 孔96,98选择性地接收导电材料114。

公开(公告)号：US06454878B1

公开(公告)日：2002-09-24

申请号：US09703553

申请日：2000-11-01

申请人： Achyuta Achari ,  Brenda Joyce Nation ,  Jay D Baker ,  Lakhi Nandlal Goenka ,  Mohan R. Paruchuri ,  Vladimir Stoica

发明人： Achyuta Achari ,  Brenda Joyce Nation ,  Jay D Baker ,  Lakhi Nandlal Goenka ,  Mohan R. Paruchuri ,  Vladimir Stoica

IPC分类号： C23C806

CPC分类号： H05K3/022 ,  B32B15/017 ,  B32B15/018 ,  H05K2201/0361 ,  Y10T29/49126

摘要： A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

摘要翻译： 一种用于形成包含使用包层磨的三金属材料组的方法。 当形成多组三金属材料时，通过氧化制备每组的外表面以防止每一组粘附到上述或下方。 氧化的替代物是在三金属材料的外表面上提供可除去的层。 或者可以在中间表面上使用粘合材料; 这种接合材料可以选自锡，镍，钛，铬，银和锌。