公开(公告)号：US20140294046A1

公开(公告)日：2014-10-02

申请号：US13853801

申请日：2013-03-29

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian

IPC: G01W1/02

CPC classification number: G01W1/02 ,  G01F1/44 ,  G01P5/14

Abstract: Sensors for air flow, temperature, pressure, and humidity are integrated onto a single semiconductor die within a miniaturized Venturi chamber to provide a microelectronic semiconductor-based environmental multi-sensor module that includes an air flow meter. One or more such multi-sensor modules can be used as building blocks in dedicated application-specific integrated circuits (ASICs) for use in environmental control appliances that rely on measurements of air flow. Furthermore, the sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. By integrating the Venturi chamber with accompanying environmental sensors, correction factors can be obtained and applied to compensate for temporal humidity fluctuations and spatial temperature variation using the Venturi apparatus.

Abstract translation: 用于气流，温度，压力和湿度的传感器被集成到小型文丘里室内的单个半导体管芯上，以提供包括空气流量计的基于微电子半导体的环境多传感器模块。 一个或多个这样的多传感器模块可以用作专用于专用集成电路（ASIC）中的构件块，用于依赖于气流测量的环境控制设备。 此外，传感器模块可以建立在可用于处理来自传感器的信号的现有电路之上。 通过将文丘里腔室与随附的环境传感器集成，可以获得校正因子并应用于使用文丘里仪器来补偿时间湿度波动和空间温度变化。

公开(公告)号：US20140291812A1

公开(公告)日：2014-10-02

申请号：US13853856

申请日：2013-03-29

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Kim-Yong Goh ,  Xueren Zhang ,  Yiyi Ma

IPC: H01L29/06 ,  H01L21/50 ,  H01L21/78

CPC classification number: H01L21/78 ,  B81B7/0048 ,  H01L23/053 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29198 ,  H01L2224/32058 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/16151 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.

Abstract translation: 实施例涉及包括具有凹部的电气装置的包装。 在一个实施例中，电气设备是传感器，并且凹部减小由于封装的热膨胀引起的传感器的信号漂移。 在另一个实施例中，凹部基本上填充有粘合剂材料，从而增加了电子装置与包装的基底之间的粘合性，同时允许较低的粘合剂片。

公开(公告)号：US08796139B2

公开(公告)日：2014-08-05

申请号：US13722776

申请日：2012-12-20

Applicant: STMicroelectronics Pte Ltd.

Inventor： Anandan Ramasamy ,  Yonggang Jin ,  Yun Liu

IPC: H01L21/44

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/96 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2924/00

Abstract: A bar formed from a reconstituted wafer and containing one or more conductive material filled voids is used to electrically and physically connect the top and bottom packages in a package-on-package (PoP) package. The bar is disposed in the fan out area of the lower package forming the PoP package.

Abstract translation: 由重构的晶片形成并包含一个或多个导电材料填充的空隙的条被用于电和物理地连接封装在封装（PoP）封装中的顶部和底部封装。 该条被布置在形成PoP包装的下部包装的扇形区域中。

公开(公告)号：US08779443B2

公开(公告)日：2014-07-15

申请号：US13629379

申请日：2012-09-27

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong ,  Hk Looi

IPC: H01L27/15

CPC classification number: H01L25/167 ,  G01S7/4813 ,  H01L31/02325 ,  H01L31/173 ,  H01L2224/32225 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.

Abstract translation: 提供了具有光敏部件和附接到同一基板上的发光部件的传感器封装。 来自发光部件的光从封装通过第一开口发射，并通过封装中的第二开口反射回封装到光敏部件中。 在发光部件和感光部件之间配置玻璃附件。 去除玻璃的一部分并填充不透明物质，以防止光在包装中的发光部件和光敏部件之间传播。

公开(公告)号：US20140084308A1

公开(公告)日：2014-03-27

申请号：US13629379

申请日：2012-09-27

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Wing Shenq Wong ,  Hk Looi

IPC: H01L33/48

CPC classification number: H01L25/167 ,  G01S7/4813 ,  H01L31/02325 ,  H01L31/173 ,  H01L2224/32225 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.

Abstract translation: 提供了具有光敏部件和附接到同一基板上的发光部件的传感器封装。 来自发光部件的光从封装通过第一开口发射，并通过封装中的第二开口反射回封装到光敏部件中。 在发光部件和感光部件之间配置玻璃附件。 去除玻璃的一部分并填充不透明物质，以防止光在包装中的发光部件和光敏部件之间传播。

公开(公告)号：US20140083557A1

公开(公告)日：2014-03-27

申请号：US13625210

申请日：2012-09-24

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Gino GEORGE ,  KeenYip Koh ,  CheeChiang LEE ,  Ditto ADNAN

IPC: B65B3/06

CPC classification number: G03F7/16 ,  H01L21/6715

Abstract: A photoresist delivery system includes a photoresist pump, a photoresist reservoir coupled to the photoresist pump, and a photoresist container. A control valve is between the photoresist reservoir and the photoresist container and is movable from a closed position to an open position upon engagement of the photoresist container with the photoresist reservoir to replenish photoresist therein.

Abstract translation: 光致抗蚀剂传输系统包括光致抗蚀剂泵，耦合到光致抗蚀剂泵的光致抗蚀剂储存器和光致抗蚀剂容器。 控制阀位于光致抗蚀剂储存器和光致抗蚀剂容器之间，并且在光致抗蚀剂容器与光致抗蚀剂储存器接合时能够从关闭位置移动到打开位置，以补充其中的光致抗蚀剂。

公开(公告)号：US20250079189A1

公开(公告)日：2025-03-06

申请号：US18951814

申请日：2024-11-19

Applicant: STMicroelectronics Pte Ltd

Inventor： Jing-En LUAN

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H01S5/02218 ,  H01S5/02315 ,  H01S5/02345

Abstract: A molded carrier is formed by a unitary body made of a laser direct structuring (LDS) material and includes a blind opening with a bottom surface. The unitary body includes: a floor body portion defining a back side and the bottom surface of the blind opening and an outer peripheral wall body portion defining a sidewall surface of the blind opening. LDS activation followed by electro-plating is used to produce: a die attach pad and bonding pad at the bottom surface; land grid array (LGA) pads at the back side; and vias extending through the floor body portion to make electrical connections between the die attach pad and one LGA pad and between the bonding pad and another LGA pad. An integrated circuit chip is mounted to the die attach pad and wire bonded to the bonding pad. A wafer-scale manufacturing process is used to form the molded carrier.

公开(公告)号：US12002898B2

公开(公告)日：2024-06-04

申请号：US17344520

申请日：2021-06-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L31/12 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/12 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/186

Abstract: The present disclosure is directed to a sensor die with an embedded light sensor and an embedded light emitter as well as methods of manufacturing the same. The light emitter in the senor die is surrounded by a resin. The sensor die is incorporated into semiconductor device packages as well as methods of manufacturing the same. The semiconductor device packages include a first optically transmissive structure on the light sensor of the sensor die and a second optically transmissive structure on the light emitter of the sensor die. The first optically transmissive structure and the second optically transmissive structure cover and protect the light sensor and the light emitter, respectively. A molding compound is on a surface of a sensor die and covers sidewalls of the first and second optically transmissive structures on the sensor die.

公开(公告)号：US20240145258A1

公开(公告)日：2024-05-02

申请号：US18489746

申请日：2023-10-18

Applicant: STMICROELECTRONICS PTE LTD

Inventor： David GANI

IPC: H01L21/56 ,  H01L21/02 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L21/568 ,  H01L21/02675 ,  H01L23/3142 ,  H01L23/49816 ,  H01L24/05 ,  H01L2224/05013 ,  H01L2224/05023 ,  H01L2924/182 ,  H01L2924/183

Abstract: The present disclosure is directed to at least one semiconductor package including a die within an encapsulant having a first sidewall, an adhesive layer on the encapsulant and having a second sidewall coplanar with the first sidewall of the encapsulant, and an insulating layer on the adhesive layer having a third sidewall coplanar with the first sidewall and the second sidewall. A method of manufacturing the at least one semiconductor package includes forming an insulating layer on a temporary adhesion layer of a carrier, forming an adhesive layer on the insulating layer, and forming a plurality of openings through the adhesive layer and the insulating layer. The plurality of openings through the adhesive layer and the insulating layer may be formed by exposing the adhesive layer and the insulating layer to a laser.

公开(公告)号：US20240036169A1

公开(公告)日：2024-02-01

申请号：US18486071

申请日：2023-10-12

Applicant: STMicroelectronics PTE LTD

Inventor： Jing-En LUAN

IPC: G01S7/481

CPC classification number: G01S7/4813

Abstract: The present disclosure is directed to an optical sensor package with a first assembly and a second assembly with an encapsulant extending between and coupling the first assembly and the second assembly. The first assembly includes a first substrate, a first die on the first substrate, a transparent material on the first die, and an infrared filter on the transparent material. The second assembly includes a second substrate, a second die on the second substrate, a transparent material on the second die, and an infrared filter on the transparent material. Apertures are formed through the encapsulant aligned with the first die and the second die. The first die is configured to transmit light through one aperture, wherein the light reflects off an object to be detected and is received at the second die through another one of the apertures.