公开(公告)号：US20090294168A1

公开(公告)日：2009-12-03

申请号：US12272797

申请日：2008-11-18

申请人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU ,  YING-TSO LAI

发明人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU ,  YING-TSO LAI

IPC分类号： H05K1/11

CPC分类号： H05K1/116 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/165 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09636

摘要： A printed circuit board includes a first layout layer, a second layout layer, a copper foil layer, a first via and a second via. The first layout layer has a first signal line and a second signal line, each of which has a curved first portion. The second layout layer has a third signal line and a fourth signal line, each of which also has a curved first portion. The curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line are coupled to the first via and the second via. In this case, the curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line cooperatively generate spiral inductance characteristic.

摘要翻译： 印刷电路板包括第一布局层，第二布局层，铜箔层，第一通孔和第二通孔。 第一布局层具有第一信号线和第二信号线，每条信号线都具有弯曲的第一部分。 第二布局层具有第三信号线和第四信号线，每条信号线还具有弯曲的第一部分。 第一信号线，第二信号线，第三信号线和第四信号线的弯曲的第一部分耦合到第一通孔和第二通孔。 在这种情况下，第一信号线，第二信号线，第三信号线和第四信号线的弯曲的第一部分协同地产生螺旋电感特性。

公开(公告)号：US20090065241A1

公开(公告)日：2009-03-12

申请号：US11957419

申请日：2007-12-15

申请人： CHIEN-HUNG LIU ,  SHOU-KUO HSU ,  YU-CHANG PAI

发明人： CHIEN-HUNG LIU ,  SHOU-KUO HSU ,  YU-CHANG PAI

IPC分类号： H05K1/02

CPC分类号： H05K1/0245 ,  H05K1/0219 ,  H05K2201/09336 ,  H05K2201/09672

摘要： A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers. Two ground parts are respectively arranged at opposite sides of each of the two differential traces.

摘要翻译： 印刷电路板（PCB）包括夹在其间的电介质层的第一和第二信号层，以及分别设置在第一和第二信号层内的差分对。 两个接地部分分别布置在两个差分迹线中的每一个的相对侧。

公开(公告)号：US20090107716A1

公开(公告)日：2009-04-30

申请号：US11967017

申请日：2007-12-29

申请人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU

发明人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU

IPC分类号： H05K1/11

CPC分类号： H05K1/0245 ,  H05K1/0228 ,  H05K1/0251 ,  H05K1/115 ,  H05K2201/09636 ,  H05K2201/097

摘要： A printed circuit board (PCB) includes a differential pair having a first differential trace and a second differential trace, a first via having an upper cap and a lower cap, and a second via having an upper cap and a lower cap. The first differential trace includes a first segment and a second segment, the second differential trace includes a third segment and a fourth segment. The first and the third segments are electrically coupled to the upper caps of the first and the second vias respectively. The second and the fourth segments are electrically coupled to the lower caps of the first and the second vias respectively. The first and the third segments extend from corresponding upper caps in different directions, the second and the fourth segments extend from corresponding lower caps in different directions.

摘要翻译： 印刷电路板（PCB）包括具有第一差分迹线和第二差分迹线的差分对，具有上盖和下盖的第一通孔以及具有上盖和下盖的第二通孔。 第一差分迹线包括第一段和第二段，第二差分迹线包括第三段和第四段。 第一和第三段分别电耦合到第一和第二通孔的上盖。 第二和第四段分别电耦合到第一和第二通孔的下盖。 第一和第三段从相应的上盖在不同的方向上延伸，第二和第四段从相应的下盖在不同的方向延伸。

公开(公告)号：US20090260860A1

公开(公告)日：2009-10-22

申请号：US12211057

申请日：2008-09-15

申请人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU

发明人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU

IPC分类号： H05K1/02 ,  H05K3/46

CPC分类号： H05K1/0245 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/0969 ,  Y10T29/49156

摘要： An exemplary FPCB includes two or more dielectric layers. Each dielectric layer is located between a signal layer and a ground layer. A differential pair including two transmission lines is arranged in each signal layer. Each ground layer includes one or more voids defined therein. Each void is opposite and adjacent to a differential pair.

摘要翻译： 示例性FPCB包括两个或更多个电介质层。 每个电介质层位于信号层和接地层之间。 在每个信号层中布置包括两条传输线的差分对。 每个接地层包括其中限定的一个或多个空隙。 每个空隙与差分对相反并相邻。

公开(公告)号：US20090086452A1

公开(公告)日：2009-04-02

申请号：US11954233

申请日：2007-12-12

申请人： CHIEN-HUNG LIU ,  SHOU-KUO HSU ,  YU-CHANG PAI

发明人： CHIEN-HUNG LIU ,  SHOU-KUO HSU ,  YU-CHANG PAI

IPC分类号： H05K1/02

CPC分类号： H05K1/0245 ,  H05K1/0248 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09709

摘要： A printed circuit board (PCB) includes parallel first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers at least partially overlapping in vertical alignment. Horizontal distance between midlines of the two differential traces is less than the width of either of the two differential traces.

摘要翻译： 印刷电路板（PCB）包括夹在其间的介电层的平行的第一和第二信号层，以及分别设置在第一和第二信号层内的两个差分迹线的差分对，至少部分地以垂直对准重叠。 两个差分迹线的中线之间的水平距离小于两个差分迹线中的任一个的宽度。

公开(公告)号：US20090078452A1

公开(公告)日：2009-03-26

申请号：US11951290

申请日：2007-12-05

申请人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU

发明人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU

IPC分类号： H05K1/00 ,  H01P3/08

CPC分类号： H05K1/0245 ,  H05K1/0393 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09336 ,  H05K2201/09672

摘要： An exemplary FPCB includes a differential pair consisting of a first transmission line and a second transmission line, a signal layer with the first transmission line arranged therein, a ground layer having a void which includes the area beneath the first transmission line, and a dielectric layer lying between the signal layer and the ground layer. The second transmission line is arranged in the ground layer offset from the first transmission line in the horizontal direction. The FPCB can transmit high speed signals.

摘要翻译： 示例性FPCB包括由第一传输线和第二传输线组成的差分对，其中布置有第一传输线的信号层，具有包括第一传输线下面的区域的空隙的接地层，以及介电层 位于信号层和接地层之间。 第二传输线布置在沿水平方向偏离第一传输线的接地层中。 FPCB可以传输高速信号。

公开(公告)号：US20090044968A1

公开(公告)日：2009-02-19

申请号：US11946859

申请日：2007-11-29

申请人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU

发明人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU

IPC分类号： H05K1/02 ,  H05K3/46

CPC分类号： H05K1/0245 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/0969 ,  Y10T29/49156

摘要： An exemplary FPCB includes a signal layer having a differential pair consisting of two transmission lines arranged therein, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. Two sheets made of conductive materials are respectively arranged at opposite sides of the differential pair, and both connected to ground. The sheets are apart from and parallel to the transmission lines. The ground layer has a void defined therein, and the void is located under the two transmission lines.

摘要翻译： 示例性FPCB包括具有由布置在其中的两条传输线组成的差分对的信号层，接地层和位于信号层和接地层之间的电介质层。 由导电材料制成的两片分别布置在差动对的相对两侧，并且都连接到地面。 纸张与传输线分开并平行。 接地层具有限定在其中的空隙，并且空隙位于两条传输线之下。

公开(公告)号：US20080245558A1

公开(公告)日：2008-10-09

申请号：US11927710

申请日：2007-10-30

申请人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU

发明人： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU

IPC分类号： H05K1/02 ,  H01R12/04 ,  H05K1/11

CPC分类号： H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09718

摘要： A printed circuit board (200) includes at least one via (280) defined therein, the via has an upper cap (220) formed on a top surface of the PCB, and a lower cap (240) formed on a bottom surface of the PCB. A conductive hole (290) is defined in the PCB having a plated sidewall (230) plated on its inner surface, and a first clearance hole (271) is defined in a first inner layer (260) of the PCB around the sidewall. A first transmission line (210) defined on the top surface of the PCB is coupled to the upper cap, a first void (273) extending from a boundary of the first clearance hole being disposed along the layout direction of the first transmission line.

摘要翻译： 印刷电路板（200）包括限定在其中的至少一个通孔（280），所述通孔具有形成在所述PCB的顶表面上的上盖（220）和形成在所述PCB的底表面上的下盖（240） PCB。 导电孔（290）限定在印刷电路板中，电镀侧壁（230）镀在其内表面上，第一间隙孔限定在PCB的围绕侧壁的第一内层（260）中。 限定在PCB的顶表面上的第一传输线（210）联接到上盖，沿着第一传输线的布置方向设置的从第一间隙孔的边界延伸的第一空隙（273）。

公开(公告)号：US20120145448A1

公开(公告)日：2012-06-14

申请号：US13031617

申请日：2011-02-22

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN ,  DAN-CHEN WU ,  JIA-CHI CHEN

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN ,  DAN-CHEN WU ,  JIA-CHI CHEN

IPC分类号： H05K1/11

CPC分类号： H05K1/0251 ,  H05K1/0225 ,  H05K1/0295 ,  H05K1/0298 ,  H05K1/113

摘要： A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.

摘要翻译： 具有复合通孔的印刷电路板（PCB）包括基板和穿过基板的一对通孔。 衬底包括作为衬底的顶层的信号层，与信号层相邻的第一参考层和不与信号层相邻的第二参考层。 第一和第二对焊盘安装在信号层上。 每个通孔延伸穿过第一对垫，使得通孔和第一对垫共同形成复合通孔。 第一保留开口形成在第一参考层上，并且对应于第一和第二对焊盘和复合通孔。 第二保留开口形成在第二参考层上并围绕其上的通孔。

公开(公告)号：US20120125679A1

公开(公告)日：2012-05-24

申请号：US13032653

申请日：2011-02-23

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN

IPC分类号： H05K1/11

CPC分类号： H05K1/0251 ,  H05K1/0245 ,  H05K1/116

摘要： A printed circuit board includes an insulating board, a pair of differential vias, and a number of wiring layers. A pair of via holes extends through opposite surfaces of the insulating board. The differential vias correspond to the pair of via holes. Each differential via includes a metal plated barrel and two via capture pads. The plated barrel is plated on the inner surface of the respective via hole, and terminates at each of the two opposite surfaces of the insulating board. The via capture pads are formed on the opposite surfaces of the insulating board around the openings of the via hole, and are electrically connected to the plated barrel. The wiring layers are arranged in the insulating board, and each define a clearance hole surrounding all of the via capture pads.

摘要翻译： 印刷电路板包括绝缘板，一对差动通孔和多个布线层。 一对通孔延伸穿过绝缘板的相对表面。 差分过孔对应于一对通孔。 每个差分通孔包括一个金属电镀桶和两个通孔捕获垫。 电镀桶被镀在相应通孔的内表面上，并且终止于绝缘板的两个相对表面的每一个。 通孔捕获垫形成在绝缘板的围绕通孔的开口的相对表面上，并且电连接到电镀桶。 布线层布置在绝缘板中，并且每个限定围绕所有通孔捕获垫的间隙孔。