公开(公告)号：US09177937B2

公开(公告)日：2015-11-03

申请号：US12880399

申请日：2010-09-13

申请人： Masayuki Mochizuki ,  Yasushi Ishii

发明人： Masayuki Mochizuki ,  Yasushi Ishii

IPC分类号： H01L23/00 ,  H01L23/12

CPC分类号： H01L24/75 ,  F16F15/28 ,  H01L24/83 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T29/5313

摘要： The present invention aims to provide a lightened reaction absorber or to provide a semiconductor assembling system with further shorter processing time and high productivity or high quality using the lightened reaction absorber. The present invention is based upon a reaction absorber provided with a counter mechanism equipped with a load unit moved in a predetermined direction by a first ball screw, a second ball screw that generates reactive force in a reverse direction to the predetermined direction and a driving unit having a driving motor that drives the first ball screw and the second ball screw, and has a characteristic of including a reaction absorbing unit with one end side equipped with a nut connected to the second ball screw and the other end side fixed to a unit base movable relatively to the counter mechanism.

摘要翻译： 本发明的目的在于提供一种减轻反应吸收剂，或提供一种半导体组装体系，其使用更轻的反应吸收剂，具有更短的加工时间和高的生产率或高质量。 本发明是基于一种反应吸收器，该反应吸收器设置有一个配备有通过第一滚珠丝杠沿预定方向移动的载荷单元的反作用机构，产生与预定方向相反的方向产生反作用力的第二滚珠丝杠和驱动单元 具有驱动第一滚珠丝杠和第二滚珠丝杠的驱动马达，具有包括反应吸收单元的特性，该反应吸收单元的一端侧配备有连接到第二滚珠丝杠的螺母，另一端侧固定在单元基座 相对于计数器机构可移动。

公开(公告)号：US08783319B2

公开(公告)日：2014-07-22

申请号：US13224536

申请日：2011-09-02

申请人： Takashi Yamagami ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

发明人： Takashi Yamagami ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

IPC分类号： B32B38/10

CPC分类号： H01L21/67028 ,  H01L21/67144 ,  H01L24/75 ,  H01L2924/10253 ,  Y10T156/14 ,  H01L2924/00

摘要： The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same.The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.

摘要翻译： 本发明的目的是提供一种异物移除装置，其能够快速有效地清洁基板表面，而不管其尺寸如何，并且防止一次去除的异物的再粘合以及提供装备有该物质的模具接合机。 本发明的异物清除装置包括：固定有其上载有模具的切割膜的拾取装置; 以及用于拾取与切割膜分离的模具的夹头，并将模具放置在其上施加有粘合剂的基板上，并且用于去除衬底上的异物以准备将粘合剂施加到基板上。 异物去除装置包括集成空气出口孔和空气入口孔的清洁喷嘴。

公开(公告)号：US20110052217A1

公开(公告)日：2011-03-03

申请号：US12850048

申请日：2010-08-04

申请人： Masayuki Mochizuki

发明人： Masayuki Mochizuki

IPC分类号： G03G15/00

CPC分类号： G03G15/80 ,  G03G15/2039

摘要： An image forming apparatus according to the present invention includes: a fixing part having a heater; a control part controlling ON/OFF of power distribution to the heater; a power source part generating a voltage for driving the control part; a main switch for turning ON/OFF power supply from outside to the power source part; and an interrupt signal generation part generating a periodical interrupt signal. The control part, based on the interrupt signal, controls ON/OFF of the power distribution to the heater, turns OFF power supply to the heater upon passage of predetermined time since disappearance of the interrupt signal, and judges that an error has occurred, when the control part is still driving after passage of driving stop time from when the main switch is turned OFF to when the control part stops its driving since the disappearance of the interrupt signal.

摘要翻译： 根据本发明的图像形成装置包括：具有加热器的固定部件; 控制部，其控制对所述加热器的配电的ON / OFF; 产生用于驱动所述控制部的电压的电源部; 用于从外部向电源部分接通/断开电源的主开关; 以及产生周期性中断信号的中断信号生成部。 控制部分基于中断信号控制对加热器的配电的ON / OFF，在由于中断信号消失之后经过预定时间后关闭对加热器的电源，并且判断发生了错误，当 控制部分在从主开关断开到从中断信号消失后控制部分停止其驱动的驱动停止时间之后仍然行驶。

公开(公告)号：US07824932B2

公开(公告)日：2010-11-02

申请号：US12436647

申请日：2009-05-06

申请人： Hideharu Kobashi ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

发明人： Hideharu Kobashi ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

IPC分类号： H01L21/66

CPC分类号： H01L22/12 ,  H01L21/67132 ,  H01L21/67271 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.

摘要翻译： 提供一种技术，其可以在芯片接合薄片的过程中从晶片片上拾取芯片时精确地识别要拾取的芯片。 相机耦合到镜筒的一端，物镜附着到镜筒的相对端，并且通过物镜拍摄芯片的主表面的图像。 在透镜筒和芯片之间内部设置表面发射照明单元，漫射板和半反射镜。 此外，设置具有沿着与照相机相同的光轴向芯片的主表面照射光的同轴放置点亮功能的另一个镜筒。

公开(公告)号：US07629231B2

公开(公告)日：2009-12-08

申请号：US11735741

申请日：2007-04-16

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US06765600B2

公开(公告)日：2004-07-20

申请号：US10147913

申请日：2002-05-20

申请人： Hiroaki Yamagishi ,  Hirosada Watanabe ,  Masayuki Mochizuki ,  Daisuke Fujita

发明人： Hiroaki Yamagishi ,  Hirosada Watanabe ,  Masayuki Mochizuki ,  Daisuke Fujita

IPC分类号： G01D1504

CPC分类号： G07C1/06

摘要： The present invention provides a time recorder with a card feed rate adjustment function making it possible to print data for arrival and departure times to and from a job side at a correct position within a print column by adjusting a feed rate for a time card according to extension or shrinkage of the time card or characteristics of the time card such as a printing state within the print column. An adjustment value is computed by reading a start point and an end point printed on a time card TA or TB inserted into the time recorder with the mark sensors 10, 11 and counting a feed rate for the time card TA or TB from the start point to the end point with the encoder sensor 12, and a feed rate for the car is adjusted according to the computed adjustment value.

摘要翻译： 本发明提供了一种具有卡进给速率调节功能的时间记录器，使得可以通过根据下面的方式调整时间卡的进给速率来打印在打印列内的正确位置的到达和离开作业侧的数据： 时间卡的延伸或收缩或时间卡的特性，如打印列中的打印状态。 通过读取用标记传感器10,11插入到时间记录器中的时间卡TA或TB上打印的开始点和终点并从起始点计数时间卡TA或TB的进给速率来计算调整值 到编码器传感器12的终点，并且根据所计算的调整值来调整汽车的进给速率。

公开(公告)号：US06228784B1

公开(公告)日：2001-05-08

申请号：US09123568

申请日：1998-07-27

申请人： Masayuki Mochizuki ,  Mayumi Yoshida ,  Torataro Kobayashi ,  Kanjiro Kobayashi ,  Jutaro Kobayashi

发明人： Masayuki Mochizuki ,  Mayumi Yoshida ,  Torataro Kobayashi ,  Kanjiro Kobayashi ,  Jutaro Kobayashi

IPC分类号： B32B2716

CPC分类号： B32B27/12 ,  A41D31/0027 ,  B32B7/12 ,  B32B2255/205 ,  B32B2375/00 ,  B32B2437/00 ,  Y10S428/92 ,  Y10S428/921 ,  Y10T442/2631

摘要： There is disclosed a heat resistant cloth for fire fighting. At least an inner surface of a fluororesin film is subjected to plasma discharge treatment to form a treated surface. A vacuum-deposition film made of a bright metal such as aluminum is formed on the treated surface of the fluororesin film without use of a primer. The vacuum-deposition film on the treated surface is bonded to an outer surface of a substrate fabric through use of a silicone rubber adhesive in order to form a heat-reflecting layer on the outer surface of the substrate fabric. Since no primer coating layer is used, the heat reflecting layer can prevent a decrease in brightness, which would otherwise occur due to cracks generated in the primer coating layer. Thus, a decrease in heat reflectivity at high temperature is prevented. Since no flammable synthetic resin layer is used at the surface of the heat reflecting layer, flame resistance can be improved.

摘要翻译： 公开了用于消防的耐热布。 至少对氟树脂膜的内表面进行等离子体放电处理以形成处理表面。 在氟树脂膜的处理表面上不使用底漆形成由诸如铝的光亮金属制成的真空沉积膜。 通过使用硅橡胶粘合剂将处理过的表面上的真空沉积膜结合到基底织物的外表面上，以在基底织物的外表面上形成热反射层。 由于没有使用底漆涂层，因此热反射层可以防止由于底漆涂层中产生的裂纹而导致的亮度降低。 因此，防止了高温下的热反射率的降低。 由于在热反射层的表面不使用可燃性合成树脂层，因此可以提高阻燃性。

公开(公告)号：US08991681B2

公开(公告)日：2015-03-31

申请号：US13412684

申请日：2012-03-06

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Yukio Tani ,  Takehito Mochizuki

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Yukio Tani ,  Takehito Mochizuki

IPC分类号： B23K31/00 ,  B23K31/02 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00 ,  H01L21/00 ,  H01L21/02 ,  H01L21/677 ,  H01L21/64

CPC分类号： H01L24/75 ,  H01L21/00 ,  H01L21/02 ,  H01L21/64 ,  H01L21/67 ,  H01L21/67144 ,  H01L21/677 ,  H01L21/68 ,  H01L21/682 ,  H01L24/00 ,  H01L24/01 ,  H01L24/02 ,  H01L24/10 ,  H01L2224/0401

摘要： A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an already-bonded die and then laminated.In the die bonder and bonding method in which a die is picked up from a wafer by a pick-up head which then places the die on an alignment stage, and the die is picked up from the alignment stage by a bonding head which then bond the die onto a substrate or an already-bonded die, a posture of the die is rotated through predetermined degrees on a plane parallel to a plane on which the bonding is performed, before the bonding head picks up the die from the alignment stage.

摘要翻译： 公开了一种管芯接合器和接合方法，其可以提供高质量的产品，特别是即使模具相对于已经结合的模具旋转预定角度然后层压。 在芯片接合器和接合方法中，其中通过拾取头从晶片上拾取管芯，然后将引线放置在校准台上，并且通过接合头从对准阶段拾取管芯，该接合头接合 模具到基板或已经结合的模具上，在接合头从对准台上取出模具之前，模具的姿态在与进行接合的平面平行的平面上旋转预定的角度。

公开(公告)号：US20100055878A1

公开(公告)日：2010-03-04

申请号：US12618292

申请日：2009-11-13

申请人： Hiroshi MAKI ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi MAKI ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/304

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US20080057599A1

公开(公告)日：2008-03-06

申请号：US11850503

申请日：2007-09-05

申请人： Hideharu Kobashi ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

发明人： Hideharu Kobashi ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

IPC分类号： H01L21/66

CPC分类号： H01L22/12 ,  H01L21/67132 ,  H01L21/67271 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.

摘要翻译： 提供一种技术，其可以在芯片接合薄片的过程中从晶片片上拾取芯片时精确地识别要拾取的芯片。 相机耦合到镜筒的一端，物镜附着到镜筒的相对端，并且通过物镜拍摄芯片的主表面的图像。 在透镜筒和芯片之间内部设置表面发射照明单元，漫射板和半反射镜。 此外，设置具有沿着与照相机相同的光轴向芯片的主表面照射光的同轴放置点亮功能的另一个镜筒。