摘要:
Highlight blooming is reduced in semiconductor diode array camera targets by forming electron-hole recombination sites intermediate the diodes. These sites collect excess holes created by intense light images incident on the target and reduce blooming. The recombination sites are formed by selectively irradiating regions of the semiconductor substrate between the diodes and beyond the limits of the depletion region surrounding the reverse-biased diodes. Useful forms of radiation which produce these recombination sites include electron beam and ultraviolet rays.
摘要:
THE DISCLOSURE RELATES TO A DIELECTRICALLY ISOLATED SILICON DIODE ARRAY VIDICON TARGET WHICH SUBSTANTIALLY ELIMINATES THE LATERAL DIFFUSION SPREAD OF PHOTO CARRIERS, THEREBY PROVIDING A NON-BLOOMING CAMERA PICKUP TUBE.
摘要:
A silicon diode array target structure is disclosed in which light sensitivity is electronically controlled. Photons incident upon a target generate hole (minority carrier) electron pairs. A single large area reversed bias P-N junction structure is formed over the entire image area on the light incident side of a conventional diode array target, and the depletion region created by the reverse bias both controls light sensitivity by impeding the movement of minority carriers toward the diode array target and serves as a sink for the minority carriers generated within the depletion region.
摘要:
A camera tube employing a silicon target with a diode array which is covered with a resistive layer or sea on the side facing the electron beam. The resistive sea consists of a layer of bismuth oxide which protects the silicon target from damage by xrays while minimizing charge build-up on the insulating layer between diodes which would otherwise prevent beam landing. The resistive sea is covered by a very thin layer of cadmium telluride which stabilizes the Bi2O3 layer and improves its beam acceptance properties.
摘要:
An improved electron beam information storage device is disclosed as comprising a target structure having an array of closely spaced diodes with electrically conducting selfregistered projections in contact with the diodes and extending away from the surface of the diode array for intercepting the electron beam and conducting electrons to the diodes thereby preventing an undesirable charge buildup on the surface of target structure. A method for making storage devices by selective epitaxial growth is also disclosed.
摘要:
A HAFNIUM-TANTALUM NITRIDE LAYER HAVING A COMPOSITION BETWEEN THE MONONITRIDE AND THE DINITRIDE 500-5000 A. THICK IS DEPOSITED ON AN OXIDIZED SILICON SUBSTRATE IN AN ARGON ATOMOSPHERE CONTAINING NITROGEN AT A PARTIAL PRESSURE OF 5-10X10**-3 TORR BY RF SPUTTERING OF HAFNIUM MONONITRIDE AND TANTALUM MONONITRIDE. AFTER SUBSEQUENT ANNEALING SUCH LAYERS HAVE SHEET RESISTIVITIES OF AT LEAST 2X10**13 OHMS/$ AND ARE PARTICLARLY SUITED AS AN ELECTRON DISCHARGE LAYER ON THE OXIDE SURFACE OF A SILICON VIDICON TARGET WAFER, I.E. AS A RESISTIVE SEA.
摘要:
Silicon diode array vidicon targets characterized by a silicon oxide insulator disposed between P-type conductivity regions forming discrete diodes within an N-type conductivity wafer have been made substantially immune to burn-in by the utilization of a 0,1 to 3 micron thick electrically conducting glass layer to leak charge formed on the insulator to the adjacent P-type conductivity regions of the target. Preferably the electronically conducting glass is an alkaline earth metal borate glass containing an oxide of a metal, e.g., iron, vanadium, cobalt, etc., providing ions of both a higher valence state and a lower valence state within the glass to permit regulation of the resistivity of the glass layer during fabrication of the bulk glass. To inhibit crazing of the glass layer while providing superior contact between the glass and the surface of the target, the glass layer is R.F. sputter deposited atop the target employing a sputtering atmosphere, e.g., argon, nitrogen, oxygen, selected to provide the desired resistivity in the deposited glass layer.
摘要:
High area-density arrays, such as diode array vidicon camera tube targets and electron tube electrode screens, are made by photolithographic printing utilizing a photomask diffraction image rather than a photomask shadow for exposing a photoresist masking layer. To form the masking layer, a relatively flat photoresist layer is exposed to a periodic array diffraction image from a photomask. The exposed portions of the layer are removed, leaving an array of unexposed portions. Alternatively, the unexposed portions of the layer may be removed, leaving an array of exposed portions. During the exposure, the layer is oscillated over a distance of essentially one-quarter the wavelength of the light and in a direction substantially perpendicular to the surface of the layer to avoid the appearance of interference fringe patterns after development.
摘要:
A silicon vidicon target comprises an N-type silicon wafer having one surface exposed to incident light, and a large number of discrete P-type regions diffused into the opposite wafer surface, which is scanned by an electron beam. A transparent electrode overlies a transparent insulator disposed on the illuminated wafer surface. The optical sensitivity and spectral response of the target are varied by applying a bias voltage between the transparent electrode and the N-type wafer.
摘要:
A semiconductor structure having a surface insulating layer formed as a grid with charges implanted in the insulating material to prevent inversion and, hence, channeling between adjacent semiconductor regions, preferably for use in a non-blooming vidicon. The method of manufacturing such a structure uses ion implantation to create immobile positive charges in a grid pattern in an insulating layer in regions spaced from the interface between the insulating layer and the semiconductor body. The insulating layer is of sufficient thickness that substantially all of the charge sites in the insulating layer are separated from the outer surface of the insulator by a sufficient distance to effectively prevent a negative electric field from reaching into the silicon.