APPARATUS FOR TREATING SUBSTRATE
    211.
    发明申请

    公开(公告)号:US20220163892A1

    公开(公告)日:2022-05-26

    申请号:US17531988

    申请日:2021-11-22

    Abstract: The inventive concept provides an apparatus for treating a substrate. The apparatus comprises a processing container having an inner space; a support unit configured to support and rotate the substrate in the inner space; a liquid supply unit configured to supply a treating liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust an air flow from the inner space, wherein the exhaust unit includes an air flow guide duct with an inlet provided to introduce the air flow into the air flow guide duct in a tangential direction to a rotating direction of the substrate supported on the support unit.

    SUBSTRATE TREATING APPARATUS
    212.
    发明申请

    公开(公告)号:US20220148853A1

    公开(公告)日:2022-05-12

    申请号:US17519461

    申请日:2021-11-04

    Abstract: A substrate treating apparatus includes a chamber having a treatment space, a first power supply that is connected to a first component provided in the treatment space and transmits power having a first frequency to the first component, a second power supply that is provided in the treatment space, is connected to a second component different from the first component, and transmits power having a second frequency smaller than the first frequency to the second component, and a coupling blocking structure installed on a power line connected to the second power supply and the second component, wherein the coupling blocking structure is electrically connected to the power line and includes a conductive line having a coil shape.

    APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE

    公开(公告)号:US20220139673A1

    公开(公告)日:2022-05-05

    申请号:US17518480

    申请日:2021-11-03

    Abstract: A substrate treating apparatus includes a processing chamber having an inner processing space, a support unit supporting a substrate in the processing space, a gas supply unit supplying processing gas into the treatment space, and a RF power for supplying an RF signal to excite the processing gas into a plasma state. The support unit includes an edge ring surrounding the substrate, a coupling ring disposed under the edge ring and including an electrode therein, and a cable connected to the electrode. The end of the cable is grounded.

    DISTANCE MEASURING SYSTEM AND DISTANCE MEASURING METHOD

    公开(公告)号:US20220137212A1

    公开(公告)日:2022-05-05

    申请号:US17520262

    申请日:2021-11-05

    Inventor: YONG SEOK JANG

    Abstract: According to an exemplary embodiment of the present invention, a system for measuring a distance is disclosed. The system includes: an LED light source configured to apply light to a target of which a distance is desired to be measured; a first splitter configured to partially reflect light applied from the LED light source; optical fiber configured to apply light passing through the first splitter to the target; and a second splitter configured to reflect light reflected from the target, and the system may further include: a first sensor configured to sense light reflected from the first splitter; and a second sensor configured to sense light reflected from the second splitter.

    APPARATUS FOR PROCESSING SUBSTRATE
    215.
    发明申请

    公开(公告)号:US20220126330A1

    公开(公告)日:2022-04-28

    申请号:US17402882

    申请日:2021-08-16

    Abstract: A substrate processing apparatus includes a support unit; a first nozzle for discharging a first rinse solution to a first area of the substrate; and a second nozzle for discharging a second rinse solution to a second area of the substrate, wherein the first nozzle discharges the first rinse solution to a first area during a first period so that the first area and the second area of the substrate are wetted by the first rinse solution, and some area of the substrate is not wetted by the first rinse solution, wherein the first nozzle discharges the first rinse solution to the first area and the second nozzle discharges the second rinse solution to the second area in a second period directly connected to the first period so that an entire upper surface of the substrate is wetted by the first rinse solution and the second rinse solution.

    SUBSTRATE TREATING APPARATUS
    216.
    发明申请

    公开(公告)号:US20220108868A1

    公开(公告)日:2022-04-07

    申请号:US17489989

    申请日:2021-09-30

    Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a load lock chamber, of which a pressure of an interior space is changed between a first pressure and a second pressure that is lower than the first pressure, an index chamber connected to the load lock chamber, and a measurement unit that measures a level of particles in the interior space, and the measurement unit is located outside the load lock chamber.

    TRANSPORT SYSTEM IN FABRICATION FACILITY

    公开(公告)号:US20220105966A1

    公开(公告)日:2022-04-07

    申请号:US17494769

    申请日:2021-10-05

    Inventor: Sang Pyo JUN

    Abstract: A transport system in a fabrication facility includes a driving unit moving along a driving rail, and a steering unit selectively contacting a steering guide rail at a branching part where the driving rail branches off. The steering unit includes horizontal steering wheels contacting a vertical guide part of the steering guide rail, and vertical steering wheels contacting a horizontal guide part of the steering guide rail.

    SUBSTRATE TREATING APPARATUS
    219.
    发明申请

    公开(公告)号:US20220102171A1

    公开(公告)日:2022-03-31

    申请号:US17486238

    申请日:2021-09-27

    Abstract: The inventive concept provides a substrate treating apparatus. In an embodiment, the substrate treating apparatus includes a process chamber having a treatment space, a support unit that supports a substrate in the treatment space, and a supply line that supplies a process gas into the treatment space, and the support unit includes a heating plate provided with a heater pattern on a lower surface thereof and that heats the supported substrate, and an insulation layer covering the heater pattern and the lower surface of the heating plate.

    TREATING VESSEL AND LIQUID PROCESSING APPARATUS

    公开(公告)号:US20220102169A1

    公开(公告)日:2022-03-31

    申请号:US17486060

    申请日:2021-09-27

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus comprising: a treating vessel including an outer cup and an inner cup placed in an inner side of the outer cup, the inner cup and the outer cup in combination defining a recollecting route for a recollecting a liquid; a rotatable spin head placed within the treating vessel on which a cleaning jig is placed; wherein the treating vessel comprises a first protrusion protruding from an inner side surface of the outer cup to direct a cleaning liquid scattering from the cleaning jig toward a surface of the inner cup.

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