公开(公告)号：US07345362B2

公开(公告)日：2008-03-18

申请号：US10932893

申请日：2004-09-02

申请人： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

发明人： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/552 ,  H01L23/02 ,  H01L29/22 ,  H01L33/00 ,  H01L23/12

CPC分类号： H01L24/80 ,  H01L21/50 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference. At the bottom of the package is a shield electrode, on which a chip is mounted via an adhesion layer. The chip and the internal contact electrode are electrically connected by an interconnection wire. Location aligning for the chip and the interconnection wire, at least either one of these, is conducted by making use of a region, which is non-electrode portion, provided on the inner bottom surface of the package.

摘要翻译： 一种电子部件，其中芯片可以以高精度水平安装在封装的某个预定位置，该封装在空腔的内壁中具有台阶级差。 该封装件在内壁表面上具有台阶级差，而形成在阶梯级差的上表面上的内部接触电极。 在封装的底部是屏蔽电极，其上通过粘合层安装芯片。 芯片和内部接触电极通过互连线电连接。 通过利用设置在封装的内底面上的非电极部分的区域来进行芯片和互连线的位置对准，其中至少任一个进行。

公开(公告)号：US06804103B1

公开(公告)日：2004-10-12

申请号：US09856822

申请日：2001-08-27

申请人： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

发明人： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

IPC分类号： H01H4700

CPC分类号： H01L24/80 ,  H01L21/50 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package 13 is provided with a stepped level-difference 26 in the inner wall surface, and an internal contact electrode 14 formed on the upper surface of the stepped level-difference 26. At the bottom of the package 13 is a shield electrode 15, on which a chip 17 is mounted via an adhesion layer 16. The chip 17 and the internal contact electrode 14 are electrically connected by an interconnection wire 19. Location aligning for the chip 17 and the interconnection wire 19, at least either one of these, is conducted by making use of a region 18a, 18b, which is non-electrode portion, provided on the inner bottom surface of the package 13.

摘要翻译： 一种电子部件，其中芯片可以以高精度水平安装在封装的某个预定位置，该封装在空腔的内壁中具有台阶级差。 封装13在内壁表面设置阶梯级差26，在台阶级差26的上表面上形成有内部接触电极14.封装13的底部是屏蔽电极15， 芯片17通过粘合层16安装在芯片17上。芯片17和内部接触电极14通过互连线19电连接。芯片17和互连线19的位置对准，这些中的至少一个， 通过利用设置在包装13的内底面上的非电极部分的区域18a，18b进行。

公开(公告)号：US5932950A

公开(公告)日：1999-08-03

申请号：US693383

申请日：1996-08-06

申请人： Toru Yamada ,  Toshio Ishizaki ,  Kazunori Nishimura ,  Kozo Murakami

发明人： Toru Yamada ,  Toshio Ishizaki ,  Kazunori Nishimura ,  Kozo Murakami

IPC分类号： H03H7/38 ,  H03H9/00 ,  H03H9/05 ,  H03H9/64 ,  H01L41/08

CPC分类号： H03H9/6479 ,  H03H9/0028 ,  H03H9/0542 ,  H03H9/14591 ,  H03H9/14597 ,  H03H9/6433 ,  H03H9/6463 ,  H03H7/38

摘要： A SAW resonator disposed with an IDT electrode and reflector electrodes is formed on the surface of a piezoelectric substrate. Three pieces of the SAW resonator form an acoustic coupling by being disposed close to each other, electrode fingers comprising the IDT electrode in the center are all grounded, and IDT electrode fingers are electrically independent on the side to be connected to input-output terminals of the IDT electrodes disposed outside. As a result, three excitation modes having different propagation frequencies are generated which are used to attain a broad band SAW resonator filter. When these three pairs of the IDT electrode are electrically independent, a balanced input-output can be achieved, and excellent out-of-band rejection characteristics can be obtained.

摘要翻译： 设置有IDT电极和反射器电极的SAW谐振器形成在压电基板的表面上。 三个SAW谐振器通过彼此靠近地布置形成声耦合，包括中心的IDT电极的电极指全部接地，并且IDT电极指在与要连接到的输入输出端子 IDT电极位于外部。 结果，产生了具有不同传播频率的三种激励模式，用于获得宽带SAW谐振滤波器。 当这三对IDT电极是电独立的时，可以实现平衡的输入 - 输出，并且可以获得优异的带外抑制特性。

公开(公告)号：US08471433B2

公开(公告)日：2013-06-25

申请号：US12903326

申请日：2010-10-13

申请人： Toru Yamaji ,  Tetsuhiro Korechika ,  Koji Kawakita ,  Eiji Kawamoto ,  Mitsuhiro Furukawa ,  Kozo Murakami

发明人： Toru Yamaji ,  Tetsuhiro Korechika ,  Koji Kawakita ,  Eiji Kawamoto ,  Mitsuhiro Furukawa ,  Kozo Murakami

IPC分类号： H03H9/02 ,  H03H9/05

CPC分类号： H03H9/132 ,  H03H9/059 ,  H03H9/1092

摘要： An elastic wave device has the following elements: a piezoelectric substrate; an inter-digital transducer (IDT) electrode disposed on the piezoelectric substrate; internal electrodes disposed above the piezoelectric substrate and electrically connected to the IDT electrode; side walls disposed above the internal electrodes surrounding the IDT electrode; a cover disposed above the side walls so as to cover a space above the IDT electrode; an electrode base layer disposed on the internal electrodes outside the side walls; and connection electrodes disposed on the electrode base layer. Each connection electrode has a first connection electrode disposed on the electrode base layer, and a second connection electrode disposed on the first connection electrode. The horizontal sectional shape of the second connection electrode is non-circular.

摘要翻译： 弹性波器件具有以下元件：压电基片; 配置在所述压电基板上的数字式换能器（IDT）电极; 内部电极设置在压电基板上并电连接到IDT电极; 设置在围绕IDT电极的内部电极上方的侧壁; 设置在所述侧壁上方以覆盖所述IDT电极上方的空间的盖; 设置在侧壁外侧的内部电极上的电极基层; 以及设置在电极基底层上的连接电极。 每个连接电极具有设置在电极基底层上的第一连接电极和设置在第一连接电极上的第二连接电极。 第二连接电极的水平截面形状是非圆形的。

公开(公告)号：US06848153B2

公开(公告)日：2005-02-01

申请号：US10315091

申请日：2002-12-10

申请人： Shigeru Tsuzuki ,  Kunihiro Fujii ,  Masahiro Takada ,  Satoshi Matsuo ,  Takafumi Koga ,  Kozo Murakami

发明人： Shigeru Tsuzuki ,  Kunihiro Fujii ,  Masahiro Takada ,  Satoshi Matsuo ,  Takafumi Koga ,  Kozo Murakami

IPC分类号： H03H9/25 ,  H03H3/08 ,  H03H9/10 ,  H04R17/00

CPC分类号： H03H9/1071 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  Y10T29/42 ,  Y10T29/49117 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of manufacture of a surface acoustic wave device which includes a step of applying a photosensitive film resist on a substrate and forming a photosensitive film resist layer over at least a portion of a surface of the substrate; a step of forming acoustic absorbers only at the two sides orthogonal to the direction of the surface acoustic wave transmission; a step of placing in a package a surface acoustic wave element obtained by cutting and dividing the substrate and electrically connecting a connection electrode of the surface acoustic wave element with an external terminal of the package; and a step of sealing an opening of the package with a lid, wherein the main surface of the acoustic absorbers is formed parallel to the surface of the substrate.

摘要翻译： 一种声表面波装置的制造方法，其特征在于，在基板的表面的至少一部分上形成感光性膜保护层， 仅在与声表面波传播方向正交的两侧形成声吸收体的步骤; 在包装中放置表示声波元件的步骤，该表面声波元件是通过切割和分割基板并将表面声波元件的连接电极与封装的外部端子电连接而获得的; 以及用盖子密封包装的开口的步骤，其中吸声器的主表面平行于基板的表面形成。

公开(公告)号：US5581141A

公开(公告)日：1996-12-03

申请号：US319790

申请日：1994-10-07

申请人： Toru Yamada ,  Toshio Ishizaki ,  Kazunori Nishimura ,  Kozo Murakami

发明人： Toru Yamada ,  Toshio Ishizaki ,  Kazunori Nishimura ,  Kozo Murakami

IPC分类号： H03H7/38 ,  H03H9/00 ,  H03H9/05 ,  H03H9/64 ,  H01L41/08

CPC分类号： H03H9/6479 ,  H03H9/0028 ,  H03H9/0542 ,  H03H9/14591 ,  H03H9/14597 ,  H03H9/6433 ,  H03H9/6463 ,  H03H7/38

摘要： A SAW resonator disposed with an IDT electrode and reflector electrodes is formed on the surface of a piezoelectric substrate. Three pieces of the SAW resonator form an acoustic coupling by being disposed close to each other, electrode fingers comprising the IDT electrode in the center are all grounded, and IDT electrode fingers are electrically independent on the side to be connected to input-output terminals of the IDT electrodes disposed outside. As a result, three excitation modes having different propagation frequencies are generated which are used to attain a broad band SAW resonator filter. When these three pairs of the IDT electrode are electrically independent, a balanced input-output can be achieved, and excellent out-of-band rejection characteristics can be obtained.

公开(公告)号：US07394462B2

公开(公告)日：2008-07-01

申请号：US10207982

申请日：2002-07-31

申请人： Kozo Murakami

发明人： Kozo Murakami

IPC分类号： G06T15/00

CPC分类号： G06T1/20

摘要： A superimposing apparatus and method for broadcasting a 3DCG image can calculate and superimpose additional information such as characters and figures expressed by a 3DCG image on a TV frame in real time by combining a general three-dimensional graphics accelerator board and a conventional TV broadcasting hardware and devising a software processing. The superimposing apparatus performs a rendering process for rendering a 3DCG image datum by a three-dimensional graphics accelerator and a mixing process for mixing a 3DCG image and an input TV signal by a superimposer. The rendering process is carried out concurrently with the mixing process. A frame to be mixed is a previous frame advanced by one frame from a frame to be concurrently rendered. A system memory to be read out is changed to even frames and odd frames in accordance with an input TV signal so as to avoid an interference of rendering and superimposing.

摘要翻译： 用于广播3DCG图像的叠加装置和方法可以通过组合一般的三维图形加速器板和传统的电视广播硬件来实时地计算和叠加由3DCG图像表示的诸如字符和图形的附加信息在TV帧上， 设计软件处理。 叠加装置执行用于通过三维图形加速器渲染3DCG图像数据的渲染处理和用于通过叠加器混合3DCG图像和输入TV信号的混合处理。 渲染过程与混合过程同时进行。 要混合的帧是从要同时渲染的帧提前一帧的先前帧。 要读出的系统存储器根据输入的TV信号改变为偶数帧和奇数帧，以避免渲染和叠加的干扰。

公开(公告)号：US06680528B2

公开(公告)日：2004-01-20

申请号：US09897423

申请日：2001-07-03

申请人： Satoshi Matsuo ,  Kunihiro Fujii ,  Takafumi Koga ,  Kozo Murakami

发明人： Satoshi Matsuo ,  Kunihiro Fujii ,  Takafumi Koga ,  Kozo Murakami

IPC分类号： H01L2312

CPC分类号： H01L23/49805 ,  H01L23/13 ,  H01L2224/48227

摘要： An electronic component having recesses on side faces of its package for housing an electric element therein. A metal layer that does not reach the bottom end of the package is formed on the surface of the recess. The metal layer has excellent wettability to a brazing material and helps extra material flow into the recess easily. In addition, the interface between the top end face of the recess and the side face is curved to make the brazing material flow into the recess easily. When the opening of the package is sealed with a lid using the brazing material, the extra brazing material flows into the recess. This prevents the brazing material from protruding outside of the package and thus improves dimensional accuracy of the electronic component. Therefore, mounting accuracy of the electronic component can be improved and short circuit can be prevented.

摘要翻译： 一种电子部件，其在其封装的侧面上具有凹部，用于在其中容纳电气元件。 在凹部的表面上形成没有到达封装的底端的金属层。 金属层对钎焊材料具有优异的润湿性，并且有助于额外的材料容易地流入凹部。 此外，凹部的顶端面与侧面之间的界面是弯曲的，以使钎焊材料容易地流入凹部。 当使用钎焊材料用盖子密封包装的开口时，额外的钎焊材料流入凹部。 这防止钎焊材料突出到包装外部，从而提高电子部件的尺寸精度。 因此，能够提高电子部件的安装精度，能够防止短路。