公开(公告)号：US08652250B2

公开(公告)日：2014-02-18

申请号：US13701179

申请日：2010-09-09

申请人： Shengyi Qin ,  Yihai Jia ,  Zhenbang Wang ,  Huan Wang ,  Wenxing Hu

发明人： Shengyi Qin ,  Yihai Jia ,  Zhenbang Wang ,  Huan Wang ,  Wenxing Hu

IPC分类号： C04B20/10 ,  C04B28/00 ,  B22C1/00

CPC分类号： C04B20/1029 ,  C04B14/068 ,  C04B20/1037 ,  C04B28/02 ,  C04B2111/00293 ,  Y02W30/92 ,  Y02W30/94 ,  Y02W30/96 ,  C04B20/04 ,  C04B14/06 ,  C04B20/008 ,  C04B2103/302 ,  C04B14/106 ,  C04B18/08 ,  C04B18/146 ,  C04B18/22 ,  C04B24/223 ,  C04B24/226 ,  C04B24/2647 ,  C04B24/287

摘要： A composition used for high-strength impermeable concrete. The composition contains sand, stone, cement, water reducer, water and reinforced impermeable sand. The reinforced impermeable sand includes aeolian sand and binder covering the surface of the aeolian sand. The reinforced impermeable sand can fill the gap between the sand and the stone, and well combine various components in the composition, and suppress the seepage phenomenon of the molded concrete, thereby greatly improving the strength and impermeability of the concrete.

摘要翻译： 用于高强度不渗透混凝土的组合物。 该组合物包含砂，石，水泥，减水剂，水和增强不渗透砂。 增强不透水砂包括风沙和覆盖风沙表面的粘结剂。 加强不透水砂可以填补砂石之间的间隙，组合各种组分，抑制混凝土的渗流现象，大大提高混凝土的强度和不渗透性。

公开(公告)号：US20130198772A1

公开(公告)日：2013-08-01

申请号：US13564473

申请日：2012-08-01

申请人： Huan Wang ,  Xun Hu ,  Jieping Zhong

发明人： Huan Wang ,  Xun Hu ,  Jieping Zhong

IPC分类号： H04N21/43

CPC分类号： H04N21/43 ,  H04H20/18 ,  H04H60/31 ,  H04H60/33 ,  H04H60/37 ,  H04H60/48 ,  H04H60/63 ,  H04H60/87 ,  H04H2201/40

摘要： Embodiments of the present invention provide a method, a server, and a system for implementing a video-based value-added service. The method includes: acquiring, by an event server, association event data which corresponds to a video currently played by a first client; when detecting an event trigger condition, generating, by the event server, an event notification according to the association event data, and sending the event notification to an application server; forming, by the application server, value-added service content according to preset value-added service data and event data in the event notification, and providing the value-added service content for a second client.

摘要翻译： 本发明的实施例提供了一种用于实现基于视频的增值业务的方法，服务器和系统。 该方法包括：由事件服务器获取与第一客户端当前播放的视频对应的关联事件数据; 当检测到事件触发条件时，由事件服务器根据关联事件数据生成事件通知，并将事件通知发送到应用服务器; 由所述应用服务器根据所述事件通知中的预设增值服务数据和事件数据形成增值服务内容，以及为第二客户端提供所述增值服务内容。

公开(公告)号：US20110306765A1

公开(公告)日：2011-12-15

申请号：US13202834

申请日：2010-02-23

申请人： Pamela A. Haile ,  Clark A. Sehon ,  Huan Wang

发明人： Pamela A. Haile ,  Clark A. Sehon ,  Huan Wang

IPC分类号： C07D471/10 ,  C07D401/06

CPC分类号： C07D471/10

摘要： The present invention relates to a method comprising reducing a ketone of formula I: with an enantioselective hydrogenating agent to form substantially enantiomerically pure alcohol of formula II: where R—R4 and m are as defined herein. The method of the present invention is useful for making CCR2 modulators as wells as precursors CCR2 modulators.

摘要翻译： 本发明涉及一种方法，其包括用对映选择性氢化剂还原式I的酮，以形成基本上为对映异构体的式II的醇：其中R-R4和m如本文所定义。 本发明的方法可用于制备CCR2调节剂作为前体CCR2调节剂。

公开(公告)号：US20150357266A1

公开(公告)日：2015-12-10

申请号：US14554064

申请日：2014-11-26

申请人： Huan Wang ,  Hejin Liu ,  Weiping Sun

发明人： Huan Wang ,  Hejin Liu ,  Weiping Sun

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L23/49555 ,  H01L21/4825 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49537 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014

摘要： A packaged semiconductor device is assembled using a first lead frame upon which a die is mounted and encapsulated and a second lead frame that provides bent leads for the device. By using two different lead frames, an array of the first lead frames can be configured with more lead frames for more devices than a comparably sized lead frame array of the prior art because the first lead frame array does not need to provide the leads for the packaged devices. Instead, the leads are provided by the second lead frame array, which can be attached to the first lead frame array after the dies have been mounted and encapsulated on the first lead frame array.

摘要翻译： 使用第一引线框架组装封装的半导体器件，在其上安装和封装管芯，以及提供用于器件的弯曲引线的第二引线框架。 通过使用两个不同的引线框架，与现有技术的相当尺寸的引线框架阵列相比，第一引线框架的阵列可以配置有比用于更多器件的更多引线框架，因为第一引线框架阵列不需要为 包装设备。 相反，引线由第二引线框架阵列提供，其可以在管芯已经被安装并封装在第一引线框架阵列上之后附接到第一引线框架阵列。

公开(公告)号：US20140284805A1

公开(公告)日：2014-09-25

申请号：US14178244

申请日：2014-02-11

申请人： Huan Wang ,  Aipeng Shu ,  Shu An Yao

发明人： Huan Wang ,  Aipeng Shu ,  Shu An Yao

IPC分类号： H01L25/065 ,  H01L23/00

CPC分类号： H01L25/0652 ,  H01L24/80 ,  H01L25/50 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/041 ,  H05K2201/09027 ,  Y02P70/611 ,  H01L2924/00

摘要： A three dimensional package includes a substrate having a columnar part including a sidewall, and stairs or steps arranged along the sidewall of the columnar part in the form of multiple helixes twisted around the columnar part. Semiconductor integrated circuits (IC dies) are attached on one or both of the supporting surfaces of the stairs. The columnar part, the stairs and the IC dies can be encapsulated with a mold compound.

摘要翻译： 三维包装包括具有包括侧壁的柱状部分的基板和沿着柱状部分的侧壁以沿着柱状部分扭转的多个螺旋形的形式布置的台阶或台阶。 半导体集成电路（IC管芯）安装在楼梯的一个或两个支撑面上。 柱状部分，楼梯和IC模具可以用模具化合物包封。

公开(公告)号：US09209119B1

公开(公告)日：2015-12-08

申请号：US14554064

申请日：2014-11-26

申请人： Huan Wang ,  Hejin Liu ,  Weiping Sun

发明人： Huan Wang ,  Hejin Liu ,  Weiping Sun

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

CPC分类号： H01L23/49555 ,  H01L21/4825 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49537 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014

摘要： A packaged semiconductor device is assembled using a first lead frame upon which a die is mounted and encapsulated and a second lead frame that provides bent leads for the device. By using two different lead frames, an array of the first lead frames can be configured with more lead frames for more devices than a comparably sized lead frame array of the prior art because the first lead frame array does not need to provide the leads for the packaged devices. Instead, the leads are provided by the second lead frame array, which can be attached to the first lead frame array after the dies have been mounted and encapsulated on the first lead frame array.

摘要翻译： 使用第一引线框架组装封装的半导体器件，在其上安装和封装管芯，以及提供用于器件的弯曲引线的第二引线框架。 通过使用两个不同的引线框架，与现有技术的相当尺寸的引线框架阵列相比，第一引线框架的阵列可以配置有比用于更多器件的更多引线框架，因为第一引线框架阵列不需要为 包装设备。 相反，引线由第二引线框架阵列提供，其可以在管芯已经被安装并封装在第一引线框架阵列上之后附接到第一引线框架阵列。

公开(公告)号：US08889877B2

公开(公告)日：2014-11-18

申请号：US13636237

申请日：2011-03-22

申请人： Steven N. Goodman ,  Matthew David Kowalski ,  Douglas Matthew Mans ,  Huan Wang

发明人： Steven N. Goodman ,  Matthew David Kowalski ,  Douglas Matthew Mans ,  Huan Wang

IPC分类号： C07D213/803 ,  C07D213/68 ,  C07D498/14 ,  C07D213/80

CPC分类号： C07D498/14 ,  C07D213/68 ,  C07D213/80

摘要： The present invention relates to the preparation of pyridinone carboxylic acid aldehydes such as 5-methoxy-6-(methoxycarbonyl)-4-oxo-1-(2-oxoethyl)-1,4-dihydropyridine-3-carboxylic acid.

摘要翻译： 本发明涉及吡啶酮羧酸醛如5-甲氧基-6-（甲氧基羰基）-4-氧代-1-（2-氧代乙基）-1,4-二氢吡啶-3-羧酸的制备。

公开(公告)号：US20140070388A1

公开(公告)日：2014-03-13

申请号：US13854137

申请日：2013-04-01

申请人： Meiquan Huang ,  Huan Wang ,  Jinsheng Wang ,  Naikuo Zhou

发明人： Meiquan Huang ,  Huan Wang ,  Jinsheng Wang ,  Naikuo Zhou

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49503 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49506 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor device has a die support and external leads formed integrally from a single sheet of electrically conductive material. A die mounting substrate is mounted on the die support, with bonding pads coupled to respective external connection pads on an external connector side of the substrate. A die is attached to the die mounting substrate with die connection pads. Bond wires selectively electrically couple the die connection pads to the external leads and the bonding pads and electrically conductive external protrusions are mounted to the external connection pads. An encapsulant covers the die and bond wires. The external protrusions are located at a central region of a surface mounting side of the package and the external leads project outwardly from locations near the die support towards peripheral edges of the package.

摘要翻译： 半导体器件具有从单片导电材料一体地形成的管芯支撑件和外部引线。 模具安装基板安装在模具支撑件上，其中焊盘连接到基板的外部连接器侧上的相应的外部连接焊盘。 一个管芯连接到具有管芯连接焊盘的管芯安装衬底。 键合线选择性地将管芯连接焊盘电连接到外部引线，并且焊盘和导电外部突出部安装到外部连接焊盘。 密封剂覆盖管芯和接合线。 外部突出部位于封装的表面安装侧的中心区域，并且外部引线朝向封装外围边缘的位置向外突出。

公开(公告)号：US08617650B2

公开(公告)日：2013-12-31

申请号：US11905241

申请日：2007-09-28

申请人： Huan Wang ,  Ka Ming Ng ,  Xijun Hu ,  Jiyun Feng

发明人： Huan Wang ,  Ka Ming Ng ,  Xijun Hu ,  Jiyun Feng

IPC分类号： C23C16/26 ,  C23C14/34

CPC分类号： C23C14/165 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  C01B2202/08 ,  C23C14/584 ,  C30B11/12 ,  C30B25/02 ,  C30B29/602 ,  H01L23/373 ,  H01L2924/0002 ,  H01L2924/00

摘要： Aligned multi-walled carbon nanotubes were grown on both sides of a metallic or metal-coated substrate by water vapor-assisted chemical vapor deposition. Aligned carbon nanotube films of thickness ranging from 1 μm to over 100 μm were obtained. By manipulating various operating factors—position of substrate in the reactor, amount of water vapor, amount of catalyst, reactor temperature, and growth time, the morphology and thickness of these carbon nanotube films could be adjusted.

摘要翻译： 通过水蒸汽辅助化学气相沉积在金属或金属涂覆的基底的两面上生长对准的多壁碳纳米管。 得到厚度范围从1um到超过100μm的对准碳纳米管薄膜。 通过操作各种操作因素 - 反应器中底物的位置，水蒸汽量，催化剂量，反应器温度和生长时间，可以调节这些碳纳米管膜的形态和厚度。

公开(公告)号：US08563722B2

公开(公告)日：2013-10-22

申请号：US13202834

申请日：2010-02-23

申请人： Pamela A. Haile ,  Clark A. Sehon ,  Huan Wang

发明人： Pamela A. Haile ,  Clark A. Sehon ,  Huan Wang

IPC分类号： C07D471/10

CPC分类号： C07D471/10

摘要： The present invention relates to a method comprising reducing a ketone of formula I: with an enantioselective hydrogenating agent to form substantially enantiomerically pure alcohol of formula II: where R—R4 and m are as defined herein. The method of the present invention is useful for making CCR2 modulators as wells as precursors CCR2 modulators.

摘要翻译： 本发明涉及一种方法，其包括用对映选择性氢化剂还原式I的酮，以形成基本上为对映异构体的式II的醇：其中R-R4和m如本文所定义。 本发明的方法可用于制备CCR2调节剂作为前体CCR2调节剂。