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    Laser beam processing machine
    11.
    发明申请
    Laser beam processing machine 有权
    激光束加工机

    公开(公告)号：US20070243696A1

    公开(公告)日：2007-10-18

    申请号：US11808384

    申请日：2007-06-08

    Applicant: Satoshi Kobayashi ,  Keiji Nomaru ,  Yosuke Watanabe

    Inventor： Satoshi Kobayashi ,  Keiji Nomaru ,  Yosuke Watanabe

    IPC: H01L21/00

    CPC classification number: B23K26/0613 ,  B23K26/0604 ,  B23K26/067 ,  B23K26/0838 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/52

    Abstract: A laser beam processing machine comprising a path distribution means for distributing a pulse laser beam oscillated by pulse laser beam oscillation means to a first path and a second path alternately, and one laser beam that passes through one of the paths and is converged by one condensing lens and the other laser beam that passes through the other path and is converged by the condensing lens are applied at different focusing points which have been displaced from each other in the direction of the optical axis, alternately with a time lag between them.

    Abstract translation: 一种激光束处理机，包括：路径分布装置，用于将由脉冲激光束振荡装置振荡的脉冲激光束交替地分配到第一路径和第二路径;以及一个激光束，其穿过一条路径并被一个会聚 透镜和通过另一路径并被聚光透镜会聚的另一激光束被施加在彼此沿着光轴方向相互偏移的不同聚焦点处，它们之间的时间间隔交替。

    Fold-type data processing apparatus having a hinge
    13.
    发明授权
    Fold-type data processing apparatus having a hinge 有权
    具有铰链的折叠式数据处理装置

    公开(公告)号：US07096540B2

    公开(公告)日：2006-08-29

    申请号：US10721880

    申请日：2003-11-26

    Applicant: Yosuke Watanabe ,  Masatomo Mizuta ,  Mitsuru Sendouda

    Inventor： Yosuke Watanabe ,  Masatomo Mizuta ,  Mitsuru Sendouda

    IPC: H04M1/00 ,  H04B1/38

    CPC classification number: H04M1/0212 ,  E05D3/10 ,  E05D11/1078 ,  E05Y2900/606 ,  G06F1/1616 ,  G06F1/1681 ,  Y10T16/5403 ,  Y10T16/547 ,  Y10T16/5472 ,  Y10T16/551 ,  Y10T16/557

    Abstract: A fold-type cellular phone has a top unit, a bottom unit and a hinge coupling together the top unit and the bottom unit while allowing the top unit to turn and swivel with respect to the bottom unit. The top unit is first unfolded from a first folded position to an attitude angle of 160 to 170 degrees, and swiveled by 180 degrees to be folded onto the bottom unit in a second folded position at an attitude angle of 180 degrees. The swivel movement of the top unit causes a cam assembly to turn the top unit from the attitude angle of 160–170 degrees to an attitude angle of 180 degrees in the second folded position, thereby allowing the top unit to assume a suitable attitude with respect to the bottom unit.

    Abstract translation: 折叠型蜂窝电话具有顶部单元，底部单元和联接在一起的顶部单元和底部单元的铰链，同时允许顶部单元相对于底部单元旋转和旋转。 顶部单元首先从第一折叠位置展开至160至170度的姿态角度，并以180度的姿态角度以第二折叠位置旋转180度以折叠到底部单元上。 顶部单元的旋转运动导致凸轮组件将顶部单元从160-170度的姿态角度转到第二折叠位置的180度的姿态角度，从而允许顶部单元相对于 到底部单位。

    Rubber composition
    15.
    发明授权
    Rubber composition 有权
    橡胶组成

    公开(公告)号：US09068055B2

    公开(公告)日：2015-06-30

    申请号：US14110043

    申请日：2012-04-24

    Applicant: Yosuke Watanabe ,  Orhan Ozturk ,  Yasuo Uekita

    Inventor： Yosuke Watanabe ,  Orhan Ozturk ,  Yasuo Uekita

    IPC: C08K5/20 ,  B60C1/00 ,  C08K5/17 ,  C08L21/00

    CPC classification number: C07C235/68 ,  B29B7/7495 ,  B60C1/00 ,  B60C1/0008 ,  B60C1/0016 ,  B60C1/0025 ,  B60C1/0041 ,  C08K3/013 ,  C08K5/17 ,  C08K5/20 ,  Y10T152/10495 ,  Y10T152/1081 ,  C08L21/00 ,  C08K3/0033

    Abstract: A rubber composition obtained by kneading at least one selected from the group consisting of (A1), (B1), (C1) and (D1), a rubber component and a filler, and a method of improving the viscoelastic property of vulcanized rubber, comprising a first step of kneading at least one selected from the group consisting of (A1), (B1), (C1) and (D1), a rubber component, a filler and a sulfur component and a second step of thermally treating the kneaded material obtained in the previous step. (A1): a compound represented by formula (I) (B1): a salt of a compound represented by formula (I) (C1): a solvate of a compound represented by formula (I) (D1): a solvate of a salt of a compound represented by formula (I).

    Abstract translation: 通过捏合从（A1），（B1），（C1）和（D1）组成的组中选择的至少一种橡胶组分和填料获得的橡胶组合物和改进硫化橡胶的粘弹性的方法， 包括：捏合从（A1），（B1），（C1）和（D1）组成的组中选出的至少一种的橡胶组分，填料和硫组分的第一步骤，以及第二步， 在上一步中获得的材料。 （A1）：由式（I）表示的化合物（B1）：由式（I）表示的化合物的盐（C1）：由式（I）（D1）表示的化合物的溶剂合物： 由式（I）表示的化合物的盐。

    Method of forming a modified layer in a substrate
    17.
    发明授权
    Method of forming a modified layer in a substrate 有权
    在基材中形成改性层的方法

    公开(公告)号：US07927974B2

    公开(公告)日：2011-04-19

    申请号：US12270649

    申请日：2008-11-13

    Applicant: Yosuke Watanabe ,  Kenji Furuta ,  Kiyoshi Ohsuga

    Inventor： Yosuke Watanabe ,  Kenji Furuta ,  Kiyoshi Ohsuga

    IPC: H01L21/00

    CPC classification number: B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78

    Abstract: First, mapping data storing interrupted areas is obtained. In a first modified-layer forming step, before a stacked article is stacked on a front surface of a substrate, a laser beam is directed to the interrupted areas based on the mapping data to form modified layers only at the interrupted areas. After the stacked articles have been stacked on the substrate, in a second modified-layer forming step, the laser beam is directed at least to the predetermined dividing line formed with no modified layer in the first modified-layer forming step to form a modified layer.

    Abstract translation: 首先，获得存储中断区域的映射数据。 在第一改质层形成工序中，在堆叠制品层叠在基板的正面上之前，基于映射数据将激光束导向到中断区域，仅在中断区域形成修饰层。 在层叠的物品堆叠在基板上之后，在第二改质层形成工序中，在第一改质层形成工序中，至少将激光束指向不具有改性层的规定的分割线，形成修饰层 。

    Method of forming embrittled areas inside wafer for division
    19.
    发明授权
    Method of forming embrittled areas inside wafer for division 有权
    在晶片内部形成脆化区域的划分方法

    公开(公告)号：US07728257B2

    公开(公告)日：2010-06-01

    申请号：US11878449

    申请日：2007-07-24

    Applicant: Yosuke Watanabe

    Inventor： Yosuke Watanabe

    IPC: B23K26/02 ,  H01L21/00

    CPC classification number: H01L21/78 ,  B23K26/38 ,  H01L21/67092

    Abstract: A method of forming embrittled areas in multiple layers inside a wafer so as to enable the wafer to be divided correctly even at areas where embrittled areas intersect. In a first direction embrittling step an embrittled area is formed as a bottom layer, in a second direction embrittling step embrittled areas are formed as a bottom layer and a second layer, in the first direction embrittling step the embrittled areas are formed as a second layer and a third layer, and thereafter, the second direction embrittling step and the first direction embrittling step are alternately implemented, and finally, in the second direction embrittling step, embrittled area is formed as a top layer, so that a length of an unprocessed area is contained within a range that does not interfere with division.

    Abstract translation: 一种在晶片内形成多层脆化区域的方法，以便即使在脆化区域相交的区域也能够正确地分割晶片。 在第一方向脆化步骤中，脆化区域形成为底层，在第二方向脆化步骤中，脆化区域形成为底层和第二层，在第一方向脆化步骤中，脆化区域形成为第二层 和第三层，然后交替地实施第二方向脆化步骤和第一方向脆化步骤，最后，在第二方向脆化步骤中，形成脆化区域作为顶层，使得未加工区域的长度 包含在不干扰分裂的范围内。

    METHOD OF FORMING A MODIFIED LAYER IN A SUBSTRATE
    20.
    发明申请
    METHOD OF FORMING A MODIFIED LAYER IN A SUBSTRATE 有权
    在基板上形成改性层的方法

    公开(公告)号：US20090149002A1

    公开(公告)日：2009-06-11

    申请号：US12270649

    申请日：2008-11-13

    Applicant: Yosuke Watanabe ,  Kenji Furuta ,  Kiyoshi Ohsuga

    Inventor： Yosuke Watanabe ,  Kenji Furuta ,  Kiyoshi Ohsuga

    IPC: H01L21/268

    CPC classification number: B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78

    Abstract: First, mapping data storing interrupted areas is obtained. In a first modified-layer forming step, before a stacked article is stacked on a front surface of a substrate, a laser beam is directed to the interrupted areas based on the mapping data to form modified layers only at the interrupted areas. After the stacked articles have been stacked on the substrate, in a second modified-layer forming step, the laser beam is directed at least to the predetermined dividing line formed with no modified layer in the first modified-layer forming step to form a modified layer.

    Abstract translation: 首先，获得存储中断区域的映射数据。 在第一改质层形成工序中，在堆叠制品层叠在基板的正面上之前，基于映射数据将激光束导向到中断区域，仅在中断区域形成修饰层。 在层叠的物品堆叠在基板上之后，在第二改质层形成工序中，在第一改质层形成工序中，至少将激光束指向不具有改性层的规定的分割线，形成修饰层 。

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