公开(公告)号：US20230179244A1

公开(公告)日：2023-06-08

申请号：US17457496

申请日：2021-12-03

Applicant: STMicroelectronics S.r.l.

Inventor： Nunzio Spina ,  Giuseppe Palmisano ,  Alessandro Castorina

IPC: H04B1/16 ,  H03F3/19 ,  H04L27/06

CPC classification number: H04B1/16 ,  H03F3/19 ,  H04L27/06 ,  H03F2200/451

Abstract: A method for calibrating the DC operating point of a PWM receiver circuit is disclosed. The PWM receiving circuit includes an envelop detector having a first resistor string, and includes a bias circuit having a second resistor string and a plurality of switches. The second resistor string is coupled between a supply voltage and a reference voltage and functions as a voltage divider. Each switch, when closed, accesses a second voltage at a node of the second resistor string connected to the closed switch. To perform the calibration process, the plurality of switches is closed one at a time, and the second voltage is compared with a first voltage at a first node of the first resistor string. The switch that, when closed, produces the smallest difference between the first voltage and the second voltage remains closed after the calibration process, and is used for demodulating the PWM signal.

公开(公告)号：US11670685B2

公开(公告)日：2023-06-06

申请号：US17226003

申请日：2021-04-08

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Simone Rascuná ,  Paolo Badalá ,  Anna Bassi ,  Gabriele Bellocchi

IPC: H01L29/872 ,  H01L29/16 ,  H01L29/66

CPC classification number: H01L29/1608 ,  H01L29/1606 ,  H01L29/6603 ,  H01L29/66143 ,  H01L29/872

Abstract: A method for manufacturing a SiC-based electronic device, that includes implanting, at a front side of a solid body of SiC having a conductivity of N type, dopant species of P type, thus forming an implanted region that extends in depth in the solid body starting from the front side and has a top surface co-planar with said front side; and generating a laser beam directed towards the implanted region in order to generate heating of the implanted region at temperatures comprised between 1500° C. and 2600° C. so as to form an ohmic contact region including one or more carbon-rich layers, for example graphene and/or graphite layers, in the implanted region and, simultaneously, activation of the dopant species of P type.

公开(公告)号：US11669770B2

公开(公告)日：2023-06-06

申请号：US16203275

申请日：2018-11-28

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Zancanato ,  Stefano Paolo Rivolta

IPC: G06N20/00 ,  G01C19/00 ,  G01P15/00 ,  G06F3/0346

CPC classification number: G06N20/00 ,  G01C19/00 ,  G01P15/00 ,  G06F3/0346 ,  G06F2218/02 ,  G06F2218/08 ,  G06F2218/12

Abstract: Technological advancements are disclosed that utilize inertial sensor data associated with a device to determine a new feature array and if the new feature array is within an existing class within a state space associated with the inertial sensor data. In response to the new feature array being included in the existing class, the new feature array is added to the existing class and a representation of the existing class in the state space is updated based on the new feature array and an existing representation of the existing class. In response to the new feature array not being included in the existing class, a new class is created based on the new feature array.

公开(公告)号：US11668585B2

公开(公告)日：2023-06-06

申请号：US17460030

申请日：2021-08-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Luca Guerinoni ,  Gabriele Gattere

IPC: G01C25/00 ,  G01C19/72

CPC classification number: G01C25/005 ,  G01C19/726

Abstract: A gyroscopic sensor unit detects a phase drift between a demodulated output signal and demodulation signal during output of a quadrature test signal. A delay calculator detects the phase drift based on changes in the demodulated output signal during application of the quadrature test signal. A delay compensation circuit compensates for the phase drift by delaying the demodulation signal by the phase drift value.

公开(公告)号：US20230170803A1

公开(公告)日：2023-06-01

申请号：US18154167

申请日：2023-01-13

Applicant: STMicroelectronics S.r.l.

Inventor： Enrico Ferrara ,  Luca Morinelli

IPC: H02M3/158 ,  H02M1/08 ,  H02M3/156

CPC classification number: H02M3/158 ,  H02M1/08 ,  H02M3/1566 ,  H02M1/0019

Abstract: An embodiment buck converter control circuit comprises an error amplifier configured to generate an error signal based on a feedback signal and a reference signal, a pulse generator circuit configured to generate a pulsed signal having switching cycles set to high and low as a function of the error signal, a driver circuit configured to generate a drive signal for an electronic switch of the buck converter as a function of the pulsed signal, a variable load, connected between two output terminals of the buck converter, configured to absorb a current based on a control signal, and a detector circuit configured to monitor a first signal indicative of an output current provided by the buck converter and a second signal indicative of a negative transient of the output current, and verify whether the second signal indicates a negative transient of the output current.

公开(公告)号：US20230170271A1

公开(公告)日：2023-06-01

申请号：US18056104

申请日：2022-11-16

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Valeria PUGLISI ,  Gabriele BELLOCCHI ,  Simone RASCUNA'

IPC: H01L23/31 ,  H01L29/16 ,  H01L21/04

CPC classification number: H01L23/3178 ,  H01L29/1608 ,  H01L21/045

Abstract: An electronic device, comprising: a semiconductor body of silicon carbide; an insulating layer on a surface of the semiconductor body; a layer of metal material extending in part on the surface of the semiconductor body and in part on the insulating layer; a SiN interface layer on the layer of metal material and the insulating layer; a passivation layer on the interface layer; and an anchoring element that protrudes from the passivation layer towards the first insulating layer and extends in the first insulating layer underneath the interface layer.

公开(公告)号：US20230168300A1

公开(公告)日：2023-06-01

申请号：US18053688

申请日：2022-11-08

Applicant: STMICROELECTRONICS S.r.l. ,  STMicroelectronics International N.V.

Inventor： Mauro GIACOMINI ,  Fabio Enrico Carlo DISEGNI ,  Rajesh NARWAL ,  Pravesh Kumar SAINI ,  Mayankkumar HARESHBHAI NIRANJANI

IPC: G01R31/315 ,  H01L21/66

CPC classification number: G01R31/315 ,  H01L22/12

Abstract: An assembly for detecting a structural defect in a semiconductor die is provided. The assembly includes a defect-detection sensor and a microcontroller. The defect-detection sensor includes a plurality of resistive paths of electrical-conductive material in the semiconductor die, each of which has a first end and a second end and extends proximate a perimeter of the semiconductor die. The defect-detection sensor includes a plurality of signal-generation structures, each coupled to a respective resistive path and configured to supply a test signal to the resistive path. The microcontroller is configured to control the signal-generation structures to generate the test signals, acquire the test signals in each resistive paths, test an electrical feature of the resistive paths by performing an analysis of the test signals acquired and detect the presence of the structural defect in the semiconductor die based on a result of the analysis of the test signals acquired.

公开(公告)号：US20230168290A1

公开(公告)日：2023-06-01

申请号：US17537069

申请日：2021-11-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Massimo ORIO

IPC: G01R29/12 ,  G01R29/08 ,  G01R29/24

CPC classification number: G01R29/12 ,  G01R29/0878 ,  G01R29/24

Abstract: The present disclosure is directed to a device that provides high impedance contact pads for an electrostatic charge sensor. The contact pads are shared between the electrostatic charge sensor and drivers. The contact pads are set to a high impedance state by reducing current leakage through the drivers. Compared to electrostatic charge sensor with low impedance contact pads, the electrostatic charge sensor disclosed herein has high sensitivity, and is able to detect weak electrostatic fields.

公开(公告)号：US20230160024A1

公开(公告)日：2023-05-25

申请号：US17531313

申请日：2021-11-19

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Massimiliano PESATURO ,  Lillo RAIA ,  Salvatore PETRALIA ,  Domenico GIUSTI ,  Marco FERRERA

IPC: C12Q1/70 ,  C12Q1/686 ,  C12Q1/6806 ,  B01L3/00 ,  B01L7/00 ,  B41M5/00

CPC classification number: C12Q1/701 ,  C12Q1/686 ,  C12Q1/6806 ,  B01L3/527 ,  B01L7/52 ,  B41M5/0023 ,  B01L2200/0647 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2200/16 ,  B01L2300/0819 ,  B01L2300/16

Abstract: A substrate has a plurality of microdots positioned thereon. Each microdot contains one or more primers for gene amplification for a particular target gene. The microdots are placed on the substrate and the substrate is positioned in a housing. The housing has a sample fluid to be tested introduced therein covering the microdot array. While the sample fluid is overlying the substrate, the amplification of the target gene is carried out if it is present within the sample. If the target gene that matches the primers is not present, then amplification will not take place. The fluid also contains fluorophores which will be fixed into the gene as it increases in size as it clearly detects if gene amplification has occurred by detecting the amount of light detected for a particular microdot. In a preferred embodiment, the sample fluid is placed on top of a sealing layer that is less dense then water, such as wax or mineral oil. During a heating of the sample fluid and sealing layer, the sample fluid will sink to the bottom of the sealing layer so that it is fully encased and protected.

公开(公告)号：US11656071B2

公开(公告)日：2023-05-23

申请号：US17237844

申请日：2021-04-22

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Rizzardini ,  Stefano Paolo Rivolta ,  Lorenzo Bracco ,  Marco Bianco

IPC: G01B7/30 ,  G01D5/16 ,  G01D18/00 ,  G05B17/02 ,  G06F1/16

CPC classification number: G01B7/30 ,  G01D5/16 ,  G01D18/00 ,  G05B17/02 ,  G06F1/1616

Abstract: A method is provided for controlling an electronic apparatus on the basis of a value of a lid angle between a first hardware element accommodating a first magnetometer and a second hardware element accommodating a second magnetometer. The method includes acquiring, through the magnetometers, first signals representing an orientation of the hardware elements. A calibration parameter indicative of a condition of calibration of the magnetometers is generated on the basis of the first signals. A reliability value indicative of a condition of reliability of the first signals is generated on the basis of the first signals. A first intermediate value of the lid angle is calculated on the basis of the first signals. A current value of the lid angle is calculated on the basis of the calibration parameter, of the reliability value, and of the first intermediate value, and the electronic apparatus is controlled on the basis of the current value.