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公开(公告)号:US06852932B2
公开(公告)日:2005-02-08
申请号:US10650309
申请日:2003-08-28
申请人: Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
发明人: Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
CPC分类号: H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T156/1056
摘要: A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.
摘要翻译: 一种多层电路板,其具有与电接地构件选择性地和电隔离的孔,并且还具有由聚合物材料在结构上支撑的选择性地形成的空气桥和/或交叉构件。 每个孔选择性地接收导电材料。
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2.Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material 失效
标题翻译: 制造具有由聚合物材料支撑的空气桥的多层电路板组件的方法公开(公告)号:US06729023B2
公开(公告)日:2004-05-04
申请号:US09815564
申请日:2001-03-23
申请人: Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
发明人: Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
IPC分类号: H05K302
CPC分类号: H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T156/1056
摘要: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.
摘要翻译: 一种用于制造具有孔96,98的多层电路板116的方法,其可以与电接地构件46选择性地和电隔离,并且还具有在结构上由材料112支撑的选择性地形成的空气桥和/或交叉构件104.每个 孔96,98选择性地接收导电材料114。
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公开(公告)号:US06584682B2
公开(公告)日:2003-07-01
申请号:US09812345
申请日:2001-03-20
IPC分类号: H05K320
CPC分类号: H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要: A method 10 for making multi-layer electronic circuit boards 148, 248 having aperture 146, 246 which may be selectively connected to an electrical ground potential.
摘要翻译: 一种用于制造具有孔146,246的多层电子电路板148,248的方法10,其可选择性地连接到电接地电位。
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公开(公告)号:US06403893B2
公开(公告)日:2002-06-11
申请号:US09907971
申请日:2001-03-20
申请人: Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Robert Joseph Gordon , Thomas Bernd Krautheim
发明人: Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Robert Joseph Gordon , Thomas Bernd Krautheim
IPC分类号: H05K114
CPC分类号: H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49156
摘要: A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.
摘要翻译: 一种用于制造具有电镀孔96,98的多层电子电路板136的方法,其可以与电接地构件46选择性地和电隔离,并且还具有结构上由材料支撑的选择性地形成的空气桥和/或交叉构件128 134。
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