公开(公告)号：US20220403517A1

公开(公告)日：2022-12-22

申请号：US17837241

申请日：2022-06-10

Applicant: SEMES CO., LTD.

Inventor： Ki Sang EUM ,  Woo Ram LEE ,  Jong Wha KANG ,  Dong Woon PARK

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/44 ,  C23C16/46

Abstract: Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes a chamber having an inner space, a support unit configured to support the substrate in the inner space, a gas supply tube configured to supply a gas onto the substrate supported on the support unit, a gas exhaust tube configured to exhaust the gas from the inner space, and a gas block connected to the gas supply tube and the gas exhaust tube and provided above the chamber.

公开(公告)号：US11527986B2

公开(公告)日：2022-12-13

申请号：US16952821

申请日：2020-11-19

Applicant: SEMES CO., LTD.

Inventor： Jun Beom Lee ,  Yeong Jae Choi

IPC: H02P29/028 ,  H02P23/20 ,  B65G1/04

Abstract: An apparatus includes a servo motor being configured to drive a traveling part for transferring an object along a traveling rail, a servo driver being configured to control an operation of the servo motor with adjusting a torque of the servo motor according to a load level, an overload determination unit being configured to check a degree of overload of the servo driver and a motion controller being configured to generate a speed signal and a speed profile according to a transfer command which a control unit of controlling an operation of the traveling part transmits thereto, the motion controller generating either a normal speed profile when the servo driver is not at an overload state or a corrected speed profile when the servo driver is at the overload state, and transmitting the speed signal and the speed profile to the servo driver.

公开(公告)号：US20220384216A1

公开(公告)日：2022-12-01

申请号：US17714999

申请日：2022-04-06

Applicant: SEMES CO., LTD.

Inventor： Jin Se PARK ,  Ki Bong KIM ,  Myung Seok CHA ,  Do Hyeon YOON

IPC: H01L21/67

Abstract: The present invention discloses an exhausting device and an exhausting method in substrate processing equipment, and more particularly, a technique for controlling a processing process environment by providing a buffer space for storing chemical fumes outside a ventilation unit of the substrate processing equipment, and discharging the chemical fumes into the buffer space in accordance with a processing process in a chamber interior space.

公开(公告)号：US20220374772A1

公开(公告)日：2022-11-24

申请号：US17746241

申请日：2022-05-17

Applicant: SEMES CO., LTD.

Inventor： Ki-Sung KOO

IPC: G06N20/00 ,  G06K9/62 ,  H01L21/66

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes at least one sensor configured to measure a condition of the substrate or the apparatus in a process of the treating of the substrate; a data collecting unit configured to collect in time series data measured by the sensor; and a data processing unit configured to learn the data by the data collecting unit to detect a change in a current data measured by the sensor. The data processing unit comprises a data learning unit configured to learn a data of the past collected by the data collecting unit using a Siamese network; and a data inspecting unit configured to detect whether an issue has occurred in the current data based on the learned data.

公开(公告)号：US20220367221A1

公开(公告)日：2022-11-17

申请号：US17745116

申请日：2022-05-16

Applicant: SEMES CO., LTD.

Inventor： Do Hyeon YOON ,  Yong Hee LEE ,  Jin Woo JUNG ,  Mi So PARK

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  B08B3/08 ,  B08B13/00 ,  F26B5/00

Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a liquid treatment chamber configured to treat a substrate with a liquid; a drying chamber configured to dry the liquid-treated substrate; a transfer robot configured to transfer the substrate between the liquid treatment chamber and the drying chamber, and including a hand which is movable along an X-axis, a Y-axis, and a Z-axis and is rotatably driven based on the Z-axis, and on which the substrate is placed; an optical system configured to photograph a form of a liquid film of the substrate, in which when the substrate is transferred from the liquid treatment chamber to the drying chamber, the substrate is wetted with a chemical liquid and is transferred by the transfer robot in a state of being formed with a liquid film formed; and a controller configured to measure the form of the liquid film photographed by the optical system.

公开(公告)号：US11491781B2

公开(公告)日：2022-11-08

申请号：US17337966

申请日：2021-06-03

Applicant: SEMES CO., LTD.

Inventor： Su Beom Jeon

IPC: B41J2/04 ,  B41J2/045 ,  B41J2/145

Abstract: A head alignment apparatus for determining a reference position using position synchronization and aligning a plurality of head modules according to the reference position, and a substrate treating system including the same are provided. The head alignment apparatus may include, a reference position determining unit for determining a first reference position of a head transfer, in which a plurality of inkjet head modules are installed; and a mounting position determining unit for determining a second reference position of the inkjet head module based on the first reference position so that the inkjet head module can be moved from a current position to a second reference position, wherein the reference position determining unit determines a first reference position using a first image sensor installed on the same plane as the inkjet head module and a second image sensor installed facing the inkjet head module.

公开(公告)号：US11485132B2

公开(公告)日：2022-11-01

申请号：US16933029

申请日：2020-07-20

Applicant: Semes Co., Ltd.

Inventor： Chulwoo Kim ,  Sanghwa Lee ,  Beomjeong Oh

IPC: B41J2/045

Abstract: In a printing method using an ink jet head, a chemical liquid may be discharged onto a substrate from a plurality of nozzles of the ink jet head. Discharging numbers of the chemical liquid from the plurality of nozzles may be identified and a cumulative discharging number of the chemical liquid from the plurality of nozzles may be calculated. The cumulative discharging number of the chemical liquid may be compared with a previously set limit discharging number of the ink jet head. A replacement time of the ink jet head may be determined if the cumulative discharging number of the chemical liquid exceeds the previously set limit discharging number.

公开(公告)号：US20220290921A1

公开(公告)日：2022-09-15

申请号：US17692395

申请日：2022-03-11

Applicant: SEMES CO., LTD.

Inventor： Hae-Won CHOI ,  Anton KORIAKIN ,  Joon Ho WON ,  Min Woo KIM ,  Ki Hoon CHOI ,  Eung Su KIM ,  Tae Hee KIM ,  Pil Kyun HEO ,  Jang Jin LEE ,  Jin Yeong SUNG

IPC: F26B5/00

Abstract: The inventive concept provides a method for treating a substrate. The method for treating a substrate comprises: a pressurization step for increasing a pressure of an inner space of a chamber by supplying a treating fluid to the inner space, after taking the substrate into the inner space; a flow step for generating a flow of the treating fluid by combination of supplying and discharging the treating fluid to and from the inner space; and a depressurization step of decreasing the pressure of the inner space by discharging the treating fluid from the inner space, and wherein the pressurization step comprises: a bottom side supply process for increasing the pressure of the inner space by supplying the treating fluid to a backside of the substrate taken into the inner space;
and a top side supply process of increasing the pressure of the inner space by supplying the treating fluid to a top side of the substrate taken into the inner space.

公开(公告)号：US20220266592A1

公开(公告)日：2022-08-25

申请号：US17742397

申请日：2022-05-12

Applicant: SEMES CO., LTD.

Inventor： Sang Hoon PARK

IPC: B41J2/045 ,  B41J11/00

Abstract: Provided is a printing apparatus. The printing apparatus includes: a stage on which an object is positioned; a printing unit provided above the stage and performing printing on the object; and a control part configured to perform a correction for printing on at least one of the object, the stage, and the printing unit based on preset printing conditions, in which the printing unit includes a head frame provided above the stage, a detection sensor configured to detect a distance between the head frame and a part positioned thereunder, and a heat part provided on the head frame to perform printing on the object.

公开(公告)号：US20220208580A1

公开(公告)日：2022-06-30

申请号：US17534716

申请日：2021-11-24

Applicant: SEMES CO., LTD.

Inventor： Myoung Hoon WOO

IPC: H01L21/67 ,  G06T7/90 ,  G06T7/70 ,  G06T7/11 ,  G06T7/00

Abstract: A wafer inspection method includes acquiring an inspection image from an edge region of a wafer, generating a color profile of the inspection image in a radial direction of the wafer, detecting a side surface of a layer formed on the wafer based on a change in the color profile in a first direction from a side surface of the wafer toward a center of the wafer, and calculating a distance between the side surface of the layer and the side surface of the wafer.