公开(公告)号：US20170256479A1

公开(公告)日：2017-09-07

申请号：US15600793

申请日：2017-05-22

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu ,  Wei-Jen Lai

IPC: H01L23/495 ,  H01L23/60

CPC classification number: H01L23/49503 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/053 ,  H01L23/481 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/60 ,  H01L24/17 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/186 ,  H01L2924/19105 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.

公开(公告)号：US08985807B2

公开(公告)日：2015-03-24

申请号：US13586287

申请日：2012-08-15

Applicant: Chen Hui-Hsiung ,  Lai Wei-Jen

Inventor： Chen Hui-Hsiung ,  Lai Wei-Jen

IPC: F21S4/00 ,  F21V7/04 ,  F21V29/00 ,  F21V13/02 ,  G09F13/04 ,  H01R33/00 ,  F21V8/00 ,  H01R12/73 ,  H05K1/02

CPC classification number: F21V7/04 ,  F21V13/02 ,  F21V29/00 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02F2201/00 ,  G09F13/04 ,  H01R12/737 ,  H01R33/00 ,  H05K1/0284

Abstract: The invention provides an electrical connector and a backlight module using that electrical connector. The electrical connector includes a body and two conducting lines. The body is provided with first and second connecting portions, the former of which has a first connecting surface and the latter has a second connecting surface. An invariable relative angle is defined between the first and second connecting surfaces. The conducting lines are coated on the first and second connecting surfaces without crossing each other. The backlight module includes a light guide plate, two LED light bars mounted to two respective light receiving edges of the light guide plate, and an aforesaid electrical connector connecting the LED light bars. The electrical connector is electrically connected with the LED light bars and fixes their relative positions. Besides, it is easy to install the electrical connector to connect the LED light bars firmly.

Abstract translation: 本发明提供了使用该电连接器的电连接器和背光模块。 电连接器包括主体和两条导线。 主体设置有第一和第二连接部分，其中前者具有第一连接表面，并且后者具有第二连接表面。 在第一和第二连接表面之间限定一个不变的相对角度。 导线被涂覆在第一和第二连接表面上而不彼此交叉。 背光模块包括导光板，安装到导光板的两个相应的光接收边缘的两个LED灯条以及连接LED灯条的上述电连接器。 电连接器与LED灯条电连接并固定其相对位置。 此外，很容易安装电连接器牢固地连接LED灯条。

公开(公告)号：US09859193B2

公开(公告)日：2018-01-02

申请号：US15600793

申请日：2017-05-22

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu ,  Wei-Jen Lai

IPC: H01L23/495 ,  H01L23/60

CPC classification number: H01L23/49503 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/053 ,  H01L23/481 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/60 ,  H01L24/17 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/186 ,  H01L2924/19105 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.

公开(公告)号：US09801282B2

公开(公告)日：2017-10-24

申请号：US15232808

申请日：2016-08-10

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu

IPC: H05K7/10 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H05K3/18 ,  H05K3/40 ,  H05K3/00 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K1/181 ,  H05K1/0218 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

公开(公告)号：US20160353575A1

公开(公告)日：2016-12-01

申请号：US15232808

申请日：2016-08-10

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0218 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

Abstract translation: 封装结构包括基板，传感器，基座，引线框架，导电通孔和图案化电路层。 基板包括部件布置区域和电极触点。 传感器设置在部件布置区域处并电连接到电极触点。 基座覆盖基板与其接合表面，并且包括接收腔，在接收腔的底表面和接合表面之间延伸的倾斜表面，以及设置在接合表面上并电连接到电极触头的电极。 传感器位于接收腔中。 引线框架设置在基座上。 导电通孔穿透基座并电连接到引线框架。 图案化电路层设置在倾斜表面上并电连接到导电通孔和电极。