公开(公告)号：US20020170175A1

公开(公告)日：2002-11-21

申请号：US10178253

申请日：2002-06-24

发明人： Robert Aigner ,  Florian Plotz ,  Sven Michaelis ,  Michael Brauer

IPC分类号： H01R043/00 ,  H05K003/36

CPC分类号： B81B7/007 ,  B81C1/00888 ,  G01P1/023 ,  G01P2015/0828 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49798 ,  Y10T29/49813 ,  Y10T83/02 ,  Y10T83/0581

摘要： A micromechanical structure is described which is disposed on a base body and requires protection from environmental influences by a covering body. Furthermore, electrical contacts are necessary for establishing contacts for the micromechanical structure. By skillfully carrying out a sawing-into operation and a sawing-through operation, it is possible to expose the electrical contact.

摘要翻译： 描述了一种微机械结构，其被布置在基体上并且需要保护以免受覆盖体的环境影响。 此外，为了建立微机械结构的触点，需要电触点。 通过巧妙地进行锯切操作和锯切操作，可以暴露电接触。

公开(公告)号：US20020081816A1

公开(公告)日：2002-06-27

申请号：US10006966

申请日：2001-12-05

发明人： Timothy R. Spooner ,  David S. Courage ,  Brad Workman

IPC分类号： H01L021/76

CPC分类号： H01L21/6836 ,  B81C1/00888 ,  B81C1/00896 ,  H01L2221/68327

摘要： A wafer cap protects micro electromechanical system (nullMEMSnull) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

公开(公告)号：US20020076873A1

公开(公告)日：2002-06-20

申请号：US10007579

申请日：2001-12-05

发明人： Timothy R. Spooner ,  Kieran P. Harney

IPC分类号： H01L021/8238

CPC分类号： H01L21/6836 ,  B81C1/00888 ,  B81C1/00896 ,  H01L2221/68327

摘要： A wafer cap protects micro electromechanical system (nullMEMSnull) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

公开(公告)号：US5824177A

公开(公告)日：1998-10-20

申请号：US678822

申请日：1996-07-12

申请人： Shinji Yoshihara ,  Sumitomo Inomata ,  Fumio Ohara ,  Takashi Kurahashi

发明人： Shinji Yoshihara ,  Sumitomo Inomata ,  Fumio Ohara ,  Takashi Kurahashi

IPC分类号： B29C43/36 ,  B81C1/00 ,  H01L21/301 ,  H01L21/78 ,  B32B31/18

CPC分类号： B81C1/00888 ,  B29C43/36 ,  H01L21/78 ,  B29C2043/023 ,  B29C33/0022 ,  Y10T156/1052

摘要： A semiconductor wafer, which can be divided into chips at a high yield and a low cost and easily handled during transfer thereof as well, is disclosed. In a semiconductor wafer of such structure that structures with a low mechanical strength, such as suspended microstructures, are exposed at a surface thereof, detachable adhesive sheet making up protective caps for the respective suspended microstructures are formed over the semiconductor wafer. By means of this, even if the semiconductor wafer is diced into the individual chips, respective microstructures on chips are protected from the external force, such as the pressure of cutting water, during the dicing process.

摘要翻译： 公开了一种半导体晶片，其可以以高产率和低成本分为芯片，并且在其转移期间也容易处理。 在这样的结构的半导体晶片中，具有低机械强度的结构（例如悬浮微结构）在其表面露出，在半导体晶片上形成用于各个悬浮微结构的可拆卸粘合片。 借此，即使将半导体晶片切割成各个芯片，在切割处理期间，可以保护芯片上的各自的微结构免受诸如切割水的压力的外力。

公开(公告)号：US5445559A

公开(公告)日：1995-08-29

申请号：US82183

申请日：1993-06-24

申请人： Richard O. Gale ,  Michael A. Mignardi

发明人： Richard O. Gale ,  Michael A. Mignardi

IPC分类号： G02B26/02 ,  B25B11/00 ,  B28D5/00 ,  B28D5/02 ,  B81C1/00 ,  G02B26/08 ,  H01L21/301 ,  H01L21/683 ,  B24B41/06

CPC分类号： B25B11/005 ,  B28D5/0052 ,  B28D5/0094 ,  B28D5/022 ,  B81C1/00888 ,  G02B26/0841 ,  Y10S148/028 ,  Y10T225/12

摘要： A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.

摘要翻译： 一种制造微机械装置的加工夹具和方法，例如数字微镜装置，其允许在锯操作和随后的清洁操作期间保护晶片22上的脆弱结构免受碎屑的影响。 在部分锯切晶片22以产生锯切之后，将晶片22附接到真空固定器26。 然后将晶片22的背面磨碎到锯切切口24以分离设备32.每个设备32通过设备32上方的顶部空间中的真空被保持在固定装置上。在替代实施例中，设备通过锯切分开 在夹具中完全通过晶片。

公开(公告)号：US20230174371A1

公开(公告)日：2023-06-08

申请号：US18161310

申请日：2023-01-30

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Qin SHI ,  Qifang HU ,  Anping QIU ,  Jinghui XU

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0048 ,  B81C1/00888 ,  B81B2201/0235 ,  B81B2201/0242

摘要： An MEMS device includes a package (1), a bottom plate (2), and a first inertial component (3). The first inertial component (3) is located in packaging space (4) formed by the bottom plate (2) and the package (1). There is a first alignment part (21) on a surface that is of the bottom plate (2) and that faces the packaging space (4), and the first inertial component (3) has a first mounting part (31). A shape of the first mounting part (31) matches a shape of the first alignment part (21). The MEMS device is equipped with a mounting alignment reference, the first mounting part (31) is connected to the first alignment part (21), and the first inertial component is mounted on the bottom plate at a preset angle. In addition, a bottom part of the first inertial component is not directly connected to the bottom plate.

公开(公告)号：US09504162B2

公开(公告)日：2016-11-22

申请号：US14118732

申请日：2012-05-18

申请人： James L. Say

发明人： James L. Say

IPC分类号： H05K3/00 ,  H01L21/78 ,  H01L23/00 ,  H01L21/306 ,  G01N27/327 ,  H01L21/683 ,  B81C1/00

CPC分类号： H05K3/00 ,  B81C1/00317 ,  B81C1/00333 ,  B81C1/00888 ,  G01N27/3272 ,  H01L21/306 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/82 ,  Y10T29/49155

摘要： Certain processes for manufacturing an electrochemical sensor module include etching a Silicon wafer to form precursor sensor bodies, disposing sensor fibers along rows of the precursor sensor bodies, securing a rigid layer over the sensor fibers, dividing the wafer, rigid layer, and sensor fibers into individual precursor sensor bodies, and joining each precursor sensor body to a component body to form sensor modules.

摘要翻译： 用于制造电化学传感器模块的某些方法包括蚀刻硅晶片以形成前体传感器主体，沿着前体传感器主体的行布置传感器光纤，将刚性层固定在传感器光纤上，将晶片，刚性层和传感器光纤分成 单独的前体传感器体，并将每个前体传感器主体连接到组件主体以形成传感器模块。

公开(公告)号：US09458012B2

公开(公告)日：2016-10-04

申请号：US14182736

申请日：2014-02-18

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： Alan J. Magnus ,  Vijay Sarihan

IPC分类号： B81C1/00

CPC分类号： B81C1/00888 ,  B81C1/00896

摘要： A method includes applying a compressive force against MEMS structures at a front side of a MEMS wafer using a protective material covering at least a portion of the front side of the MEMS wafer. The method further includes concurrently dicing through the protective material and the MEMS wafer from the front side to produce a plurality of MEMS dies, each of which includes at least one of the MEMS structures. The protective material is secured over the front side of the MEMS wafer to apply pressure to the protective material, and thereby impart the compressive force against the MEMS structures to largely limit movement of the MEMS structures during dicing. A tack-free surface of the protective material enables its removal following dicing.

摘要翻译： 一种方法包括使用覆盖MEMS晶片的前侧的至少一部分的保护材料对MEMS晶片的前侧施加抵抗MEMS结构的压缩力。 该方法还包括从前侧同时切割穿过保护材料和MEMS晶片以产生多个MEMS管芯，每个MEMS管芯包括至少一个MEMS结构。 保护材料固定在MEMS晶片的前侧上以对保护材料施加压力，从而赋予对MEMS结构的压缩力，从而大大限制了在切割期间MEMS结构的运动。 保护材料的无粘性表面使其能够在切割之后被去除。

公开(公告)号：US20110156242A1

公开(公告)日：2011-06-30

申请号：US12969952

申请日：2010-12-16

申请人： Hideaki Sakaguchi ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama

发明人： Hideaki Sakaguchi ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama

IPC分类号： H01L23/482 ,  H01L21/50

CPC分类号： H01L24/94 ,  B81B2207/096 ,  B81C1/00269 ,  B81C1/00301 ,  B81C1/00888 ,  B81C2203/0118 ,  H01L21/50 ,  H01L23/10 ,  H01L24/81 ,  H01L2224/83805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00

摘要： There is provided a method of manufacturing a semiconductor package. The method includes: (a) providing a silicon wafer comprising a first surface and a second surface opposite to the first surface; (b) forming vias through the silicon wafer in its thickness direction; (c) forming wiring patterns on the first surface of the silicon wafer such that the wiring patterns are electrically connected to the vias; (d) bonding a MEMS element wafer comprising MEMS elements onto the second surface of the silicon wafer such that the MEMS elements are electrically connected to the vias; (e) dividing the MEMS element wafer into the respective MEMS elements; (f) bonding a lid having concave portions therein onto the second surface of the silicon wafer such that the respective MEMS elements face a corresponding one of the concave portions; and (g) dicing the lid and the silicon wafer.

摘要翻译： 提供了制造半导体封装的方法。 该方法包括：（a）提供包括与第一表面相对的第一表面和第二表面的硅晶片; （b）在硅晶片的厚度方向上形成通孔; （c）在所述硅晶片的所述第一表面上形成布线图案，使得所述布线图形电连接到所述通孔; （d）将包含MEMS元件的MEMS元件晶片接合到所述硅晶片的所述第二表面上，使得所述MEMS元件电连接到所述通孔; （e）将MEMS元件晶片分成相应的MEMS元件; （f）将其中具有凹部的盖子粘合到硅晶片的第二表面上，使得各个MEMS元件面对相应的一个凹部; 和（g）切割盖子和硅晶片。

公开(公告)号：US07790578B2

公开(公告)日：2010-09-07

申请号：US11848423

申请日：2007-08-31

申请人： Toshikazu Furui

发明人： Toshikazu Furui

IPC分类号： H01L21/00 ,  H01L21/78

CPC分类号： B81C1/00888 ,  B81C2201/053 ,  H01L21/78

摘要： Prior to dicing, a volatile protective agent is applied to at least the face of the substrate in which the devices are fabricated. Then the devices are separated by dicing. After dicing, the surface of the volatile protective agent is cleaned, and then the volatile protective agent is evaporated.

摘要翻译： 在切割之前，将挥发性保护剂施加到至少其中制造器件的衬底的表面。 然后通过切割分离设备。 切割后，清洁挥发性保护剂的表面，然后蒸发挥发性保护剂。