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    Package structure
    1.
    发明授权
    Package structure 有权

    公开(公告)号：US10134668B2

    公开(公告)日：2018-11-20

    申请号：US15657208

    申请日：2017-07-24

    Applicant: IBIS Innotech Inc.

    Inventor： Wen-Chun Liu ,  Wei-Jen Lai

    IPC: H01L23/495 ,  H01L23/498 ,  H01L23/00

    Abstract: A package structure includes a lead frame, an insulator, a plurality of conductive vias, a patterned metal layer, and a chip. The lead frame includes a plurality of contacts. The insulator covers the lead frame. The conductive vias are disposed on the insulator and connected to the contacts. The patterned metal layer covers an outer surface of the insulator and includes a groove and a circuit portion. The circuit portion is connected to and covers the conductive vias and contacts. The groove surrounds the circuit portion such that the circuit portion is electrically insulated from the rest of the patterned metal layer. A surface of the insulator exposed by the groove is lower than the outer surface. The chip is disposed on the insulator and electrically connected to the circuit portion.

    CERAMIC CIRCUIT BOARD AND LED PACKAGE MODULE USING THE SAME
    5.
    发明申请
    CERAMIC CIRCUIT BOARD AND LED PACKAGE MODULE USING THE SAME 审中-公开
    陶瓷电路板和使用其的LED封装模块

    公开(公告)号：US20150060929A1

    公开(公告)日：2015-03-05

    申请号：US14171432

    申请日：2014-02-03

    Applicant: IBIS INNOTECH INC.

    Inventor： Wei-Jen LAI

    IPC: H05K1/03 ,  H01L33/48

    CPC classification number: H05K1/0306 ,  H01F27/2804 ,  H01L23/15 ,  H01L23/49838 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H05K2201/0175 ,  H01L2924/00

    Abstract: A ceramic circuit board includes a substrate made of Al2O3 or AlN and having an exterior surface and a groove recessed from the exterior surface. The groove has a bottom surface provided with a roughness Ra of 1-20 μm, a plurality of crests and a plurality of troughs. The crests are located in an imaginary plane separated from the exterior surface at a distance of 1-100 μm. An electro-conductive wire is embedded in the groove and has a top surface flush with the exterior surface. An LED package module includes a ceramic circuit board having two embedded electro-conductive wires, two bonding pads respectively mounted on the top surfaces of the wires, and an LED chip having two contacts electrically connected with the bonding pads respectively. The electro-conductive wire is connected with the substrate firmly and made relatively thicker capable of carrying a relatively larger electric current.

    Abstract translation: 陶瓷电路板包括由Al 2 O 3或AlN制成并具有外表面和从外表面凹陷的凹槽的基底。 凹槽具有设置有1-20μm粗糙度Ra，多个波峰和多个槽的底表面。 波峰位于与外表面隔开的虚拟平面上，距离为1-100μm。 导电线嵌入槽中并具有与外表面齐平的顶表面。 LED封装模块包括具有两个嵌入式导电线的陶瓷电路板，分别安装在导线顶表面上的两个焊盘，以及分别与焊盘电连接的两个触点的LED芯片。 导电线牢固地与基板连接，并且能够承载相对较大电流的相对较厚。

    PACKAGE STRUCTURE
    8.
    发明申请
    PACKAGE STRUCTURE 有权
    包装结构

    公开(公告)号：US20160233152A1

    公开(公告)日：2016-08-11

    申请号：US15133244

    申请日：2016-04-20

    Applicant: IBIS Innotech Inc.

    Inventor： Wen-Chun Liu

    IPC: H01L23/495 ,  H01L21/768

    CPC classification number: H01L23/49586 ,  H01L21/4828 ,  H01L21/76823 ,  H01L21/76825 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: A package structure includes a lead frame, a selective-electroplating epoxy compound, conductive vias and a patterned circuit layer. The lead frame includes a metal stud array having metal studs. The selective-electroplating epoxy compound covers the metal stud array. The selective-electroplating epoxy compound includes non-conductive metal complex. The conductive vias are directly embedded in the selective electroplating epoxy compound to be respectively connected to the metal studs and extended to a top surface of the selective-electroplating epoxy compound. Each of the conductive vias includes a lower segment connected to the corresponding metal stud and an upper segment connected to the lower segment and extended to the top surface, and a smallest diameter of the upper segment is greater than a largest diameter of the lower segment. The patterned circuit layer is directly disposed on the top surface and electrically connected to the conductive vias.

    Abstract translation: 封装结构包括引线框，选择性电镀环氧化合物，导电通孔和图案化电路层。 引线框架包括具有金属螺柱的金属螺柱阵列。 选择性电镀环氧化合物覆盖金属螺柱阵列。 选择性电镀环氧化合物包括非导电金属络合物。 导电通孔直接嵌入选择性电镀环氧化合物中，以分别连接到金属螺柱并延伸到选择性电镀环氧化合物的顶表面。 每个导电通孔包括连接到相应的金属螺柱的下部段和连接到下部段并延伸到顶部表面的上段，并且上段的最小直径大于下段的最大直径。 图案化电路层直接设置在顶表面上并电连接到导电通孔。

    FERRITE CIRCUIT BOARD
    10.
    发明申请
    FERRITE CIRCUIT BOARD 审中-公开
    铁路电路板

    公开(公告)号：US20150061814A1

    公开(公告)日：2015-03-05

    申请号：US14475950

    申请日：2014-09-03

    Applicant: IBIS INNOTECH INC.

    Inventor： Wei-Jen LAI ,  Chih-Kung HUANG

    IPC: H01F27/28

    CPC classification number: H05K1/0306 ,  H01F27/2804 ,  H01L23/15 ,  H01L23/49838 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H05K2201/0175 ,  H01L2924/00

    Abstract: A ferrite circuit board includes a substrate and a wire. The substrate is made of ferrite and provided with a surface and an elongated groove recessed from the surface. The elongated groove has an inner wall having a roughness Ra ranging from 0.1 μm to 20 μm. The wire is embedded in the elongated groove of the substrate, such that the wire is not easily separated from the substrate. The ferrite circuit board can be used as an inductor to provide abundant functionality.

    Abstract translation: 铁氧体电路板包括基板和导线。 基板由铁氧体制成，并具有从表面凹陷的表面和细长槽。 细长槽具有表面粗糙度Ra为0.1μm〜20μm的内壁。 导线被嵌入基板的细长槽中，使得导线不容易与基板分离。 铁氧体电路板可用作电感器以提供丰富的功能。

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