Method of Transferring Thin Films
    20.
    发明申请
    Method of Transferring Thin Films 审中-公开
    转移薄膜的方法

    公开(公告)号:US20140087191A1

    公开(公告)日:2014-03-27

    申请号:US14119830

    申请日:2012-05-23

    IPC分类号: B32B37/00

    摘要: The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.

    摘要翻译: 本发明公开了一种将薄膜从第一衬底转移到第二衬底的方法,包括以下步骤:提供设置在第一衬底的表面上的转移结构和薄膜,所述转移结构包括支撑层和 膜接触层,其中所述转移结构接触所述薄膜; 去除第一衬底以获得具有与膜接触层接触的薄膜的转移结构; 使获得的转印结构与第二基板的表面接触; 并除去膜接触层,从而将薄膜转移到第二基板的表面上。