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    Package structure
    1.
    发明授权
    Package structure 有权

    公开(公告)号：US10134668B2

    公开(公告)日：2018-11-20

    申请号：US15657208

    申请日：2017-07-24

    Applicant: IBIS Innotech Inc.

    Inventor： Wen-Chun Liu ,  Wei-Jen Lai

    IPC: H01L23/495 ,  H01L23/498 ,  H01L23/00

    Abstract: A package structure includes a lead frame, an insulator, a plurality of conductive vias, a patterned metal layer, and a chip. The lead frame includes a plurality of contacts. The insulator covers the lead frame. The conductive vias are disposed on the insulator and connected to the contacts. The patterned metal layer covers an outer surface of the insulator and includes a groove and a circuit portion. The circuit portion is connected to and covers the conductive vias and contacts. The groove surrounds the circuit portion such that the circuit portion is electrically insulated from the rest of the patterned metal layer. A surface of the insulator exposed by the groove is lower than the outer surface. The chip is disposed on the insulator and electrically connected to the circuit portion.

    PACKAGE STRUCTURE
    5.
    发明申请
    PACKAGE STRUCTURE 有权
    包装结构

    公开(公告)号：US20160353575A1

    公开(公告)日：2016-12-01

    申请号：US15232808

    申请日：2016-08-10

    Applicant: IBIS Innotech Inc.

    Inventor： Wen-Chun Liu

    IPC: H05K1/18 ,  H05K1/03 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/181 ,  H05K1/0218 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

    Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

    Abstract translation: 封装结构包括基板，传感器，基座，引线框架，导电通孔和图案化电路层。 基板包括部件布置区域和电极触点。 传感器设置在部件布置区域处并电连接到电极触点。 基座覆盖基板与其接合表面，并且包括接收腔，在接收腔的底表面和接合表面之间延伸的倾斜表面，以及设置在接合表面上并电连接到电极触头的电极。 传感器位于接收腔中。 引线框架设置在基座上。 导电通孔穿透基座并电连接到引线框架。 图案化电路层设置在倾斜表面上并电连接到导电通孔和电极。

    PACKAGE STRUCTURE
    10.
    发明申请
    PACKAGE STRUCTURE 有权
    包装结构

    公开(公告)号：US20160233152A1

    公开(公告)日：2016-08-11

    申请号：US15133244

    申请日：2016-04-20

    Applicant: IBIS Innotech Inc.

    Inventor： Wen-Chun Liu

    IPC: H01L23/495 ,  H01L21/768

    CPC classification number: H01L23/49586 ,  H01L21/4828 ,  H01L21/76823 ,  H01L21/76825 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: A package structure includes a lead frame, a selective-electroplating epoxy compound, conductive vias and a patterned circuit layer. The lead frame includes a metal stud array having metal studs. The selective-electroplating epoxy compound covers the metal stud array. The selective-electroplating epoxy compound includes non-conductive metal complex. The conductive vias are directly embedded in the selective electroplating epoxy compound to be respectively connected to the metal studs and extended to a top surface of the selective-electroplating epoxy compound. Each of the conductive vias includes a lower segment connected to the corresponding metal stud and an upper segment connected to the lower segment and extended to the top surface, and a smallest diameter of the upper segment is greater than a largest diameter of the lower segment. The patterned circuit layer is directly disposed on the top surface and electrically connected to the conductive vias.

    Abstract translation: 封装结构包括引线框，选择性电镀环氧化合物，导电通孔和图案化电路层。 引线框架包括具有金属螺柱的金属螺柱阵列。 选择性电镀环氧化合物覆盖金属螺柱阵列。 选择性电镀环氧化合物包括非导电金属络合物。 导电通孔直接嵌入选择性电镀环氧化合物中，以分别连接到金属螺柱并延伸到选择性电镀环氧化合物的顶表面。 每个导电通孔包括连接到相应的金属螺柱的下部段和连接到下部段并延伸到顶部表面的上段，并且上段的最小直径大于下段的最大直径。 图案化电路层直接设置在顶表面上并电连接到导电通孔。

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